Items : %s%s
RF Switches
Contact Material
- Brass
- Gold
Contact Plating
- Gold
- Lead, Tin
- Tin
ECCN Code
- 5A991.G
- 5A991.H
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 4 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- [object Object]
Feature
- DC Blocked
- DC Blocked, Single Line Control
- DC Blocked, Single/Dual Line Control
- Single Line Control
- Single/Dual Line Control
IIP3
- 27dBm
- 29dBm
- 30dBm (min)
- 30dBm (typ)
- 31dBm
- 32dBm
- 32dBm (typ)
- 33.5dBm
- 33dBm
- 34dBm
- 35dBm
- 36 dBm
- 36dBm
- 36dBm (typ)
- 37dBm
- 38 dBm
- 38dBm
- 39dBm OIP3
- 40dBm
- 40dBm (typ)
- 41dBm
- 42dBm
- 42dBm (typ)
- 43 dBm
- 43dBm
- 43dBm (typ)
- 44dBm
- 45dBm
- 45dBm (min)
- 45dBm (typ)
- 46dBm
- 46dBm (typ)
- 47.5dBm
- 47dBm
- 47dBm (typ)
- 48dBm
- 49dBm
- 49dBm (typ)
- 50dBm
- 50dBm (min)
- 50dBm (typ)
- 51dBm
- 52dBm
- 53 dBm
- 53dBm
- 53dBm (min)
- 53dBm (typ)
- 54 dBm
- 54dBm
- 55dBm
- 56dBm
- 57dBm
- 58 dBm
- 58dBm
- 58dBm (typ)
- 59dBm
- 60 dBm
- 60dBm
- 60dBm (typ)
- 61dBm
- 62dBm
- 63dBm
- 64dBm
- 65dBm
- 65dBm (typ)
- 66 dBm
- 66dBm
- 67dBm
- 68dBm
- 69dBm
- 70dBm
- 71dBm
- 72dBm
- 73dBm
- 74dBm
- 75dBm
- 76dBm
- 77dBm
- 78dBm
- 80dBm
- 81dBm
IIP3
- 36dBm
JESD-609 Code
- e0
- e1
- e3
- e4
- e6
Lifecycle Status
- LAST TIME BUY (Last Updated: 1 week ago)
- LAST TIME BUY (Last Updated: 2 days ago)
- LAST TIME BUY (Last Updated: 2 weeks ago)
- LAST TIME BUY (Last Updated: 3 days ago)
- LAST TIME BUY (Last Updated: 4 days ago)
- LAST TIME BUY (Last Updated: 5 days ago)
- LAST TIME BUY (Last Updated: 6 days ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 3 days ago)
- OBSOLETE (Last Updated: 4 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- OBSOLETE (Last Updated: 6 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
Manufacturer Package Identifier
- 200176H-008
- MS8G (E)
Material
- Brass
Mfr
- Analog Devices Inc.
- Infineon Technologies
- MACOM Technology Solutions
- Microchip Technology
- Mini-Circuits
- onsemi
- Panasonic Electric Works
- Radiall USA, Inc.
- Renesas Electronics America Inc
- Skyworks Solutions Inc.
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2 (1 Year)
- 3
- 3 (168 Hours)
- Not Applicable
Mount
- PCB
- Screw
- Surface Mount
Mounting Feature
- PANEL MOUNT
- SURFACE MOUNT
Number of Pins
- 10
- 12
- 14
- 16
- 17
- 2
- 20
- 22
- 24
- 25
- 26
- 3
- 32
- 4
- 48
- 5
- 6
- 7
- 70
- 8
- 88
- 9
Number of Positions
- 2
- 3
- 4
- 6
Number of Terminals
- 10
- 12
- 16
- 20
- 29
- 32
- 6
- 8
Number of Terminations
- 10
- 12
- 13
- 14
- 16
- 18
- 20
- 22
- 24
- 26
- 30
- 32
- 36
- 48
- 5
- 6
- 8
- 9
Operating Temperature
- -
- -20°C ~ 85°C
- -20°C~85°C
- -25°C ~ 70°C
- -25°C ~ 75°C
- -25°C~70°C
- -30°C~85°C
- -30°C~90°C
- -35°C~70°C
- -35°C~90°C
- -40°C ~ 105°C
- -40°C ~ 105°C (TC)
- -40°C ~ 125°C
- -40°C ~ 85°C
- -40°C ~ 85°C (TA)
- -40°C~100°C
- -40°C~105°C
- -40°C~105°C TC
- -40°C~125°C
- -40°C~70°C
- -40°C~85°C
- -40°C~85°C TA
- -40°C~85°C TC
- -40°C~90°C
- -40°C~95°C
- -45°C~105°C
- -45°C~85°C
- -54°C~105°C
- -54°C~95°C
- -55°C ~ 100°C
- -55°C ~ 85°C
- -55°C ~ 85°C (TA)
- -55°C~105°C
- -55°C~125°C
- -55°C~175°C
- -55°C~85°C
- -55°C~95°C
- -65°C ~ 125°C
- -65°C~125°C
- -65°C~150°C
- 0°C ~ 50°C
- 0°C~70°C
- 0°C~85°C
- 125°C TJ
- 175°C
P1dB
- -12dBm
- -34dBm
- 11.2dBm
- 12dBm
- 14.5dBm
- 14dBm
- 15 dBm
- 15dBm
- 16dBm
- 16dBm (typ) P1dB
- 17dBm
- 17dBm (typ) P1dB
- 18dBm
- 18dBm OP1dB
- 20dBm
- 20dBm (min)
- 20dBm (typ) IP1dB
- 21dBm
- 21dBm (typ) IP1dB
- 22dBm
- 23.5dBm
- 23dBm
- 23dBm (typ) IP1dB
- 24dBm
- 25.5dBm
- 25dBm
- 25dBm (typ) IP1dB
- 26dBm
- 27.5dBm
- 27dBm
- 27dBm (typ) IP1dB
- 27dBm OP1dB
- 28.5dBm
- 28dBm
- 29dBm
- 29dBm (typ) IP1dB
- 30 dBm
- 30.5dBm
- 30.5dBm (typ) IP1dB
- 30dBm
- 31dBm
- 32 dBm
- 32dBm
- 32dBm (typ) IP1dB
- 33 dBm
- 33dBm
- 33dBm (min)
- 33dBm (typ) IP1dB
- 34dBm
- 35.3dBm
- 35dBm
- 35dBm (typ) IP1dB
- 36dBm
- 36dBm (typ) IP1dB
- 37 dBm
- 37dBm
- 38.5dBm
- 38dBm
- 38dBm (typ) IP1dB
- 39 dBm
- 39dBm
- 40 dBm
- 40dBm
- 41.5dBm
- 41dBm
- 43dBm
- 44dBm
- 47dBm
- 50dBm (Min)
- 52dBm
Package / Case
- -
- 10-SMD, Flat Lead
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-UFDFN Exposed Pad
- 10-UFLGA
- 10-UFQFN
- 10-VFQFN Exposed Pad
- 10-WFDFN Exposed Pad
- 10-XFDFN Exposed Pad
- 10-XFLGA
- 10-XFQFN
- 10-XFQFN Exposed Pad
- 11-UFBGA, WLCSP
- 11-UFLGA
- 12-CSMD
- 12-LQFN Exposed Pad
- 12-SMD, No Lead
- 12-UFQFN
- 12-UFQFN Exposed Pad
- 12-VFLGA
- 12-VFQFN
- 12-VFQFN Exposed Pad
- 12-WFQFN Exposed Pad
- 12-XFQFN
- 12-XFQFN Exposed Pad
- 14-QFN
- 14-SOIC (0.154, 3.90mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-UFLGA Exposed Pad
- 14-UFQFN
- 14-UFQFN Exposed Pad
- 14-VFQFN Exposed Pad
- 14-WFQFN Exposed Pad
- 14-XFBGA, FCDSBGA
- 14-XFQFN Exposed Pad
- 16-CLCC Exposed Pad
- 16-FFP
- 16-LFCQFN Exposed Pad
- 16-LQFN Exposed Pad
- 16-LQFP
- 16-SMD, No Lead
- 16-SSOP (0.154, 3.90mm Width)
- 16-TQFN Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 16-UFLGA Exposed Pad
- 16-VFCQFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VFQFN Exposed Pad, CSP
- 16-VQFN Exposed Pad
- 16-VQFN Exposed Pad, CSP
- 16-WFQFN Exposed Pad
- 16-WFQFN Exposed Pad, CSP
- 16-XFQFN Exposed Pad
- 18-UFQFN
- 18-UFQFN Exposed Pad
- 18-XFQFN Exposed Pad
- 20-LQFN Exposed Pad
- 20-SMD Module
- 20-TFLGA Exposed Pad
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFQFN Exposed Pad
- 20-VFLGA Exposed Pad
- 20-VFQFN Exposed Pad
- 20-VQFN Exposed Pad
- 20-WFLGA Exposed Pad
- 20-WFQFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 20-XFQFN
- 200
- 22-VFQFN Exposed Pad
- 24-LCC Exposed Pad
- 24-LFQFN Exposed Pad, CSP
- 24-LSSOP (0.154, 3.90mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-TFCQFN Exposed Pad
- 24-TFQFN Exposed Pad
- 24-VFLGA Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VFQFN Exposed Pad, CSP
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 24-WFQFN Exposed Pad, CSP
- 26-VFQFN Exposed Pad
- 26-WFQFN Exposed Pad
- 28-SMD Module
- 29-TFLGA Exposed Pad
- 30-WFQFN Exposed Pad
- 32-LQFN Exposed Pad
- 32-PowerVFQFN
- 32-TFLGA Exposed Pad
- 32-VFQFN Exposed Pad
- 36-VFQFN Exposed Pad, CSP
- 4-SMD Module Exposed Pad
- 44-VFQFN Exposed Pad
- 48-WFQFN Exposed Pad
- 5-SMD Module
- 5-SMD, No Lead
- 6-PowerXDFN
- 6-PowerXFDFN
- 6-SMD
- 6-SMD, Flat Leads
- 6-SMD, Gull Wing
- 6-SMD, No Lead
- 6-TDFN Exposed Pad
- 6-TSSOP, SC-88, SOT-363
- 6-UFDFN Exposed Pad
- 6-VDFN Exposed Pad
- 6-VFDFN Exposed Pad
- 6-VFLGA
- 6-VSSOP, SC-88, SOT-363
- 6-WDFN Exposed Pad
- 6-XFBGA, WLCSP
- 6-XFDFN
- 6-XFDFN Exposed Pad
- 6-XFQFN
- 7-SMD, Gull Wing
- 8-CSOIC (0.154, 3.90mm Width)
- 8-CSOIC (0.154, 3.90mm Width), Exposed Pad
- 8-SMD, Gull Wing Exposed Pad
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
- 8-UFDFN Exposed Pad
- 8-UFQFN Exposed Pad
- 8-VFDFN Exposed Pad
- 8-VFQFN Exposed Pad
- 8-WFDFN Exposed Pad, CSP
- 8-XFBGA, WLCSP
- 8-XFDFN
- 8-XFDFN Exposed Pad
- 8-XFLGA
- 8-XFQFN
- 8-XFQFN Exposed Pad
- 844-001
- 9-UFQFN
- 9-XFLGA
- CQF12-N1
- CR-14
- CR-9
- Die
- FP-16
- Module
- Module, Pin Contacts
- Module, SMA Connectors
- QFN
- SC-74A, SOT-753
- SC-82A, SOT-343
- SMD/SMT
- SOT-143R
- SOT-23-6
- SOT-343 Reverse Pinning
- SOT-563, SOT-666
- SOT-6
- TO-253-4, TO-253AA
Packaging
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Strip
- Tape
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
- Waffle
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
- Unconfirmed
Pbfree Code
- icon-pbfree yes
- no
- yes
Published
- 1997
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 2.5Ohm
- 262Ohm
- 50Ohm
- 75Ohm
Series
- -
- ADG902
- ADG918
- ARD
- ARV
- Automotive, AEC-Q100
- CERMACHIP™
- DP3T
- DP3T/SPDT
- DPDT
- HMIC?
- HMIC™
- MA8334
- PLATINUM
- RAMSES
- SP2T SEM
- SPDT ZC
- SPnT
- Super-Slim
- UltraCMOS®
- UltraCMOS®, HaRP™
- Value
Supplier Device Package
- -
- 10-FLP
- 10-QFN (1.5x1.1)
- 10-TSON (2.3x2.55)
- 10-TSSON (2x1.35)
- 10-USB-C3 (2x1.5)
- 12-EQFN (1.8x1.8)
- 12-EQFN (2x2)
- 12-QFN (1.83x1.83)
- 12-QFN (2x2)
- 12-QFN (3x3)
- 12-SMD
- 12-SMT (5x5)
- 12-TSQFN (2x2)
- 12-USB (2.35x2.35)
- 12-VQFN (3x3)
- 14-EQFN (1.6x1.6)
- 14-FlipChip (1.1x2)
- 14-QFN (1.6x2)
- 14-SSOP
- 16-CSMT (3x3)
- 16-FFP-C1 (2.5x2.5)
- 16-HTSSOP
- 16-LFCSP-WQ (3x3)
- 16-QFN (2.3x2.3)
- 16-QFN (3x3)
- 16-QFN (4x4)
- 16-QSOP
- 16-SMT (3x3)
- 16-SMT (5.84x5.84)
- 16-SOIC
- 18-EQFN (2x2)
- 20-HQFN (5x5)
- 20-LGA (4x4)
- 20-MCM (2.5x2.5)
- 20-QFN (4x4)
- 20-VQFN (4x4)
- 24-CSMT (4x4)
- 24-LFCSP (4x4)
- 24-LFCSP (5x4)
- 24-LPCC
- 24-QFN (4x4)
- 24-QSOP
- 24-SMT (4x4)
- 24-SOIC
- 24-VFQFPN (4x4)
- 24-VQFN-EP (4x4)
- 29-LGA (4x4)
- 32-LGA (5x5)
- 32-QFN (5x5)
- 36-PQFN, CSP (4x7)
- 4-SO
- 6-DFN (1.5x1.5)
- 6-DFN (1.6x1.6)
- 6-DFN (1x1)
- 6-DFN (3x3)
- 6-FLP-B2
- 6-Minimold
- 6-MLPD (1x1)
- 6-QFN (1x1)
- 6-SuperMiniMold
- 6-TSON
- 6-TSSON
- 7-SMD
- 8-CSMD
- 8-DFN (1.5x1.5)
- 8-DFN (2x2)
- 8-MLP (1.1x1.1)
- 8-MSOP
- 8-MSOP-EP
- 8-QFN (1.5x1.5)
- 8-QFN (2x2)
- 8-SOIC
- 8-TSON
- 8-VSP
- 8-WLSCP (1.1x1.1)
- 844-001
- Chip
- Die
- FP-16
- Module
- PG-TSLP-10-3
- PG-TSNP-10-1
- PG-TSNP-26-3
- PG-TSNP-8-1
- PG-ULGA-10-1
- PG-ULGA-14-1
- SC-70-6
- SC-70-6 (SOT-363)
- SOT-143B
- SOT-143R
- SOT-26
- SOT-363
- TSLP-6-4
- TSLP-7-4
- TSLP-7-6
- TSLP-9-3
- TSNP-16-1
- TSNP-6-2
- TSNP-9-3
Surface Mount
- NO
- YES
Terminal Finish
- GOLD (80) OVER NICKEL (50)
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Gold Flash (Au) - with Nickel (Ni) barrier
- Gold/Nickel (Au/Ni)
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Gold (Ni/Au)
- Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- TIN
- Tin (Sn)
- TIN LEAD
- Tin/Bismuth (Sn/Bi)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
Termination
- Quick Connect
- SMA
- SMD/SMT
- Solder
Type
- Integrated Circuit (IC)
- Switch
Weight
- 123.008581mg
- 130.010913mg
- 139.989945mg
- 21.092045mg
- 21.99923mg
- 255.5993mg
- 28.009329mg
- 288.002805mg
- 29.993795mg
- 338.011364mg
- 36.003894mg
- 37.393021mg
- 45g
- 540.001716mg
- 57.09594mg
- 6.010099mg
- 61.291669mg
- 7.512624mg
- 928.191737mg
- 937.688827mg
- 994.501271mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Number of Pins | Package / Case | Frequency | Width | Impedance | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Frequency Range | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Supply Voltage-Max (Vsup) | Max Power Dissipation | Feature | Analog IC - Other Type | Halogen Free | Test Frequency | Insertion Loss | Supplier Device Package | Insertion Loss (dB) | Telecom IC Type | Voltage - Supply | Circuit | Topology | Isolation | RF Type | P1dB | IIP3 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
BGS22W2L10E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2005 | Obsolete | 1 (Unlimited) | 3.6V | RoHS Compliant | Lead Free | Gold | 10 | 10-XFQFN | 50Ohm | -30°C~85°C | 100MHz~2GHz | Halogen Free | 1.91GHz | 0.39dB | 0.33 dB | 2.4V~3.6V | DPDT | Reflective | 27dB | General Purpose | ||||||||||||||||||||||||||||||||||
 |
BGS16MN14E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | Active | 1 (Unlimited) | 14 | 5.5V | 2mm | ROHS3 Compliant | Lead Free | 14-WFQFN Exposed Pad | 2.7GHz | 2mm | 50Ohm | -30°C~85°C | CMOS | 0.77mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | NO LEAD | NOT SPECIFIED | 3.5V | NOT SPECIFIED | 100MHz~2.7GHz | 0.5mm | S-PQCC-N14 | 1.5849W | Halogen Free | 2GHz | 0.45dB | 0.3 dB | TELECOM CIRCUIT | 2.5V~5.5V | SP6T | 33dB | WCDMA | |||||||||||||||||
 |
BGS18MA14E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | 14-UFQFN Exposed Pad | 3.8GHz | 50Ohm | -40°C~85°C TA | 100MHz~3.8GHz | 3.6GHz~3.8GHz | 0.7dB | 1.7V~3.4V | SP8T | 29dB | LTE, W-CDMA | 65dBm | ||||||||||||||||||||||||||||||||||||||||
 |
BGSX212MA18E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 18 | 2.4mm | ROHS3 Compliant | 18-UFQFN Exposed Pad | 3.8GHz | 2mm | 50Ohm | -30°C~85°C | CMOS | 0.65mm | 1 | BOTTOM | BUTT | NOT SPECIFIED | 3V | NOT SPECIFIED | 100MHz~3.8GHz | YES | 0.4mm | R-PBCC-B18 | 2.5V | 2 | 3.4V | CROSS POINT SWITCH | 2.5GHz 3.5GHz | 0.9dB | 2.5V~3.4V | 39dB | LTE | ||||||||||||||||||||||
 |
BGS13MPA9E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Discontinued | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BGSA12UGL8E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | 8-XFLGA | 6GHz | TELECOM CIRCUIT | 1.8V~3.6V | SPDT | CDMA, EDGE, LTE, W-CDMA | 11.2dBm | ||||||||||||||||||||||||||||||||||||||||||||||
|
BGSA142M2N12E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BGS13PN10E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel (TR) | 2004 | yes | Last Time Buy | 1 (Unlimited) | 10 | 1.5mm | ROHS3 Compliant | 10-XFQFN | 6GHz | 1.1mm | 50Ohm | -40°C~85°C | CMOS | 0.4mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | BOTTOM | BUTT | NOT SPECIFIED | 2.85V | NOT SPECIFIED | 500MHz~6GHz | YES | 0.4mm | R-XBCC-B10 | 1.5dB | TELECOM CIRCUIT | 1.8V~3.6V | SP3T | 17dB | 76dBm | ||||||||||||||||||||||
 |
BGS15AN16E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Not For New Designs | 1 (Unlimited) | 16 | 4.7V | 2.3mm | ROHS3 Compliant | Lead Free | Tin | 16 | 16-WFQFN Exposed Pad | 3GHz | 2.3mm | 50Ohm | -30°C~85°C | 0.77mm | 8542.39.00.01 | 1 | e3 | QUAD | NO LEAD | NOT SPECIFIED | 3.5V | NOT SPECIFIED | 100MHz~3GHz | 0.5mm | DC Blocked | Halogen Free | 2.69GHz | 0.65dB | 0.34 dB | TELECOM CIRCUIT | SP5T | Reflective | 27dB | W-CDMA | ||||||||||||||||||
 |
BGS13S2N9E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | yes | Obsolete | 1 (Unlimited) | 9 | 1.1mm | RoHS Compliant | 9-XFLGA | 3GHz | 1.1mm | 50Ohm | -40°C~85°C | MOS | 0.4mm | 8542.39.00.01 | 1 | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | 100MHz~3GHz | YES | 0.4mm | S-XBGA-B9 | 0.55dB | TELECOM CIRCUIT | 1.8V~3.3V | SP3T | 23dB | |||||||||||||||||||||||||
 |
BGSF18DM20E6727XUMA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Cut Tape (CT) | 2011 | Obsolete | 3 (168 Hours) | 20 | 3.5V | 3.2mm | RoHS Compliant | Gold | 20 | 20-SMD Module | 2.7GHz | 2.8mm | 50Ohm | -30°C~85°C | CMOS | 0.98mm | 8542.39.00.01 | 1 | BOTTOM | BUTT | NOT SPECIFIED | 3.5V | NOT SPECIFIED | 0.4mm | TELECOM CIRCUIT | 2.85V~4.7V | SP8T | GSM/Edge/C2K/LTE/WCDMA | ||||||||||||||||||||||||||
 |
BGS14GA14E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2013 | yes | Obsolete | 1 (Unlimited) | 14 | 2mm | ROHS3 Compliant | 14-UFQFN Exposed Pad | 6GHz | 2mm | 50Ohm | -30°C~85°C | 0.65mm | 8542.39.00.01 | 1 | e4 | Gold/Nickel (Au/Ni) | QUAD | BUTT | NOT SPECIFIED | 3V | NOT SPECIFIED | 100MHz~6GHz | YES | S-XQMA-B14 | 0.65dB | TELECOM CIRCUIT | 3V | SP4T | 27dB | |||||||||||||||||||||||||
 |
BGS15GA14E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | yes | Obsolete | 1 (Unlimited) | 14 | 2mm | Non-RoHS Compliant | 14-UFQFN Exposed Pad | 6GHz | 2mm | 50Ohm | -30°C~85°C | 0.65mm | 8542.39.00.01 | 1 | e4 | Gold/Nickel (Au/Ni) | QUAD | BUTT | NOT SPECIFIED | 3V | NOT SPECIFIED | 100MHz~6GHz | YES | S-XQMA-B14 | 0.65dB | TELECOM CIRCUIT | 3V | SP5T | 27dB | |||||||||||||||||||||||||
 |
BGSF1717MN26E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Surface Mount | Tape & Reel (TR) | 2016 | Obsolete | 1 (Unlimited) | 1.8V | RoHS Compliant | Lead Free | 26 | 26-WFQFN Exposed Pad | 50Ohm | 100MHz~2.7GHz | Halogen Free | PG-TSNP-26-3 | 1.2V~1.8V | SP7T | General Purpose | |||||||||||||||||||||||||||||||||||||||
 |
BGS15M2A12E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | yes | Obsolete | 1 (Unlimited) | 12 | 1.9mm | Non-RoHS Compliant | 12-UFQFN Exposed Pad | 1.1mm | -30°C~85°C | MOS | 0.65mm | 8542.39.00.01 | 1 | BOTTOM | BUTT | NOT SPECIFIED | NOT SPECIFIED | 100MHz~2.7GHz | YES | 0.4mm | R-XBCC-B12 | 2GHz | 0.4dB | TELECOM CIRCUIT | 3.3V | SP5T | 30dB | LTE, W-CDMA | |||||||||||||||||||||||||||
 |
BGS13SN8E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2016 | yes | Not For New Designs | 1 (Unlimited) | 8 | 1.1mm | ROHS3 Compliant | Lead Free | 8-XFQFN | 6GHz | 1.1mm | 50Ohm | -40°C~85°C | MOS | 0.4mm | 8542.39.00.01 | 1 | BOTTOM | BUTT | NOT SPECIFIED | NOT SPECIFIED | 100MHz~6GHz | YES | 0.4mm | S-XBCC-B8 | 5.725GHz | 0.65dB | TELECOM CIRCUIT | 1.8V~3.4V | SP3T | 15dB | General Purpose | |||||||||||||||||||||||
 |
BGSX22G5A10E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | 10-UFQFN | 50Ohm | -40°C~85°C TA | 100MHz~6GHz | 5.15GHz~5.925GHz | 1.1dB | 1.65V~3.4V | DPDT | 38dB | LTE, W-CDMA | 80dBm | |||||||||||||||||||||||||||||||||||||||||
|
BGS22WL10E6327XTSA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tape & Reel (TR) | 2000 | Obsolete | 1 (Unlimited) | 3.6V | RoHS Compliant | Lead Free | Gold | 10 | 10-XFQFN | 3GHz | 50Ohm | -30°C~85°C | e4 | 100MHz~3GHz | Halogen Free | 2.69GHz | 0.45dB | 0.33 dB | 2.4V~3.6V | DPDT | Reflective | 24dB | General Purpose | |||||||||||||||||||||||||||||||
 |
BGSF18DM20E6327XUMA1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | Obsolete | 3 (168 Hours) | 85°C | -30°C | 3.5V | RoHS Compliant | Lead Free | Gold | 2.7GHz | SP8T | Cellular, 3G, GSM |
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