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XC7Z030-1SBG485I

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Manufacturer No:

XC7Z030-1SBG485I

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z030-1SBG485I

Package:

484-FBGA, FCBGA

Datasheet:

XC7Z030-1SBG485I

Description:

485 Terminations-40°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 225

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Product Details

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This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-FBGA, FCBGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.The Zynq?-7000 series contains this system on chip SoC.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.Housed in the state-of-art Tray package.In total, this SoC part has 130 I/Os.A 1V power supply is recommended.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supplies of at least 0.95V are required.system on a chip benefits from 485 terminations.Just like other high-quality Other Microprocessor ICs will do, it is of outstanding system on a chip capability.There is 11.8V power supply required for system on chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.At 667MHz, the wireless SoC works.It uses ARM as its core architecture.Moreover, this SoC processor is also equipped with additional features of PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This is the version with 485 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z030-1SBG485I System On Chip (SoC) applications.

  • Optical drive
  • Multiprocessor system-on-chips (MPSoCs)
  • Industrial
  • Efficient hardware for training of neural networks
  • Apple smart watch
  • Industrial sectors
  • Robotics
  • AC drive control module
  • Automotive
  • Self-aware system-on-chip (SoC)
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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UPS(www.ups.com)
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FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z030-1SBG485I

technical specifications, attributes, parameters and parts with similar specifications to XC7Z030-1SBG485I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Mount

    Surface Mount

  • Package / Case

    484-FBGA, FCBGA

  • Number of Pins

    485

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    485

  • ECCN Code

    EAR99

  • Terminal Finish

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Additional Feature

    PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

  • HTS Code

    8542.39.00.01

  • Subcategory

    Other Microprocessor ICs

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1V

  • Terminal Pitch

    0.8mm

  • Frequency

    667MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.05V

  • Power Supplies

    11.8V

  • Supply Voltage-Min (Vsup)

    0.95V

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • RAM (words)

    256000

  • Primary Attributes

    Kintex™-7 FPGA, 125K Logic Cells

  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • UV Erasable

    N

  • Height Seated (Max)

    2.44mm

  • Length

    19mm

  • RoHS Status

    ROHS3 Compliant

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