
Items : %s%s
RFID ICs
Additional Feature
- ALSO HAVE OTHER SUPPLY VOLTAGE RANGE FROM 3V TO 3.6V; TERM PITCH-MAX
- ALSO HAVING 40 KBYTE BOOT ROM
- ALSO REQUIRE SUPPLY VOLTAGE RANGE 3.3V TO 3.6V AND 4.5V TO 5.5V
- CAN ALSO OPERATES WITH 4.75 V TO 5.25 V DIGITAL SUPPLY
- IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE
Capacitance
- 250pF
- 330pF
Contact Plating
- Gold
- Gold, Tin
- Tin
ECCN Code
- 5A992
- EAR99
Factory Lead Time
- 10 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 143 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 25 Weeks
- 26 Weeks
- 35 Weeks
- 4 Weeks
- 5 Weeks
- 53 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
HTS Code
- 8542.31.00.01
- 8542.32.00.51
- 8542.32.00.71
- 8542.39.00.01
JESD-609 Code
- e1
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- NRND (Last Updated: 6 months ago)
- NRND (Last Updated: 7 months ago)
Manufacturer Package Identifier
- ST25DV04K-JFR6D3
- TSSOP8-AM
- TSSOP8AM
- VFQFPN 5X5 32L PAD 3.5X3 PUNCHED
- VFQFPN32-42
Material
- Copper
Max Operating Temperature
- 105°C
- 110°C
- 125°C
- 70°C
- 85°C
Mfr
- Infineon Technologies
- Murata Electronics
- NXP Semiconductors
- NXP USA Inc.
- STMicroelectronics
- Texas Instruments
Min Operating Temperature
- -20°C
- -25°C
- -30°C
- -40°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- 6 (Time on Label)
- Not Applicable
Mount
- Front
- Standard
- Surface Mount
Mounting Type
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 10
- 14
- 16
- 2
- 20
- 24
- 28
- 32
- 36
- 5
- 6
- 64
- 8
Number of Terminations
- 10
- 12
- 14
- 16
- 2
- 20
- 24
- 28
- 30
- 32
- 4
- 40
- 48
- 5
- 56
- 64
- 8
Operating Temperature
- -
- -20°C~55°C
- -20°C~65°C
- -20°C~85°C
- -20°C~85°C TA
- -25°C ~ 85°C (TA)
- -25°C~105°C
- -25°C~105°C TA
- -25°C~70°C
- -25°C~70°C TA
- -25°C~75°C
- -25°C~85°C
- -25°C~85°C TA
- -25°C~85°C TJ
- -30°C ~ 85°C (TA)
- -30°C~85°C
- -30°C~85°C TA
- -40°C ~ 105°C
- -40°C ~ 105°C (TA)
- -40°C ~ 125°C
- -40°C ~ 125°C (TA)
- -40°C ~ 85°C
- -40°C ~ 85°C (TA)
- -40°C~105°C
- -40°C~105°C TA
- -40°C~110°C
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~145°C
- -40°C~150°C
- -40°C~85°C
- -40°C~85°C TA
- -40°C~85°C TJ
- -40°C~90°C
- -40°C~95°C
- -55°C~140°C
- 0°C~70°C
- 25°C~70°C TA
Package / Case
- 0505 (1313 Metric)
- 0805 (2012 Metric)
- 10-UFBGA, WLCSP
- 10-VFDFN Exposed Pad
- 10-XFBGA, WLCSP
- 100-LQFP
- 12-UFBGA, WLCSP
- 12-UFDFN Exposed Pad
- 12-XFBGA, WLCSP
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 14-SOIC (0.236, 6.05mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 16-LSSOP (0.154, 3.90mm Width)
- 16-LSSOP (0.173, 4.40mm Width)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.209, 5.30mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 16-VFQFN
- 16-VFQFN Exposed Pad
- 16-VQFN Exposed Pad
- 16-XFQFN
- 2-Flip Chip Strap
- 2-FlipChip
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-VFQFN Exposed Pad
- 20-VQFN Exposed Pad
- 24-DIP Module
- 24-VFQFN Exposed Pad
- 25-UFBGA, WLCSP
- 28-PowerTSSOP (0.173, 4.40mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-VQFN Exposed Pad
- 3-XDFN
- 30-WFBGA, WLCSP
- 32-SOIC (0.295, 7.50mm Width)
- 32-UFQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 36-UFBGA, WLCSP
- 36-VFQFN Exposed Pad
- 38-TFSOP (0.173, 4.40mm Width)
- 38-VFQFN Exposed Pad
- 4-XFDFN Exposed Pad
- 40-VFQFN Exposed Pad
- 42-UFBGA, WLCSP
- 48-LFQFN Exposed Pad
- 48-VFQFN Exposed Pad
- 49-VFBGA
- 5-UFDFN
- 6-UFDFN
- 6-XFDFN
- 64-TFBGA
- 64-VFBGA
- 64-VFQFN Dual Rows, Exposed Pad
- 64-VFQFN Exposed Pad
- 8-SOIC (0.154, 3.90mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-UFDFN
- 8-UFDFN Exposed Pad
- 8-WFDFN Exposed Pad
- 8-XFDFN Exposed Pad
- 8-XFQFN Exposed Pad
- Die
- MCC2 Chip Card Module
- MCC8 Chip Card Module
- MFCC1 Chip Card Module
- MOA2, Smart Card Module
- MOA4, Smart Card Module
- MOA8, Smart Card Module
- MOB6, Smart Card Module
- Module
- NOA3 Micromodule
- QFN
- SC-74A, SOT-753
- TFBGA
- TO-270-15 Variant, Flat Leads
- TSSOP
Packaging
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1997
- 1999
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
Series
- *
- -
- 6700
- ATA5558
- ATA5567
- ATA5570
- ATA5577
- Automotive, AEC-Q100
- Automotive, AEC-Q100, ST25R
- E5530
- E5561
- HITAG® 1
- HITAG® 2
- HITAG® S
- HITAG™
- I-Code
- I-Connect
- MAGICSTRAP?
- MAGICSTRAP®
- MIFARE PLUS™
- MIFARE®
- MIFARE® Standard
- MIFARE® Ultralight
- MLX12115
- MLX90109
- MLX90121
- MLX90130
- my-d™ proximity 2
- my-d™ vicinity
- NCx3310
- NFC-PWM
- RI-TMS3705
- ST25D
- ST25R
- ST25T
- T555711
- T555714
- T555715
- Tag-It
- TI-RFid™
- U-Code
- U2270B
- U3280M
- UCode HSL
Supplier Device Package
- 0505
- 0805
- 10-MLPD (3x3)
- 10-WLCSP (1.59x1.25)
- 100-LQFP (14x14)
- 12-UFDFPN (3x3)
- 16-HVQFN (3x3)
- 16-QFN (4.2x3.2)
- 16-SO
- 16-SSO
- 16-SSOP
- 16-TSSOP
- 16-XQFN (1.8x2.6)
- 2-FCP
- 20-TSSOP
- 24-HVQFN (4x4)
- 28-QFN (7x7)
- 32-HVQFN (5x5)
- 32-QFN (5x5)
- 32-VFQFPN (5x5)
- 38-VQFN (5x7)
- 40-HVQFN (6x6)
- 48-VQFN (7x7)
- 5-UFDFPN (1.7x1.4)
- 6-XSON, SOT886 (1.45x1)
- 64-QFN (9x9)
- 64-TFBGA (5.5x5.5)
- 64-VFBGA (4x4)
- 8-SO
- 8-SOIC
- 8-SON (2x2)
- 8-TSSOP
- 8-UFDFPN (2x3)
- Die
- Module
- P-MCC2-2-1
- PG-DSO-16-45
- PLLMC
- Wafer
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Silver (Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
Termination
- SMD/SMT
Type
- Integrated Circuit (IC)
- Passive Entry/Start
- Passive Entry/Start, TPMS
- RFID Reader
- RFID Reader/Transponder
- RFID Transponder
- TPMS
Weight
- 140.30179mg
- 155.100241mg
- 157.991892mg
- 172.98879mg
- 188.609377mg
- 453.59237mg
- 506.605978mg
- 57.09594mg
- 71.809342mg
- 72.206235mg
- 75.891673mg
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Operating Supply Voltage | RoHS Status | Package / Case | REACH SVHC | Frequency | Mounting Type | Operating Temperature | Type | Supplier Device Package | Voltage - Supply | Standards |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
RWD-MIFARE-R5 | RF Solutions | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Bulk | 2011 | MIFARE® | Active | 1 (Unlimited) | RoHS Compliant | 24-DIP Module | 13.56MHz | Through Hole | -40°C~85°C | RFID Reader | 4V~6V | ISO 14443 | ||||||
![]() |
RWD-MIFARE-OEM | RF Solutions | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Bulk | 2009 | MIFARE® | Active | 1 (Unlimited) | 5V | RoHS Compliant | 24-DIP Module | No SVHC | 13.56MHz | Through Hole | -40°C~85°C | RFID Reader | Module | 4V~6V | ISO 14443 |
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RWD-MIFARE-OEM RF Solutions
RF SOLUTIONS RWD-MIFARE-OEM Reader Board, Read/Write system for ISO14443A Mifare 1k, 4k, Integrated PCB Track Antenna
Price: 0.0000
RFQ