Items : %s%s
RF Mixers
Additional Feature
- 2.9 MM-F; SMA-F
- 2.92 MM-F; SMA-F
- 2.92 MM; SMA
- CMOS COMPATIBLE
- HIGH DYNAMIC RANGE
- HIGH ISOLATION
- HIGH ISOLATION, HIGH DYNAMIC RANGE
- HIGH RELIABILITY
- HIGH RELIABILITY, HIGH DYNAMIC RANGE
- HIGH RELIABILITY, HIGH ISOLATION
- HIGH RELIABILITY, HIGH ISOLATION, HIGH DYNAMIC RANGE
- I/P POWER-MAX (PEAK)=20DBM
- I/P POWER-MAX (PEAK)=25DBM
- I/P POWER-MAX (PEAK)=27DBM
- IMAGE REJECTION
- IMAGE REJECTION, LOW NOISE, HIGH DYNAMIC RANGE
- IN-BUILT QUADRATURE DETECTOR
- IT ALSO REQUIRES 5 V
- K-F; N-F
- K-F; N-F, LOW NOISE
- K-F; SMA-F
- K-F; SMA-F, LOW NOISE
- K-F; SMA-F,HIGH RELIABILITY
- K; SMA
- LOW NOISE
- SMA
- SMA, I/P POWER-MAX (PEAK)=26DBM
- SMA-F
- SMA-F, HIGH RELIABILITY
- SMA-F, IMAGE REJECTION, LOW NOISE
- SMA-F, IMAGE REJECTION, LOW NOISE, HIGH DYNAMIC RANGE
- SMA-F, LOW NOISE
- SMA-F, LOW NOISE, HIGH DYNAMIC RANGE
- TERMINATION INSENSITIVE
- TTL COMPATIBLE
- USABLE TO 42 GHZ
Contact Plating
- Copper, Silver, Tin
- Gold
- Lead, Silver, Tin
- Lead, Tin
- Tin
Diode Element Material
- SILICON
ECCN Code
- 3A001.A.3
- 5A991
- 5A991.B
- 5A991.G
- 5A991.H
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 20 Weeks
- 22 Weeks
- 23 Weeks
- 25 Weeks
- 26 Weeks
- 4 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 98 Weeks
HTS Code
- 8517.70.00.00
- 8542.33.00.01
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
- e3/e2
- e3/e4
- e4
- e6
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- CONTACT ADI (Last Updated: 2 weeks ago)
- LAST TIME BUY (Last Updated: 1 week ago)
- LAST TIME BUY (Last Updated: 2 days ago)
- LAST TIME BUY (Last Updated: 2 weeks ago)
- LAST TIME BUY (Last Updated: 3 days ago)
- LAST TIME BUY (Last Updated: 3 weeks ago)
- LAST TIME BUY (Last Updated: 4 days ago)
- LAST TIME BUY (Last Updated: 5 days ago)
- LAST TIME BUY (Last Updated: 6 days ago)
- NRND (Last Updated: 7 months ago)
- NRND (Last Updated: 8 months ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 3 days ago)
- OBSOLETE (Last Updated: 4 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- OBSOLETE (Last Updated: 5 months ago)
- OBSOLETE (Last Updated: 6 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 days ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
- PRODUCTION (Last Updated: 6 days ago)
Max Operating Temperature
- 100°C
- 105°C
- 125°C
- 150°C
- 70°C
- 85 °C
- 85°C
Mfr
- Analog Devices Inc.
- Analog Devices Inc./Maxim Integrated
- Fairchild Semiconductor
- Intersil
- MACOM Technology Solutions
- Mini-Circuits
- NXP USA Inc.
- onsemi
- Renesas Electronics America Inc
Min Operating Temperature
- -10°C
- -20°C
- -25°C
- -30°C
- -40 °C
- -40°C
- -54°C
- -55°C
- -65°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3 (168 Hours)
- Not Applicable
Mount
- Screw
- Surface Mount
- Termination
Mounting Feature
- SURFACE MOUNT
Mounting Type
- -
- Chassis Mount
- Connector Mount
- Surface Mount
- Through Hole
Number of Pins
- 10
- 11
- 12
- 14
- 16
- 17
- 196
- 2
- 20
- 24
- 25
- 252
- 256
- 3
- 32
- 324
- 36
- 4
- 40
- 44
- 48
- 5
- 6
- 8
- 87
- 89
Number of Terminals
- 20
- 44
- 6
- 8
Number of Terminations
- 10
- 11
- 12
- 14
- 16
- 196
- 20
- 24
- 252
- 256
- 28
- 3
- 32
- 324
- 36
- 4
- 40
- 44
- 48
- 5
- 6
- 7
- 8
P1dB
- -18.4 dBm
- 10 dBm
- 10.2 dBm
- 10.4 dBm
- 10.6 dBm
- 11 dBm
- 11.5 dBm
- 12 dBm
- 12.5 dBm
- 12.7 dBm
- 13.3 dBm
- 14.4 dBm
- 14.5 dBm
- 14.9 dBm
- 18 dBm
- 19.8 dBm
- 2.8 dBm
- 20 dBm
- 25 dBm
- 8.5 dBm
Package / Case
- -
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-WFQFN Exposed Pad
- 12-CLCC Exposed Pad
- 12-CSMD
- 12-LFQFN Exposed Pad
- 12-TFQFN Exposed Pad
- 12-VFCQFN Exposed Pad
- 12-VFQFN Exposed Pad
- 12-VFQFN Exposed Pad, CSP
- 12-VQFN Exposed Pad
- 12-WFQFN Exposed Pad
- 120-BPGA
- 120-BQFP
- 14-SOIC (0.154, 3.90mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 16-LSSOP (0.154, 3.90mm Width)
- 16-LSSOP (0.154, 3.90mm Width) Exposed Pad
- 16-LSSOP (0.173, 4.40mm Width)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 16-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 16-UFQFN Exposed Pad
- 16-VFCQFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VFQFN Exposed Pad, CSP
- 16-VQFN Exposed Pad
- 16-WFQFN Exposed Pad
- 16-WFQFN Exposed Pad, CSP
- 16-WQFN Exposed Pad
- 196-LBGA, CSPBGA
- 196-LFBGA
- 20-LCC (J-Lead)
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SMD Module
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.173, 4.40mm Width)
- 20-TQFN Exposed Pad
- 20-VFQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 20-WQFN Exposed Pad
- 20-WQFN Exposed Pad, CSP
- 24-CLCC Exposed Pad
- 24-LCC Exposed Pad
- 24-TFCQFN Exposed Pad
- 24-TFQFN Exposed Pad
- 24-TSSOP (0.173, 4.40mm Width)
- 24-VFCQFN Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VFQFN Exposed Pad, CSP
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad, CSP
- 24-WQFN Exposed Pad
- 25-LFLGA Exposed Pad
- 252-BGA Exposed Pad
- 256-BGA, CSPBGA
- 28-LSSOP (0.173, 4.40mm Width)
- 28-SDIP (0.400, 10.16mm)
- 28-TQFN Exposed Pad
- 28-WFQFN Exposed Pad
- 3-SMD, No Lead
- 32-CLCC
- 32-TFCQFN Exposed Pad
- 32-TFQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 32-WFQFN Exposed Pad
- 32-WFQFN Exposed Pad, CSP
- 324-BBGA
- 36-SMD Module
- 36-VFLGA Exposed Pad
- 36-VFQFN
- 36-VFQFN Exposed Pad
- 36-VFQFN Exposed Pad, CSP
- 36-WFQFN Exposed Pad
- 4-SMD Module
- 40-VFQFN Exposed Pad
- 40-VFQFN Exposed Pad, CSP
- 40-VQFN Exposed Pad
- 44-LCC (J-Lead)
- 44-VFQFN Exposed Pad
- 48-WFQFN Exposed Pad
- 48-WFQFN Exposed Pad, CSP
- 56-WFQFN Exposed Pad, CSP
- 6-SMD, Flat Leads
- 6-SMD, No Lead
- 6-TLGA Exposed Pad
- 6-TQFN
- 6-TQFN Exposed Pad
- 6-TSSOP, SC-88, SOT-363
- 6-VDFN Exposed Pad
- 6-VSSOP, SC-88, SOT-363
- 6-WFDFN Exposed Pad
- 68-VFQFN Exposed Pad
- 8-CSOIC (0.154, 3.90mm Width)
- 8-CSOIC (0.154, 3.90mm Width), Exposed Pad
- 8-DIP (0.300, 7.62mm)
- 8-QFN
- 8-SMD
- 8-SMD, No Lead
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
- 8-VFDFN Exposed Pad, CSP
- 8-VSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
- 8-WFDFN Exposed Pad
- DFN
- Die
- FP-2
- LFCSP EP
- Module
- Module, SMA Connectors
- MSOP
- PLCC
- QFN
- QFN EP
- RH-3
- SC-74A, SOT-753
- SF-1
- SMA
- SO
- SOIC
- SOT-143
- SOT-23-6
- SOT-23-6 Thin, TSOT-23-6
- SSOP
- TO-5
- TO-8 Style, 4 Lead
- TSSOP
Packaging
- Box
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Strip
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- icon-pbfree yes
- no
- yes
Published
- 1994
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- *
- -
- AD608
- AD6633
- AD6634
- AD6635
- AD6636
- AD831
- AD8342
- AD8343
- AD8344
- ADL5350
- AMMC-3040
- AMMC-3041
- AMMC-6530
- AMMC-6545
- AMMC-6550
- ATR0785
- ATR0786
- ATR0787
- ATR2730
- BA4116
- BA4127
- BA4138
- BGA2022
- DB
- DB0418
- DB0418L
- DB0426
- DB0440
- DM
- DM0104L
- DM0416
- DMX
- DMY
- GC5016
- HSP50016
- HSP50216
- IAM-91563
- LT5511
- LT5512
- LT5519
- LT5520
- LT5521
- LT5522
- LT5525
- LT5526
- LT5527
- LT5557
- LT5560
- LT5579
- LTC555
- LTC5555
- MAX
- MAX2031
- MAX2039
- MAX2041
- MAX2680
- MAX9981
- MAX9982
- MAX9984
- MAX9985
- MAX9986A
- MAX9986E
- MAX9993
- MAX9994
- MAX9995
- MAX9996
- RF2418
- RF3334
- SA58640
- SA58641
- SA602
- SA605
- SA606
- SA607
- SA608
- SA612
- SA615
- SA616
- SA636
- SA639
- SA676
- SBB
- SBE
- SBF
- SN761688
- T0780
- T0781
- T0782
- TB
- TB0208L
- TB0218H
- TB0218L
- TB0218M
- TB0226L
- TB0440
- TBR
- TBS
- TRF1115
- TRF1122
- TRF1216
- TRF1222
- U25
- U2730
- U2795
- U2796
- UltraCMOS®
- UPB2756TB
- UPC2757TB
- UPC2758TB
- UPC2798GR
- UPC8106TB
- UPC8112TB
- UPC8163TB
- UPC8172TB
- Zero-Distortion?
- Zero-Distortion™
Supplier Device Package
- -
- 12-AQFN (3x3)
- 12-CSMT (3x3)
- 12-MCLP (3x3)
- 12-SMT (3x3)
- 12-SMT (5x5)
- 12-TQFN (3x3)
- 120-MQFP (28x28)
- 120-PPGA (34.16x34.16)
- 14-SOIC
- 16-CSMT (3x3)
- 16-DHVQFN (2.5x3.5)
- 16-LFCSP-VQ (3x3)
- 16-QFN (4x4)
- 16-SOIC
- 16-SSOP
- 16-UQFN (3x3)
- 196-BGA (12x12)
- 196-CSPBGA (15x15)
- 20-QFN (4x4)
- 20-QFN (5x5)
- 20-SO
- 20-SSOP
- 24-CSMT (4x4)
- 24-MLCP (4x4)
- 24-QFN (4x4)
- 24-QFN (5x5)
- 24-SMT (4x4)
- 24-TSSOP
- 24-VFQFPN (4x4)
- 252-BGA (17x17)
- 28-QFN (6x6)
- 28-SDIP
- 28-SSO
- 32-QFN (5x5)
- 32-SMT (5x5)
- 32-VQFN (5x5)
- 36-MCM (6x6)
- 36-VFQFPN (6x6)
- 40-QFN (6x6)
- 44-PLCC (16.58x16.58)
- 48-VFQFPN (7x7)
- 56-LFCSP-WQ (8x8)
- 6-DFN (3x3)
- 6-SMT
- 6-SOP
- 6-SuperMiniMold
- 6-TDFN (1.5x1.2)
- 68-VFQFPN (10x10)
- 8-MSOP
- 8-MSOP-EP
- 8-MSOPG
- 8-SMT
- 8-SO
- 8-SOIC
- C-7
- Die
- FP-2
- Module
- RH-3
- SF-1
- SMA
- SMD
- SOT-23-6
- TO-5-2
- TO-8
Surface Mount
- NO
- YES
Terminal Finish
- GOLD
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Gold Flash (Au) - with Nickel (Ni) barrier
- GOLD OVER NICKEL
- Gold/Nickel (Au/Ni)
- MATTE TIN
- MATTE TIN (394) OVER COPPER
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL
- Nickel (Ni)
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- NOT SPECIFIED
- Silver (Ag)
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Bismuth (Sn/Bi)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Lead/Silver (Sn/Pb/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- TIN/TIN COPPER
- Tungsten/Nickel/Gold (W/Ni/Au)
Termination
- SMD/SMT
Transistor Element Material
- SILICON
Weight
- 117.310327mg
- 139.989945mg
- 188.609377mg
- 21.99923mg
- 266.712314mg
- 288.002805mg
- 36.003894mg
- 540.001716mg
- 62.99264mg
- 72.206235mg
- 92.589543mg
- 928.191737mg
- 977.009615mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Lifecycle Status | Mount | Pbfree Code | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | RoHS Status | Lead Free | Contact Plating | Number of Pins | Package / Case | REACH SVHC | Frequency | Weight | Technology | JESD-609 Code | Terminal Finish | Surface Mount | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Mounting Feature | Characteristic Impedance | Construction | RF/Microwave Device Type | Operating Frequency-Max | Operating Frequency-Min | Input Power-Max (CW) | Noise Figure | Frequency (Max) | Conversion Loss-Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HMC208AMS8E | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | LAST TIME BUY (Last Updated: 2 weeks ago) | yes | EAR99 | 85°C | -40°C | RoHS Compliant | Contains Lead | 8 | MSOP | No SVHC | 700MHz | 139.989945mg | e3 | Matte Tin (Sn) | 50Ohm | COMPONENT | DOUBLE BALANCED | 13dBm | 9 dB | 2GHz | 10.5 dB | |||||||||||||
|
HMC399MS8 | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | EAR99 | RoHS Compliant | MSOP | 700MHz | e0 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 50Ohm | COMPONENT | DOUBLE BALANCED | 25dBm | 9 dB | 10 dB | ||||||||||||||||||||
|
HMC351S8 | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | EAR99 | RoHS Compliant | SOIC | e0 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 50Ohm | COMPONENT | DOUBLE BALANCED | 1200MHz | 700MHz | 27dBm | 11.5 dB | ||||||||||||||||||||
|
HMC387MS8 | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | EAR99 | RoHS Compliant | MSOP | 500MHz | e0 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 50Ohm | COMPONENT | DOUBLE BALANCED | 25dBm | 9.5 dB | 11 dB | ||||||||||||||||||||
|
HMC402MS8 | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | EAR99 | RoHS Compliant | MSOP | 2.2GHz | e0 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 50Ohm | COMPONENT | DOUBLE BALANCED | 27dBm | 10.5 dB | |||||||||||||||||||||
|
HMC316MS8 | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | LAST TIME BUY (Last Updated: 5 days ago) | Surface Mount | no | 8 | EAR99 | 85°C | -40°C | Non-RoHS Compliant | Contains Lead | Lead, Tin | 8 | MSOP | 3.8GHz | GAAS | e0 | Tin/Lead (Sn/Pb) | RF/Microwave Mixers | 50Ohm | COMPONENT | DOUBLE BALANCED | 22dBm | 8 dB | 11 dB | ||||||||||||
|
HMC400MS8 | Hittite (Analog Devices) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | 8 | EAR99 | RoHS Compliant | MSOP | 2.2GHz | GAAS | e0 | Tin/Lead (Sn/Pb) | YES | 85°C | -40°C | RF/Microwave Mixers | SURFACE MOUNT | 50Ohm | COMPONENT | DOUBLE BALANCED | 27dBm | 9 dB | 11 dB |
-
HMC208AMS8E Hittite (Analog Devices)
HMC208AMS8E datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ -
HMC399MS8 Hittite (Analog Devices)
HMC399MS8 datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ -
HMC351S8 Hittite (Analog Devices)
HMC351S8 datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ -
HMC387MS8 Hittite (Analog Devices)
HMC387MS8 datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ -
HMC402MS8 Hittite (Analog Devices)
HMC402MS8 datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ -
HMC316MS8 Hittite (Analog Devices)
HMC316MS8 datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ -
HMC400MS8 Hittite (Analog Devices)
HMC400MS8 datasheet pdf and RF Mixers product details from Hittite (Analog Devices) stock available at HK JDW
Price: 0.0000
RFQ
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