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M2S090S-1FG676I

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Manufacturer No:

M2S090S-1FG676I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S090S-1FG676I

Package:

676-BGA

Datasheet:

M2S090S-1FG676I

Description:

-40°C~100°C TJ M2S090S System On ChipSmartFusion?2 Series 425 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 676-BGA to this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.425 I/Os in total are included in this SoC part.There is a flash of 512KB.A search for M2S090S will result in system on chips that have similar specs and purposes.In this wireless SoC, the frequency is set to 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.For the SoC computing to start, -40°C is sufficient.There is an operating temperature limit of 100°C which is the maximum operating temperature designed for this SoC system on chip.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090S-1FG676I System On Chip (SoC) applications.

  • Networked Media Encode/Decode
  • Communication network-on-Chip (cNoC)
  • POS Terminals
  • Sensor network-on-chip (sNoC)
  • Digital Media
  • Central alarm system
  • Industrial Pressure
  • POS Terminals
  • Medical
  • Samsung galaxy gear
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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S090S-1FG676I

technical specifications, attributes, parameters and parts with similar specifications to M2S090S-1FG676I.

  • Type
    Parameter
    Select All
  • Package / Case

    676-BGA

  • Supplier Device Package

    676-FBGA (27x27)

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®2

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    100°C

  • Min Operating Temperature

    -40°C

  • Frequency

    166MHz

  • Base Part Number

    M2S090S

  • Interface

    CAN, Ethernet, I2C, SPI, UART, USART, USB

  • Number of I/O

    425

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Primary Attributes

    FPGA - 90K Logic Modules

  • Flash Size

    512KB

  • RoHS Status

    Non-RoHS Compliant

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