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RF Directional Coupler
Additional Feature
- HIGH ISOLATION
- HIGH RELIABILITY
- IT CAN ALSO OPERATE AT 1700-1800 MHZ
- N
- N, I/P POWER-MAX(PEAK)=2000WATT
- N, I/P POWER-MAX(PEAK)=3000WATT
- N, I/P POWER-MAX(PEAK)=4000WATT
- N-F
- N-F, I/P POWER-MAX(PEAK)=10000WATT
- N-F, I/P POWER-MAX(PEAK)=5000WATT
- N-F; N-M, I/P POWER-MAX (PEAK)=5000WATT
- N-F; N-M, I/P POWER-MAX(PEAK)=3000WATT
- SMA
- SMA, I/P POWER-MAX(PEAK)=2000WATT
- SMA, I/P POWER-MAX(PEAK)=3000WATT
- SMA, I/P POWER-MAX(PEAK)=4000WATT
- SMA-F
- SMA-F, HIGH ISOLATION
- SMA-F, I/P POWER-MAX(PEAK)=1000WATT
- SMA-F, I/P POWER-MAX(PEAK)=2000WATT
- SMA-F, I/P POWER-MAX(PEAK)=3000WATT
- SMA-F; TNC-F; TNC-M, I/P POWER-MAX (PEAK)=3000WATT
- SMA-F; TNC-F; TNC-M, I/P POWER-MAX (PEAK)=5000WATT
- TNC
- TNC, I/P POWER-MAX(PEAK)=2000WATT
- TNC, I/P POWER-MAX(PEAK)=3000WATT
- TNC, I/P POWER-MAX(PEAK)=4000WATT
- TNC-F
Applications
- -
- AGSM, DCS, PCS
- AGSM, GSM
- AMPS
- AMPS, CDMA, WCDMA
- AMPS, GSM, LTE, WCDMA
- CATV
- CATV, Cellular
- CDMA
- CDMA, DCS, GPS, ISM, PCS, TDMA, UMTS
- CDMA, PCS, DCS
- CDMA, WCDMA
- Cellular
- Cellular, PCN, PCS
- Cellular, PCS
- DCS
- DCS, LTE, PCS, WCDMA
- DCS, LTE, PCS, WiMax
- DCS, PCS
- DCS, PCS, WCDMA
- DECT
- E-GSM
- General Purpose
- GPS
- GSM
- GSM, LTE
- GSM, W-CDMA, WiMax
- LTE, WiMAX
- LTE, WWAN
- Military
- PCN
- PCN, PCS
- PCS
- PCS, LTE, ISM, UMTS, WiMAX, Wi-Fi
- PDC
- PHP
- S-Band Radar
- Telecom/Datacom Systems
- UMTS
- W-CDMA
- Wireless LAN
- WLAN
- X-Band Radar
Composition
- Ceramic
- Thin Film
Contact Plating
- Copper, Silver, Tin
- Gold
- Lead, Tin
- Tin
ECCN Code
- 5A991.G
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 25 Weeks
- 5 Weeks
- 6 Weeks
- 8 Weeks
- 9 Weeks
HTS Code
- 8517.70.00.00
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 8 months ago)
- EOL ANNOUNCED (Last Updated: 2 months ago)
- NRND (Last Updated: 1 month ago)
- NRND (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 2 months ago)
- PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)
- PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 2 months ago)
Manufacturer Package Identifier
- X3C19P2-30S
Max Operating Temperature
- 85°C
- 95°C
Mfr
- Johanson Technology Inc.
- KYOCERA AVX
- MACOM Technology Solutions
- Mini-Circuits
- Murata Electronics
- Pulse Electronics
- Radiall USA, Inc.
- Taiyo Yuden
- TDK Corporation
Min Operating Temperature
- -30°C
- -40°C
- -50°C
- -55°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 2 (1 Year)
- 2 (1 Year)
- Not Applicable
- Vendor Undefined
Mount
- Screw
- Surface Mount
Mounting Feature
- SURFACE MOUNT
Number of Pins
- 10
- 4
- 5
- 6
- 8
Number of Terminations
- 4
- 6
Package / Case
- -
- 0202 (0505 Metric), 4 PC Pad
- 0302 (0806 Metric), 4 Lead
- 0402
- 0402 (1005 Metric)
- 0402 (1005 Metric), 4 PC Pad
- 0402 (1005 Metric), 6 PC Pad
- 0603
- 0603 (1608 Metric)
- 0603 (1608 Metric), 4 PC Pad
- 0603 (1608 Metric), 6 PC Pad
- 0606 (1616 Metric)
- 0805
- 0805 (2012 Metric)
- 0805 (2012 Metric), 4 PC Pad
- 0805 (2012 Metric), 8 PC Pad
- 100
- 1206 (3216 Metric)
- 1210 (3225 Metric)
- 125
- 200
- 24-VFQFN Exposed Pad
- 2520 (6450 Metric)
- 4-SMD
- 4-SMD, Flat Leads
- 4-SMD, Gull Wing
- 4-SMD, No Lead
- 4-SMD, No Lead Exposed Pad
- 5-SMD Module
- 5-SMD, No Lead
- 5-UFBGA, FCBGA
- 6-SMD
- 6-SMD (5 Leads), Flat Lead
- 6-SMD (5 Leads), Gull Wing
- 6-SMD Module
- 6-SMD Module, No Lead
- 6-SMD, Flat Leads
- 6-SMD, No Lead
- 6-UFBGA, FCBGA
- 6-VFDFN Exposed Pad
- 6-WFBGA, FCBGA
- 6-WFDFN Exposed Pad
- 7-WFBGA, FCBGA
- 8-SMD, J-Lead
- 8-SMD, No Lead
- 8-SOIC (0.154, 3.90mm Width)
- 8-UFBGA, FCBGA
- Flat Box, Terminator
- FlatPack
- FP-2
- LGA
- Module
- Module, SMA Connectors
- N-Type In-Line Module
- Nonstandard
- SC-74, SOT-457
- SF-1
- SM-22
- SM-55
- SMA
- SMA In-Line Module
- SMD/SMT
- SOT-23-6
- TNC In-Line Module
Packaging
- Box
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Strip
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
Packing Method
- TR, EMBOSSED, 7 INCH
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- *
- -
- 1608
- 2020
- 605
- FI
- HDH
- HHM
- SURFCOIL® GLSL
- TSC1
- Xinger III®
- Xinger II®
- Xinger®
- Xinger® IV
Supplier Device Package
- -
- 0202
- 0402
- 0603
- 0603 (1608 Metric)
- 0805
- 0805 (2012 Metric)
- 1206
- 6-SMD
- 6-TDFN (1.5x1.2)
- 8-SOIC
- FP-2
- Module
- SF-1
- SM-22
- SM-55
- SMD
Surface Mount
- YES
Terminal Finish
- GOLD
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Matte Tin (Sn)
- MATTE TIN OVER COPPER
- Nickel/Gold (Ni/Au) - ENIG
- TIN
- Tin (Sn)
- Tin (Sn) - immersion
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn10Pb90)
- Tin/Lead (Sn63Pb37)
- Tin/Silver/Copper (Sn/Ag/Cu)
Termination
- SMD/SMT
- Through Hole
Weight
- 2.012816mg
- 5.499807mg
- 50.008559mg
- 652.039032μg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Series | Mfr |
|---|---|---|---|---|---|---|---|---|---|
 |
CP0805B0947BWTR | KYOCERA AVX | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | - | KYOCERA AVX |
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