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XC7Z010-3CLG400E

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Manufacturer No:

XC7Z010-3CLG400E

Manufacturer:

Xilinx

HK JDW NO:

903-XC7Z010-3CLG400E

Package:

400-LFBGA, CSPBGA

Datasheet:

XC7Z010-3CLG400E

Description:

400 Terminations0°C~100°C TJ 400 Pin XC7Z010 System On ChipZynq?-7000 Series 130 I/O1V

Quantity:

In Stock : 1780

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 400-LFBGA, CSPBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 28K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.Having 400 terminations in total makes system on a chip possible.By searching XC7Z010, you can find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 866MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.This is the version with 400 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z010-3CLG400E System On Chip (SoC) applications.

  • Functional safety for critical applications in the automotive
  • Cyber security for critical applications in the aerospace
  • ARM Cortex M4 microcontroller
  • USB hard disk enclosure
  • Digital Signal Processing
  • Wireless networking
  • Communication network-on-Chip (cNoC)
  • Avionics
  • Vending machines
  • Sports
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7Z010-3CLG400E

technical specifications, attributes, parameters and parts with similar specifications to XC7Z010-3CLG400E.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Package / Case

    400-LFBGA, CSPBGA

  • Surface Mount

    YES

  • Number of Pins

    400

  • Operating Temperature

    0°C~100°C TJ

  • Packaging

    Tray

  • Published

    2010

  • Series

    Zynq®-7000

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    400

  • ECCN Code

    EAR99

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • HTS Code

    8542.39.00.01

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    260

  • Supply Voltage

    1V

  • Terminal Pitch

    0.8mm

  • Frequency

    866MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    XC7Z010

  • Operating Supply Voltage

    1V

  • Supply Voltage-Max (Vsup)

    1.05V

  • Interface

    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Boundary Scan

    YES

  • Speed Grade

    -3

  • RAM (words)

    256000

  • Primary Attributes

    Artix™-7 FPGA, 28K Logic Cells

  • Bus Compatibility

    CAN; ETHERNET; I2C; SPI; UART; USB

  • Height Seated (Max)

    1.6mm

  • Length

    17mm

  • Radiation Hardening

    No

  • RoHS Status

    ROHS3 Compliant

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