Items : %s%s
Microprocessors
Additional Feature
- 16 MIPS; BURST BUS; 5 PIPELINE STAGES
- 24MHZ NOMINAL CLOCK AVAILABLE
- ADDRESSABLE REGISTER (ARA)
- ALSO OPERATES AT 1V NOMINAL SUPPLY
- ALSO OPERATES AT 1V SUPPLY NOM
- ALSO OPERATES AT 2.85 V MINIMUM SUPPLY
- ALSO OPERATES AT 3.3 V
- ALSO OPERATES AT 5V SUPPLY
- ALSO OPERATES AT 600 MHZ
- ALSO OPERATES AT MIN 0.912 V
- ALSO REQUIRES 1.8V OR 2.5V SUPPLY
- ALSO REQUIRES 1.8V OR 3.3V SUPPLY
- ALSO REQUIRES 2.5V AND 3.3V SUPPLY
- ALSO REQUIRES 2.5V OR 3.3V SUPPLY
- ALSO REQUIRES 3.3V I/O SUPPLY
- ALSO REQUIRES 3.3V SUPPLY
- ALSO REQUIRES 3V OR 3.3V SUPPLY
- ALSO REQUIRES 5V SUPPLY
- ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.
- BARREL SHIFTER
- BURST BUS
- BURST BUS; 5 PIPELINE STAGES
- CAN ALSO OPERATE WITH 5V SUPPLY
- DRAM MEMORY REFRESH COUNTER
- DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER
- DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
- DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
- DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
- DRAM REFRESH COUNTER
- DYNAMIC BUS SIZING;UPTO 9.2 MIPS
- IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
- IT ALSO OPERATES IN 600 MHZ AT 0.9V SUPPLY
- IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY
- LOW POWER TAKEN FROM SLEEP MODE
- OPERATING CASE TEMPERATURE 0 TO 100 C
- OPERATING CASE TEMPERATURE 0 TO 85 C
- OPERATING CASE TEMPERTURE 0 TO 100 C
- OPERATING CASE TEMPERTURE 0 TO 85 C
- OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 20 MIPS MAX; 7.5 MIPS SUSTAINED; BURST BUS
- OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
- OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS
- PIPELINED ARCHITECTURE
- REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
- REGISTER SCOREBOARDING; BURST BUS
- REQUIRES 3.3V SUPPLY FOR I/O
- SEATED HGT-CALCULATED
Connector Type
- Connector
- IDC
- Pin
Contact Plating
- Copper, Silver, Tin
- Gold
- Lead, Tin
- Silver, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.A.3
- 3A991
- 3A991.A.1
- 3A991.A.2
- 5A002
- 5A002.A
- 5A002.A.1
- 5A002.A.4
- 5A991
- 5A992
- 5A992.C
- 5A992C
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 3 Weeks
- 4 Weeks
- 5 Weeks
- 52 Weeks
- 53 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
HTS Code
- 8542.31.00.01
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e4
- e4
- e6
- e8
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 2 weeks ago)
- ACTIVE (Last Updated: 23 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 3 weeks ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 7 months ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 2 weeks ago)
- NRND (Last Updated: 3 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
Manufacturer Package Identifier
- AM1808BZWT3
- AM1808EZCED4
- AM5716AABCDEA
- AMIC120BZDNA30
- AT91SAM9G45C-CU
- FCBGA 760
- LFBGA-361
Max Operating Temperature
- 100°C
- 105°C
- 110°C
- 115°C
- 125°C
- 150°C
- 55°C
- 57°C
- 64°C
- 65°C
- 66°C
- 67.4°C
- 67°C
- 68°C
- 69.1°C
- 69.8°C
- 69°C
- 70°C
- 71.4°C
- 72.6°C
- 72.7°C
- 72°C
- 73°C
- 74°C
- 75°C
- 76.2°C
- 76°C
- 77°C
- 79°C
- 81.3°C
- 83°C
- 85°C
- 87°C
- 88°C
- 90°C
- 95°C
Min Operating Temperature
- -20°C
- -25°C
- -30°C
- -40°C
- -55°C
- -65°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 4 (72 Hours)
- 5
- 5 (48 Hours)
- Not Applicable
Mount
- Box
- Edge
- Socket
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
- Wall
Number of Pins
- 100
- 1023
- 1031
- 1088
- 1089
- 114
- 1155
- 1156
- 128
- 1284
- 1288
- 1295
- 132
- 1356
- 1366
- 144
- 160
- 168
- 176
- 179
- 184
- 196
- 2
- 20
- 2011
- 204
- 208
- 217
- 24
- 240
- 241
- 247
- 255
- 256
- 272
- 28
- 289
- 292
- 296
- 298
- 3
- 304
- 32
- 320
- 324
- 352
- 356
- 357
- 360
- 361
- 364
- 368
- 370
- 388
- 399
- 4
- 40
- 413
- 416
- 417
- 420
- 423
- 432
- 437
- 44
- 441
- 449
- 473
- 478
- 479
- 48
- 480
- 481
- 483
- 484
- 491
- 492
- 495
- 515
- 516
- 52
- 520
- 5284
- 540
- 544
- 559
- 561
- 60
- 603
- 604
- 615
- 620
- 64
- 668
- 672
- 676
- 68
- 684
- 689
- 722
- 740
- 760
- 771
- 775
- 783
- 8
- 80
- 827
- 831
- 838
- 84
- 940
- 956
- 988
- 994
Number of Terminations
- 100
- 1023
- 114
- 128
- 1295
- 1313
- 132
- 1329
- 1366
- 144
- 160
- 168
- 169
- 176
- 179
- 184
- 196
- 20
- 204
- 206
- 208
- 217
- 225
- 228
- 233
- 236
- 24
- 240
- 241
- 247
- 255
- 256
- 265
- 272
- 28
- 289
- 297
- 298
- 3
- 304
- 32
- 320
- 324
- 347
- 352
- 356
- 357
- 360
- 361
- 364
- 369
- 370
- 372
- 388
- 40
- 400
- 404
- 413
- 416
- 42
- 420
- 423
- 425
- 432
- 437
- 44
- 441
- 449
- 457
- 473
- 478
- 479
- 48
- 480
- 483
- 484
- 486
- 488
- 489
- 491
- 492
- 515
- 516
- 52
- 520
- 525
- 529
- 538
- 541
- 544
- 559
- 569
- 576
- 603
- 604
- 609
- 620
- 621
- 624
- 625
- 64
- 668
- 672
- 676
- 68
- 684
- 689
- 740
- 760
- 771
- 775
- 780
- 783
- 8
- 80
- 838
- 84
- 85
- 896
- 940
- 956
- 988
Operating Temperature
- -10°C~70°C TA
- -20°C~105°C TJ
- -20°C~70°C TA
- -20°C~75°C TA
- -20°C~85°C TA
- -20°C~85°C TC
- -30°C~70°C TA
- -40°C~100°C TA
- -40°C~100°C TC
- -40°C~105°C
- -40°C~105°C TA
- -40°C~105°C TJ
- -40°C~110°C TC
- -40°C~110°C TJ
- -40°C~115°C TA
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~70°C TA
- -40°C~85°C
- -40°C~85°C TA
- -40°C~85°C TC
- -40°C~90°C TJ
- -40°C~95°C TA
- -40°C~95°C TC
- -45°C~85°C TA
- -55°C~125°C TC
- -55°C~125°C TJ
- -55°C~175°C TJ
- -55°C~85°C TA
- 0°C~100°C TC
- 0°C~100°C TJ
- 0°C~105°C
- 0°C~105°C TA
- 0°C~105°C TC
- 0°C~125°C TA
- 0°C~70°C
- 0°C~70°C TA
- 0°C~85°C TA
- 0°C~85°C TC
- 0°C~85°C TJ
- 0°C~90°C TA
- 0°C~90°C TJ
- 0°C~95°C
- 0°C~95°C TA
- 0°C~95°C TJ
Package / Case
- 100-BFQFP
- 100-BQFP
- 100-LQFP
- 100-QFP
- 1020-BBGA, FCBGA
- 1023-BBGA, FCBGA
- 1023-BCBGA, FCCBGA
- 1023-BFBGA, FCBGA
- 1031-BFBGA, FCBGA
- 1089-BFBGA, FCBGA
- 114-BCPGA
- 114-BPGA
- 1150-LGA Module
- 1151-LGA Module
- 1155-LGA Module
- 128-BPGA
- 128-BQFP
- 128-LQFP
- 1292-BBGA, FCBGA
- 1292-BFBGA, FCBGA
- 1295-BBGA, FCBGA
- 132-BCQFP
- 132-BPGA Exposed Pad
- 132-BQFP Bumpered
- 132-QFP
- 1366-LGA
- 144-BCQFP
- 144-BQFP
- 144-LBGA
- 144-LQFP
- 144-TQFP
- 168-PGA
- 169-LFBGA
- 176-LFBGA
- 176-LQFP Exposed Pad
- 179-BEPGA
- 179-PGA
- 182-BEPGA
- 184-BCQFP
- 1932-BBGA, FCBGA
- 196-LFBGA
- 196-TFBGA, CSBGA
- 2011-LGA Module
- 2011-LGA, FC
- 204-TFBGA
- 206-BPGA
- 208-BFQFP
- 208-BFQFP Exposed Pad
- 208-LQFP
- 208-QFP
- 211-VFLGA
- 217-LFBGA
- 225-LFBGA
- 233-TFBGA
- 240-BFCQFP
- 240-BFQFP
- 241-BEPGA
- 247-LFBGA
- 255-BBGA, FCBGA
- 255-BCBGA Exposed Pad
- 255-BCBGA, FCCBGA
- 256-BBGA
- 256-BGA
- 256-LBGA
- 256-LFBGA
- 256-LQFP
- 256-MAPBGA
- 256-TFBGA
- 257-TFBGA
- 265-LFBGA
- 272-BBGA
- 272-LFBGA
- 289-BGA
- 289-LFBGA
- 289-TFBGA
- 292-LFBGA
- 297-LFBGA
- 298-LFBGA
- 304-LBGA Exposed Pad
- 320-LFBGA
- 324-BGA
- 324-LFBGA
- 324-TFBGA
- 352-BBGA
- 352-LBGA
- 354-LFBGA
- 357-BBGA
- 357-BGA
- 360-BBGA Exposed Pad
- 360-BBGA, FCBGA
- 360-BCBGA
- 360-BCBGA, FCCBGA
- 360-CBGA, FCCBGA
- 360-CLGA, FCCLGA
- 361-LFBGA
- 361-TFBGA
- 364-LFBGA
- 3647-LGA Module
- 369-LFBGA
- 40-DIP (0.600, 15.24mm)
- 40-DIP (0.620, 15.75mm)
- 400-LFBGA
- 404-LFBGA
- 416-BGA
- 416-LFBGA
- 423-LFBGA, FCBGA
- 425-FBGA
- 432-LBGA
- 432-TFBGA
- 44-LCC (J-Lead)
- 44-LQFP
- 448-BFBGA
- 448-FBGA Exposed Pad
- 448-LFBGA
- 449-FBGA
- 457-FBGA
- 457-LFBGA
- 473-LFBGA
- 480-LBGA Exposed Pad
- 483-BCBGA, FCCBGA
- 484-BBGA Exposed Pad
- 486-LFBGA
- 486-LFBGA, FCBGA
- 488-TFBGA
- 489-LFBGA
- 491-LFBGA
- 492-BBGA
- 515-VFBGA, FCBGA
- 515-WFBGA, FCBGA
- 516-BBGA
- 516-BBGA Exposed Pad
- 520-FBGA, FCBGA
- 520-LFBGA
- 525-FBGA, FCBGA
- 529-FBGA
- 529-LFBGA
- 538-LFBGA, FCBGA
- 541-LFBGA
- 561-FBGA
- 569-LFBGA
- 620-BBGA Exposed Pad
- 621-FBGA, FCBGA
- 624-FBGA, FCBGA
- 624-LFBGA
- 624-LFBGA, FCBGA
- 625-BFBGA, FCBGA
- 64-CDIP (0.900, 22.86mm)
- 64-DIP (0.750, 19.05mm)
- 64-LQFP
- 64-QFP
- 668-BBGA Exposed Pad
- 672-LBGA
- 68-BCPGA
- 68-CPGA
- 68-LCC (J-Lead)
- 684-BFBGA, FCBGA
- 689-BBGA Exposed Pad
- 740-LBGA
- 760-BFBGA, FCBGA
- 760-LFBGA
- 780-BBGA, FCBGA
- 780-BFBGA
- 780-BFBGA, FCBGA
- 780-FBGA
- 780-FBGA, FCBGA
- 783-BBGA, FCBGA
- 784-BBGA, FCBGA
- 80-BQFP
- 84-LCC (J-Lead)
- 896-BFBGA, FCBGA
- 988-PGA Module
- 994-BCBGA, FCCBGA
- BGA
- CDIP
- DIP
- FBGA
- FCBGA
- LCC
- LGA
- LQFP
- MAPBGA
- Module
- PDIP
- PLCC
- PQFP
- QFN
- QFP
- SOIC
- TFBGA
- TQFP
Packaging
- Box
- Box|Tray
- Bulk
- Cut Tape (CT)
- Each
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tray|Box
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- LTB
- Not For New Designs
- NRND
- Obsolete
- Preliminary
- Unconfirmed
Pbfree Code
- no
- yes
Published
- 1993
- 1994
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- AT91SAM
- Automotive, AEC-Q100
- Broadwell
- Broadwell-EP
- C29x Crypto
- Conroe
- EP7
- EP9
- eZ80® Acclaim!®
- Haswell
- i.MX1
- i.MX21
- i.MX23
- i.MX25
- i.MX27
- i.MX28
- i.MX31
- i.MX35
- i.MX50
- i.MX51
- i.MX53
- i.MX6
- i.MX6D
- i.MX6DL
- i.MX6DP
- i.MX6G
- i.MX6Q
- i.MX6QP
- i.MX6S
- i.MX6SL
- i.MX6SLL
- i.MX6SX
- i.MX6UL
- i.MX6Y
- i.MX7D
- i.MX7S
- i.MX7ULP
- i.MX8MD
- i.MX8MM
- i.MX8MN
- i.MX8MQ
- i.MXL
- i.MXS
- i186
- i386
- i486
- i960
- Interprise™
- Ivy Bridge
- Ivy Bridge-EP
- Kaby Lake
- M680x0
- M683xx
- Merom
- Mobile Celeron
- Mobile Pentium II
- MPC52xx
- MPC6xx
- MPC74xx
- MPC7xx
- MPC82xx
- MPC83xx
- MPC85xx
- MPC86xx
- MPC8xx
- OMAP-35xx
- OMAP-59xx
- OMAP-L1x
- Penryn
- QorIQ P1
- QorIQ P2
- QorIQ P3
- QorIQ P4
- QorIQ P5
- QorIQ Qonverge B
- QorIQ Qonverge BSC
- QorIQ T1
- QorIQ T2
- QorIQ T4
- QorIQ®
- QorIQ® Layerscape
- QorlQ LS1
- Rabbit®
- RZ/A1H
- RZ/A1L
- RZ/A1LC
- RZ/A1LU
- RZ/A1M
- RZ/N1D
- RZ/N1L
- RZ/N1S
- SA-110
- SAC™
- SAM9CN
- SAM9G
- SAM9M
- SAM9N
- SAM9X
- SAM9X60
- SAM9XE
- SAMA5D2
- SAMA5D3
- SAMA5D4
- Sandy Bridge
- Sandy Bridge-EP
- SCC
- SIAP™
- Sitara™
- Skylake
- SPEAr®
- STM32MP1
- Vybrid, VF3xx
- Vybrid, VF3xxR
- Vybrid, VF5xx
- Vybrid, VF5xxR
- Vybrid, VF6xx
- Wolfdale
- Yonah
- Yorkfield
- Z180
- Z80
- ZIP™
Supplier Device Package
- 100-PQFP (19x19)
- 100-PQFP (20x14)
- 100-QFP (14x20)
- 100-TQFP (14x14)
- 100-VQFP (14x14)
- 1023-FCCBGA (33x33)
- 1023-FCPBGA (33x33)
- 114-PGA (34.55x34.55)
- 1150-FCLGA
- 1150-LGA
- 1151-FCLGA
- 1151-LGA
- 1155-FCLGA
- 1155-FCLGA (37.5x37.5)
- 1155-LGA (37.5x37.5)
- 1295-FCPBGA (37.5x37.5)
- 132-CPGA
- 132-CQFP (24x24)
- 132-PGA (34.5x34.5)
- 132-PQFP (24.13x24.13)
- 132-PQFP (46x46)
- 1366-LGA
- 144-CQFP (26.77x26.77)
- 144-LQFP (20x20)
- 168-PGA
- 176-HLQFP (24x24)
- 179-PGA (47.24x47.24)
- 184-CQFP (31.3x31.3)
- 196-QFP
- 2011-LGA
- 206-PGA (47.25x47.25)
- 208-LQFP
- 208-PQFP (28x28)
- 208-SQFP (28x28)
- 211-FCLGA (9.6x9.6)
- 217-LFBGA (15x15)
- 225-MAPBGA (13x13)
- 240-FQFP (32x32)
- 241-PGA (47.24x47.24)
- 255-CI-CGA (21x21)
- 255-FCCBGA (21x21)
- 255-PBGA (21x21)
- 256-BGA (17x17)
- 256-CABGA (17x17)
- 256-MAPBGA (17x17)
- 256-PBGA (17x17)
- 256-PBGA (23x23)
- 272-PBGA (27x27)
- 289-BGA (19x19)
- 289-MAPBGA (14x14)
- 292-LFBGA (17x17)
- 298-NFBGA (13x13)
- 304-TBGA (31x31)
- 320-LFBGA (13x13)
- 324-NFBGA(15x15)
- 324-TFBGA (15x15)
- 352-TBGA (35x35)
- 357-PBGA (25x25)
- 360-CBGA (25x25)
- 360-FCCBGA (25x25)
- 360-PBGA (25x25)
- 361-NFBGA (13x13)
- 361-NFBGA (16x16)
- 369-PBGA (19x19)
- 400-MAPBGA (17x17)
- 416-PBGA (27x27)
- 423-FCBGA (16x16)
- 425-TEPBGA I (19x19)
- 432-MAPBGA (13x13)
- 448-PBGA w/Heat Spreader (23x23)
- 457-MAPBGA (14x14)
- 473-MAPBGA (19x19)
- 478-PGA
- 480-TBGA (37.5x37.5)
- 483-HTCE-CBGA (29x29)
- 491-NFBGA (17x17)
- 515-POP-FCBGA (12x12)
- 515-POP-FCBGA (14x14)
- 516-FPBGA (27x27)
- 516-TEPBGA (27x27)
- 525-FCPBGA (19x19)
- 561-TEPBGA I (23x23)
- 615-BGA (35.15x31.15)
- 620-PBGA (29x29)
- 624-FCBGA (21x21)
- 64-QFP (14x14)
- 668-PBGA-PGE (29x29)
- 672-TBGA (35x35)
- 68-PLCC (24.21x24.21)
- 684-FCBGA (23x23)
- 689-TEPBGA II (31x31)
- 740-TBGA (37.5x37.5)
- 775-LGA
- 780-FCPBGA (23x23)
- 783-FCPBGA (29x29)
- 988-PGA
- 988-PGA (37.5x37.5)
- 994-FCCBGA (33x33)
Surface Mount
- NO
- YES
Terminal Finish
- Gold (Au)
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- TIN
- Tin (Sn)
- TIN BISMUTH
- TIN COPPER/TIN SILVER
- TIN LEAD
- TIN LEAD SILVER
- TIN SILVER
- TIN SILVER COPPER
- TIN SILVER COPPER OVER NICKEL
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn80Pb20)
- Tin/Lead (Sn85Pb15)
- Tin/Lead/Silver (Sn/Pb/Ag)
- TIN/NICKEL PALLADIUM GOLD
- TIN/SILVER
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
- Tin/Silver/Copper - with Nickel barrier
- Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Termination
- SMD/SMT
Transistor Element Material
- SILICON
USB
- USB 1.1 (2)
- USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- USB 2.0 (1)
- USB 2.0 (1), USB 3.0 (1)
- USB 2.0 (2)
- USB 2.0 (3)
- USB 2.0 (3), USB 2.0 + PHY (1)
- USB 2.0 + HSIC
- USB 2.0 + PHY (1)
- USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- USB 2.0 + PHY (2)
- USB 2.0 + PHY (3)
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- USB 2.0 + PHY (4)
- USB 2.0 OTG + PHY (1)
- USB 2.0 OTG + PHY (2)
- USB 3.0 (2)
Weight
- 1.241794g
- 1.428504g
- 1.486592g
- 1.623294g
- 1.662955g
- 1.713814g
- 1.724048g
- 1.758663g
- 1.758804g
- 10.060849g
- 10.163049g
- 10.630703g
- 10.784102g
- 11.162596g
- 11.227488g
- 11.285492g
- 11.436396g
- 11.529496g
- 12.834991g
- 12.927383g
- 12.964294g
- 12.96659g
- 13.095892g
- 13.971014g
- 14.084298g
- 2.089502g
- 2.094208g
- 2.096504g
- 2.169986g
- 2.1737g
- 2.267508g
- 2.514603g
- 2.587007g
- 2.668711g
- 2.784008g
- 205.307246mg
- 274.791928mg
- 284.997756mg
- 29.780891g
- 3.193404g
- 3.336087g
- 3.420001g
- 3.534392g
- 3.663807g
- 3.695587g
- 3.803287g
- 360.605934mg
- 4.086896g
- 4.31131g
- 4.358994g
- 4.374388g
- 4.543691g
- 4.617712g
- 4.634155g
- 4.634807g
- 4.724505g
- 4.743102g
- 4.801956g
- 5.177388g
- 5.247213g
- 5.438686g
- 5.496887g
- 5.503805g
- 5.67084g
- 5.819307g
- 5.821943g
- 5.854205g
- 5.976306g
- 530.703073g
- 6.069208g
- 6.610599g
- 6.718043g
- 685.207974mg
- 7.349897g
- 7.994395g
- 789.392471mg
- 838.692292mg
- 9.256006g
- 9.283193g
- 911.607266mg
- 919.403384mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Min Supply Voltage | Frequency | Width | Weight | Operating Temperature | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Halogen Free | Number of Cores | Supplier Device Package | Core Architecture | Speed | Frequency (Max) | Memory Size | Memory Type | Ethernet | USB | SATA | Core Processor | RAM Size | Number of I/O | Address Bus Width | Number of UART Channels | Supply Current-Max | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Barrel Shifter | Data Bus Width | Number of Timers/Counters | uPs/uCs/Peripheral ICs Type | Clock Frequency | RAM (words) | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | ROM (words) | RAM (bytes) | CPU Family | Integrated Cache | Internal Bus Architecture | Voltage - I/O | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | Co-Processors/DSP | Security Features | Display & Interface Controllers | Additional Interfaces | Device Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MC68LC060BRC66 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1995 | M680x0 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 206-BPGA | -40°C~70°C TA | MC68LC060 | 206-PGA (47.25x47.25) | 66MHz | 68060 | 5.0V | 1 Core 32-Bit | No | SCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "SAB-80C515A-N18") |
SAB-80C515A-N18 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 68 | 70°C | 0°C | 5V | 24.21mm | Non-RoHS Compliant | 68 | ON CHIP XRAM 1K X 8; BOOLEAN PROCESSOR | PLCC | Serial | 5.5V | 4.25V | 18MHz | 24.21mm | CMOS | 5.08mm | e0 | Tin/Lead (Sn/Pb) | QUAD | J BEND | NOT SPECIFIED | 5V | NOT SPECIFIED | 68 | COMMERCIAL | 1.27mm | Microcontrollers | Not Qualified | 5V | 8051 | ROMless | 1.3kB | 56 | 16 | 8 | 3 | MICROCONTROLLER | 8 | YES | NO | NO | NO | 1280 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC8640DVU1067NE | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2002 | MPC86xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 1023-BCBGA, FCCBGA | 0°C~105°C TA | MC8640 | 1.067GHz | 10/100/1000Mbps (4) | PowerPC e600 | 1.8V 2.5V 3.3V | 2 Core 32-Bit | No | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
PCX745BVZFU350LE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 255-BBGA Exposed Pad | -40°C~110°C TJ | PCX745 | 255-PBGA (21x21) | 350MHz | PowerPC | 2.5V 3.3V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
STM3210E-SK/KEI | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
P5021NXN72QC | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | 2012 | QorIQ P5 | Active | 3 (168 Hours) | 3A991.A.1 | 37.5mm | ROHS3 Compliant | 1295-BBGA, FCBGA | -40°C~105°C TA | CMOS | 3.53mm | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1.2V | 30 | YES | 1mm | S-PBGA-B1295 | 1.17V | 1.23V | 2.2GHz | 1Gbps (10), 10Gbps (2) | USB 2.0 + PHY (2) | SATA 3Gbps (2) | PowerPC e5500 | 16 | YES | YES | 64 | FIXED POINT | MICROPROCESSOR, RISC | YES | 1.0V 1.2V | 2 Core 64-Bit | No | DDR3, DDR3L | I2C, MMC/SD, PCIe, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
KMPC853TVR66A | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2004 | MPC8xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 256-BBGA | 0°C~95°C TA | MPC853 | 256-PBGA (23x23) | 166MHz | 10Mbps (1) | MPC8xx | 3.3V | 1 Core 32-Bit | No | DRAM | Communications; CPM | HDLC/SDLC, PCMCIA, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MPC850DSLVR50BU | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | MPC8xx | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | 23mm | ROHS3 Compliant | 256-BBGA | 0°C~95°C TA | CMOS | 2.54mm | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 40 | MPC850 | YES | 1.27mm | S-PBGA-B256 | 3V | Microprocessors | 3.3V | 3.6V | 50MHz | 10Mbps (1) | USB 1.x (1) | 26 | YES | YES | 32 | FIXED POINT | MICROPROCESSOR, RISC | 32 | YES | 3.3V | 1 Core 32-Bit | No | DRAM | Communications; CPM | HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
KMPC860PVR66D4 | Freescale Semiconductor, Inc. (NXP Semiconductors) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 95°C | 0°C | 3.3V | RoHS Compliant | Lead Free | No | 357 | BGA | 66MHz | 2.096504g | Not Halogen Free | 1 | 66MHz | 32b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
KMC7448VS1400ND | NXP Semiconductors | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2004 | MPC74xx | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 360-CLGA, FCCLGA | 0°C~105°C TA | MC7448 | 1.4GHz | PowerPC G4 | 1.5V 1.8V 2.5V | 1 Core 32-Bit | No | Multimedia; SIMD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC9328MXLVP15R2 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | i.MXL | yes | Obsolete | 3 (168 Hours) | 225 | 13mm | ROHS3 Compliant | 225-LFBGA | 0°C~70°C TA | 1.6mm | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1.8V | 40 | 225 | YES | 0.8mm | S-PBGA-B225 | 1.7V | COMMERCIAL | 1.9V | 150MHz | USB 1.x (1) | ARM920T | 25 | YES | YES | 32 | FIXED POINT | MICROPROCESSOR, RISC | 16MHz | 32 | YES | 1.8V 3.0V | 1 Core 32-Bit | No | SDRAM | LCD | I2C, I2S, SPI, SSI, MMC/SD, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MPC8377CVRAGD | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2012 | MPC83xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 689-BBGA Exposed Pad | -40°C~125°C TA | MPC8377 | 689-TEPBGA II (31x31) | 400MHz | 10/100/1000Mbps (2) | USB 2.0 + PHY (1) | SATA 3Gbps (2) | PowerPC e300c4s | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR, DDR2 | DUART, I2C, MMC/SD, PCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
P1010PSN5FFA | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2011 | QorIQ P1 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 425-FBGA | 0°C~105°C TA | P1010 | 1.0GHz | 10/100/1000Mbps (3) | USB 2.0 + PHY (1) | SATA 3Gbps (2) | PowerPC e500v2 | 1 Core 32-Bit | No | DDR3, DDR3L | CAN, DUART, I2C, MMC/SD, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CM8062107184424SR0GY | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 85°C | 1.35V | RoHS Compliant | 2011 | CMOS | BOTTOM | BUTT | Microprocessors | Not Qualified | 0.65/1.4V | 8 | 2700 MHz | 2.7GHz | 750GB | DDR3 | 165000mA | 64b | MICROPROCESSOR, RISC | 64 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
PCX755BVZFU350LE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 360-BBGA Exposed Pad | -40°C~110°C TJ | PCX755 | 360-PBGA (25x25) | 350MHz | PowerPC | 2.5V 3.3V | 1 Core 32-Bit | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
OMAP3503DCBBA | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | OMAP-35xx | no | Obsolete | 3 (168 Hours) | 515 | 12mm | ROHS3 Compliant | Contains Lead | 515 | 515-VFBGA, FCBGA | 1.89V | 1.71V | 600MHz | -40°C~105°C TJ | CMOS | 0.9mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.8V | OMAP3503 | 515 | 0.4mm | Graphics Processors | 1.35V | ARM | L2 Cache, ROM, SRAM | USB 1.x (3), USB 2.0 (1) | ARM® Cortex®-A8 | 64kB | 3 | YES | YES | FLOATING POINT | NO | 32b | DIGITAL SIGNAL PROCESSOR, OTHER | SINGLE | 1.8V 3.0V | 1 Core 32-Bit | No | LPDDR | Multimedia; NEON™ SIMD | LCD | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MPC8360ZUALFHA | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | MPC83xx | Obsolete | 3 (168 Hours) | 740 | 3A991.A.2 | 37.5mm | Non-RoHS Compliant | 740-LBGA | 0°C~105°C TA | CMOS | 1.69mm | 8542.31.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 260 | 1.3V | 40 | MPC8360 | YES | 1mm | S-PBGA-B740 | 1.25V | 1.35V | 667MHz | 10/100/1000Mbps (1) | USB 1.x (1) | PowerPC e300 | 32 | YES | YES | 32 | FLOATING POINT | MICROPROCESSOR, RISC | 66.67MHz | 32 | YES | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR, DDR2 | Communications; QUICC Engine | DUART, HDLC, I2C, PCI, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AM1705CPTPD4 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tube | Sitara™ | no | Obsolete | 4 (72 Hours) | 176 | 24mm | ROHS3 Compliant | Contains Lead | 176 | 176-LQFP Exposed Pad | SPI, USB | 1.35V | 1.25V | 456MHz | -40°C~90°C TJ | CMOS | 1.6mm | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | GULL WING | 260 | 1.2V | AM1705 | 0.5mm | Microprocessors | 1.35V | ARM | 16kB | 10/100Mbps (1) | USB 2.0 + PHY (1) | ARM926EJ-S | 8kB | 13 | 3 | YES | YES | FIXED POINT | 32b | MICROPROCESSOR, RISC | 32 | YES | 1.8V 3.3V | 1 Core 32-Bit | No | SDRAM | System Control; CP15 | I2C, McASP, SPI, MMC/SD, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
MPC8379VRALG | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | MPC83xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 689-BBGA Exposed Pad | 0°C~125°C TA | 689-TEPBGA II (31x31) | 667MHz | 10/100/1000Mbps (2) | USB 2.0 + PHY (1) | SATA 3Gbps (4) | PowerPC e300c4s | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR, DDR2 | DUART, I2C, MMC/SD, PCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY80632007221AAS LJBX | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | Yes with exemptions | 1466 | Atom | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MPC8544EAVTALF | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2007 | MPC85xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 783-BBGA, FCBGA | 0°C~105°C TA | MPC8544 | 667MHz | 10/100/1000Mbps (2) | PowerPC e500 | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | DUART, I2C, PCI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PPC8306CVMADDCA | NXP Semiconductors | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 369-LFBGA | -40°C~105°C TA | PC8306 | 369-PBGA (19x19) | 266MHz | 10/100Mbps (3) | USB 2.0 (1) | PowerPC e300c3 | 1.8V 3.3V | 1 Core 32-Bit | No | DDR2 | Communications; QUICC Engine | CAN, DUART, I2C, MMC/SD, SPI, TDM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AM1808BZWTT3 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | Sitara™ | no | Obsolete | 3 (168 Hours) | 361 | ROHS3 Compliant | Contains Lead | 361 | 361-LFBGA | 375MHz | -40°C~125°C TJ | CMOS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | AM1808 | 0.8mm | 1.32V | 1 | ARM | 10/100Mbps (1) | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | SATA 3Gbps (1) | ARM926EJ-S | 23 | 3 | YES | YES | 16 | FIXED POINT | MICROPROCESSOR, RISC | 32 | YES | 1.8V 3.3V | 1 Core 32-Bit | No | LPDDR, DDR2 | System Control; CP15 | LCD | I2C, McASP, McBSP, SPI, MMC/SD, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
LS1027AXE7KQA | NXP Semiconductors | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | QorIQ® Layerscape | Active | 3 (168 Hours) | 448-BFBGA | -40°C~105°C TA | 1GHz | 1Gbps (1), 2.5Gbps (5) | SATA 6Gbps (1) | ARM® Cortex®-A72 | 2 Core 64-Bit | DDR3L SDRAM, DDR4 SDRAM | CANbus, I2C, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCIMX507CVK8B | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tray | 2008 | i.MX50 | Active | 3 (168 Hours) | 416 | 5A992 | 13mm | ROHS3 Compliant | 416-LFBGA | 0°C~70°C TA | CMOS | 1.52mm | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.05V | 40 | MCIMX507 | YES | 0.5mm | S-PBGA-B416 | 0.95V | Not Qualified | 1.15V | 800MHz | 10/100Mbps (1) | USB 2.0 + PHY (2) | ARM® Cortex®-A8 | 628mA | YES | MICROPROCESSOR CIRCUIT | 800MHz | 131072 | 1.2V 1.875V 2.775V 3.0V | 1 Core 32-Bit | Yes | LPDDR, LPDDR2, DDR2 | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | LCD | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MPC8545EVUANG | NXP Semiconductors | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2007 | MPC85xx | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 783-BBGA, FCBGA | 0°C~105°C TA | MPC8545 | 800MHz | 10/100/1000Mbps (4) | PowerPC e500 | 1.8V 2.5V 3.3V | 1 Core 32-Bit | No | DDR, DDR2, SDRAM | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | DUART, I2C, PCI, RapidIO | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
C8051F316 | Silicon Labs | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 24 | 4mm | Non-RoHS Compliant | 4mm | CMOS | 0.8mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | NOT SPECIFIED | 3V | NOT SPECIFIED | 24 | INDUSTRIAL | YES | 0.5mm | S-XQCC-N24 | 2.7V | 85°C | -40°C | Microcontrollers | Not Qualified | 3/3.3V | 3.6V | 25 MHz | 21 | MICROCONTROLLER | 25MHz | 8 | YES | NO | YES | NO | FLASH | 16384 | 1280 | 8051 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
OSA146CEP5AK | AMD | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 940 | RoHS Compliant | No | 940 | CMOS | PERPENDICULAR | PIN/PEG | 1.5V | 940 | NO | 1.27mm | Microprocessors | 1.52.5V | 2000 MHz | 2GHz | 2900mA | NO | YES | FIXED POINT | MICROPROCESSOR, RISC | 64 | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
ATSAMA5D27C-CU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2017 | SAMA5D2 | Active | 3 (168 Hours) | 289 | 14mm | ROHS3 Compliant | 289-LFBGA | -40°C~85°C TA | CMOS | 1.4mm | 8542.31.00.01 | BOTTOM | BALL | 1.2V | ATSAMA5D27 | YES | 0.8mm | S-PBGA-B289 | 1.1V | 1.32V | 500MHz | 10/100Mbps (1) | USB 2.0 + HSIC | ARM® Cortex®-A5 | 26 | YES | YES | 32 | FLOATING POINT | MICROPROCESSOR, RISC | 24MHz | YES | 3.3V | 1 Core 32-Bit | Yes | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | I2C, SMC, SPI, UART, USART, QSPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
T2081NSN8T1B | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | QorIQ T2 | Active | 3 (168 Hours) | 780 | 3A991.A.1 | 23mm | ROHS3 Compliant | 896-BFBGA, FCBGA | 0°C~105°C TA | CMOS | 2.61mm | 8542.31.00.01 | BOTTOM | BALL | 250 | 1.025V | 30 | YES | 0.8mm | S-PBGA-B780 | 0.995V | 1.055V | 1.8GHz | 1Gbps (8), 2.5Gbps (4), 10Gbps (4) | USB 2.0 + PHY (2) | SATA 3Gbps (2) | PowerPC e6500 | 16 | YES | YES | 64 | FIXED POINT | MICROPROCESSOR, RISC | YES | 4 Core 64-Bit | DDR3, DDR3L | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage |
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