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LFE2M50E-5FN900I

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Manufacturer No:

LFE2M50E-5FN900I

Manufacturer:

Lattice Semiconductor

HK JDW NO:

477-LFE2M50E-5FN900I

Package:

900-BBGA

Datasheet:

LFE2M50E-5FN900I

Description:

1.2V V 531kB B FPGAs ECP2M Series 900-BBGA

Quantity:

In Stock : 999

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LFE2M50E-5FN900I Overview


There are two packages that contain fpga chips: 900-BBGA package and X package. There are 410 I/Os for better data transfer. A fundamental building block contains 48000 logic elements or cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 1.14V~1.26V . The ECP2M Series is one of the types of FPGAs that belong to this type. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are 4246528 RAM bits that are available with this device. For related parts, use its base part number LFE2M50. For the program to work properly, the RAM si518.4kBe of this FPGA module must reach 518.4kB GB in order to ensure normal operation. This cable has 900 pins and is designed to connect to a computer. 6000 LABs/CLBs are configured on this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. The 1.2V supply voltage provides designers with full flexibility in their designs. The maximal operating temperature of this module reaches 100°C. Fpga electronics is necessary to maintain an operating temperature higher than -40°C. The basic building block of the system is composed of 6000 logic blocks (LABs). A memory of 531kB is embedded in this FPGA module for storing data and programs. This device package is supplied by 900-FPBGA (31x31).

LFE2M50E-5FN900I Features


410 I/Os
Up to 4246528 RAM bits
900 LABs/CLBs
100°C gates
6000 logic blocks (LABs)

LFE2M50E-5FN900I Applications


There are a lot of Lattice Semiconductor Corporation LFE2M50E-5FN900I FPGAs applications.

  • Camera time adjustments
  • Automotive advanced driver assistance systems (ADAS)
  • Cryptography
  • Digital signal processing
  • ASIC prototyping
  • Space Applications
  • Medical ultrasounds
  • Automotive driver's assistance
  • Military Temperature
  • Data center hardware accelerators
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

LFE2M50E-5FN900I

technical specifications, attributes, parameters and parts with similar specifications to LFE2M50E-5FN900I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    8 Weeks

  • Mount

    Surface Mount

  • Mounting Type

    Surface Mount

  • Package / Case

    900-BBGA

  • Number of Pins

    900

  • Supplier Device Package

    900-FPBGA (31x31)

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2012

  • Series

    ECP2M

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    100°C

  • Min Operating Temperature

    -40°C

  • Voltage - Supply

    1.14V~1.26V

  • Base Part Number

    LFE2M50

  • Operating Supply Voltage

    1.2V

  • Memory Size

    531kB

  • Number of I/O

    410

  • RAM Size

    518.4kB

  • Number of Logic Elements/Cells

    48000

  • Total RAM Bits

    4246528

  • Number of LABs/CLBs

    6000

  • Number of Logic Blocks (LABs)

    6000

  • RoHS Status

    ROHS3 Compliant

  • Lead Free

    Lead Free

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