Items : %s%s
Microcontrollers
Connector Type
- IDC
Contact Plating
- Copper, Silver, Tin
- Copper, Tin
- Gold
- Gold, Tin
- Lead, Tin
- Tin
Core Size
- 16-Bit
- 16-Bit Dual-Core
- 16/32-Bit
- 32-Bit
- 32-Bit 10-Core
- 32-Bit 12-Core
- 32-Bit 16-Core
- 32-Bit 24-Core
- 32-Bit 32-Core
- 32-Bit 6-Core
- 32-Bit 8-Core
- 32-Bit Dual-Core
- 32-Bit Quad-Core
- 32-Bit Single-Core
- 32-Bit Tri-Core
- 4-Bit
- 8-Bit
- 8/16-Bit
ECCN Code
- 3A001.A.2.A
- 3A001.A.3
- 3A991.A.2
- 3A991.A.3
- 5A992
- 5A992.C
- 5A992C
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 28 Weeks
- 29 Weeks
- 3 Weeks
- 30 Weeks
- 32 Weeks
- 4 Weeks
- 5 Weeks
- 56 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
- e8
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 18 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- LIFEBUY (Last Updated: 4 days ago)
- LIFEBUY (Last Updated: 5 days ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 months ago)
- NRND (Last Updated: 7 months ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
Manufacturer Package Identifier
- 100A (REV C)
- 32M1-A
- 40P6 (REV B)
- 44J – PLCC
- 44J-B
- 51-85079 *F
- 5B_ME
- 64A
- 8S2
- AT89C51CC02CA-RATUM
- ATMEGA1284P-AU
- ATMEGA32U4-AU
- ATMEGA644V-10PU
- LQFP144-1A
- PIC16(L)F1826/27
- UFBGA132-A0G8
- UFBGA176+25-A0E7
- UFQFPN28-A0B0
- UFQFPN48-A0B9_ME
- YA_ME
Max Operating Temperature
- 105°C
- 125°C
- 70°C
- 85°C
Min Operating Temperature
- -40°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- 6 (Time on Label)
- Not Applicable
Mount
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 10
- 100
- 112
- 113
- 12
- 121
- 124
- 128
- 132
- 14
- 144
- 15
- 16
- 169
- 176
- 179
- 18
- 2
- 20
- 201
- 208
- 216
- 217
- 24
- 256
- 28
- 30
- 32
- 36
- 38
- 40
- 44
- 45
- 48
- 49
- 516
- 52
- 56
- 6
- 63
- 64
- 65
- 68
- 72
- 8
- 80
- 81
- 84
Number of Terminations
- 10
- 100
- 112
- 113
- 121
- 124
- 128
- 132
- 14
- 143
- 144
- 15
- 16
- 160
- 169
- 176
- 179
- 18
- 196
- 20
- 201
- 208
- 216
- 217
- 24
- 256
- 28
- 292
- 30
- 32
- 35
- 36
- 38
- 40
- 44
- 45
- 48
- 49
- 516
- 52
- 56
- 6
- 63
- 64
- 68
- 72
- 8
- 80
- 81
- 84
Operating Temperature
- -10°C~85°C TA
- -20°C~85°C TA
- -30°C~85°C TA
- -40°C~105°C TA
- -40°C~105°C TJ
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~150°C TA
- -40°C~80°C TA
- -40°C~85°C
- -40°C~85°C TA
- -55°C~125°C TA
- 0°C~70°C TA
- 0°C~95°C TJ
Package / Case
- 10-VFDFN Exposed Pad
- 100-BQFP
- 100-LBGA
- 100-LFBGA
- 100-LQFP
- 100-LQFP Exposed Pad
- 100-TFBGA
- 100-TQFP
- 100-TQFP Exposed Pad
- 100-UFBGA
- 100-VFBGA
- 112-LFBGA
- 113-VFBGA
- 121-LFBGA
- 121-TFBGA
- 124-VFTLA Dual Rows, Exposed Pad
- 128-LQFP
- 128-TQFP
- 132-UFBGA
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 144-BQFP
- 144-LBGA
- 144-LFBGA
- 144-LQFP
- 144-LQFP Exposed Pad
- 144-TFBGA
- 144-TQFP
- 144-TQFP Exposed Pad
- 144-UFBGA
- 16-SOIC (0.154, 3.90mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 16-UQFN Exposed Pad
- 16-VQFN Exposed Pad
- 169-UFBGA
- 176-LFBGA
- 176-LQFP
- 176-LQFP Exposed Pad
- 18-DIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 196-LBGA
- 20-DIP (0.300, 7.62mm)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFQFN Exposed Pad
- 20-VFQFN Exposed Pad
- 20-VQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 201-UFBGA
- 208-BFQFP
- 208-LQFP
- 216-TFBGA
- 24-UFQFN Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 256-LBGA
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-UFQFN
- 28-UFQFN Exposed Pad
- 28-UQFN Exposed Pad
- 28-VFQFN Exposed Pad
- 28-VQFN Exposed Pad
- 292-LFBGA
- 30-LSSOP (0.240, 6.10mm Width)
- 32-LQFP
- 32-TQFP
- 32-UFQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 32-WFQFN Exposed Pad
- 36-VFQFN Exposed Pad
- 36-VFTLA Exposed Pad
- 38-TFSOP (0.173, 4.40mm Width)
- 38-TSSOP (0.240, 6.10mm Width)
- 40-DIP (0.600, 15.24mm)
- 40-UFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 44-TQFP
- 44-VFQFN Exposed Pad
- 44-VFTLA Exposed Pad
- 44-VQFN Exposed Pad
- 48-BSSOP (0.295, 7.50mm Width)
- 48-LQFP
- 48-TQFP
- 48-TQFP Exposed Pad
- 48-UFQFN Exposed Pad
- 48-VFQFN Exposed Pad
- 49-UFBGA, WLCSP
- 49-VFBGA
- 52-LCC (J-Lead)
- 52-QFP
- 56-UFQFN Exposed Pad
- 64-LQFP
- 64-LQFP Exposed Pad
- 64-QFP
- 64-TFBGA
- 64-TQFP
- 64-TQFP Exposed Pad
- 64-UFBGA
- 64-UFBGA, WLCSP
- 64-VFQFN Exposed Pad
- 68-LCC (J-Lead)
- 68-VFQFN Exposed Pad
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-VDFN Exposed Pad
- 8-VFDFN Exposed Pad
- 80-BQFP
- 80-LQFP
- 80-QFP
- 80-TQFP
- 80-VFBGA
- 84-LCC (J-Lead)
- LQFP
- SOT-23-6
- TQFP
Packaging
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 128Ohm
Series
- 56F8xxx
- 80C
- 87C
- 89C
- 89LP
- AURIX™
- Automotive, AEC-Q100, AVR® ATmega
- Automotive, AEC-Q100, AVR® ATtiny
- Automotive, AEC-Q100, C2000™ C28x Piccolo™
- Automotive, AEC-Q100, dsPIC™ 33EP
- Automotive, AEC-Q100, dsPIC™ 33EV
- Automotive, AEC-Q100, dsPIC™ 33F
- Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R
- Automotive, AEC-Q100, PIC® 24EP
- Automotive, AEC-Q100, PIC® 24H
- Automotive, AEC-Q100, PIC® 32MX
- Automotive, AEC-Q100, PIC® 32MZ
- AVR® ATmega
- AVR® ATtiny
- C16xx
- C2000™ C28x Delfino™
- C2000™ C28x Piccolo™
- dsPIC™ 30F
- dsPIC™ 33EP
- dsPIC™ 33EV
- dsPIC™ 33F
- Gecko
- HCS12
- Kinetis K10
- Kinetis K20
- Kinetis K60
- Kinetis KL1
- Kinetis KV
- Leopard Gecko
- M16C™ M16C/60/62P
- MAXQ®
- megaAVR® 0
- MicroConverter® ADuC7xxx
- MicroConverter® ADuC8xx
- MPC57xx
- MSP430F2xx
- MSP430F5xx
- MSP430F6xx
- MSP430G2xx
- MSP430x1xx
- MSP430x4xx
- MSP430™ FRAM
- PIC® 10F
- PIC® 12C
- PIC® 12F
- PIC® 16C
- PIC® 16F
- PIC® 17C
- PIC® 18C
- PIC® 18F
- PIC® 18J
- PIC® 24EP
- PIC® 24F
- PIC® 24H
- PIC® 32MM
- PIC® 32MX
- PIC® 32MZ
- PIC® XLP™ 16F
- PIC® XLP™ 18J
- PIC® XLP™ 18K
- PIC® XLP™ 18Q
- PIC® XLP™ 24F
- PIC® XLP™ mTouch™ 16F
- PSOC® 3 CY8C32xx
- PSOC® 3 CY8C34xx
- PSOC® 3 CY8C36xx
- PSOC® 3 CY8C38xx
- PSOC®1 CY8C21xxx
- PSOC®1 CY8C24xxx
- RL78/G13
- RX600
- S08
- S12 MagniV
- S32K
- SAM D20J
- SAM E70
- SAM L11
- SAM S70
- SAM3S
- SAM4L
- SAM4S
- STM32F0
- STM32F1
- STM32F2
- STM32F3
- STM32F4
- STM32F7
- STM32H7
- STM32L0
- STM32L1
- STM32L4
- STM8L EnergyLite
- STM8S
- Tiny Gecko
- tinyAVR™ 1
- Tiva™ C
- Wonder Gecko
- XC16x
- XC8xx
- XE16x
- XMC1000
- XMC4000
- XS1
- Zero Gecko
Supplier Device Package
- 100-TFBGA (9x9)
- 100-TQFP (14x14)
- 14-PDIP
- 14-SOIC
- 144-LQFP (20x20)
- 16-QFN (4x4)
- 18-SOIC
- 20-QFN (4x4)
- 20-SSOP
- 20-TSSOP
- 28-DIP
- 28-PDIP
- 28-QFN (6x6)
- 28-QFN-S (6x6)
- 28-SOIC
- 28-SPDIP
- 28-SSOP
- 32-QFN (5x5)
- 32-VQFN (5x5)
- 40-PDIP
- 44-PLCC (16.59x16.59)
- 44-PLCC (16.6x16.6)
- 44-QFN (8x8)
- 44-TQFP (10x10)
- 44-TSSOP
- 48-LQFP (7x7)
- 48-QFN (7x7)
- 64-QFN (9x9)
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 8-MSOP
- 80-TQFP (12x12)
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Gold (Ni/Au)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- TIN
- Tin (Sn)
- TIN COPPER
- TIN LEAD
- TIN SILVER COPPER
- Tin/Copper/Silver (Sn/Cu/Ag)
- Tin/Lead (Sn/Pb)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
- Tin/Silver/Copper - with Nickel barrier
- Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Termination
- SMD/SMT
- Through Hole
Weight
- 1.290414g
- 1.319103g
- 1.620005g
- 1.896186g
- 103.986051mg
- 117.310327mg
- 117.508773mg
- 123.008581mg
- 138.005479mg
- 139.989945mg
- 140.30179mg
- 150.507618mg
- 181.692094mg
- 188.609377mg
- 190.990737mg
- 191.387631mg
- 2.214806g
- 2.26799g
- 203.804722mg
- 206.29948mg
- 22.679619g
- 227.391525mg
- 249.10726mg
- 274.706879mg
- 337.812918mg
- 338.011364mg
- 342.689036mg
- 360.605934mg
- 37.393021mg
- 4.190003g
- 4.535924g
- 43.204673mg
- 45.387587mg
- 456.087128mg
- 46.011276mg
- 465.697616mg
- 500.709277mg
- 503.487531mg
- 510.007921mg
- 53.693997mg
- 540.001716mg
- 57.09594mg
- 57.209338mg
- 60.186038mg
- 600.301152mg
- 639.990485mg
- 657.000198mg
- 665.986997mg
- 677.610302mg
- 69.994973mg
- 70.788759mg
- 71.809342mg
- 72.206235mg
- 72.801575mg
- 730.794007mg
- 76.997305mg
- 773.99868mg
- 800.987426mg
- 810.002575mg
- 9.071791g
- 9.071847g
- 925.810377mg
- 928.191737mg
- 930.006106mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Frequency | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Watchdog Timer | Core Architecture | Speed | Number of Terminals | Oscillator Type | Memory Size | Core Processor | RAM Size | Number of Bits | Number of I/O | Address Bus Width | Number of UART Channels | Supply Current-Max | Number of A/D Converters | Boundary Scan | External Data Bus Width | Data Bus Width | Bus Compatibility | Number of Timers/Counters | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Peripherals | Clock Frequency | RAM (words) | Bit Size | Has ADC | DMA Channels | PWM Channels | UV Erasable | ROM Size (bits) | DAC Channels | ROM Programmability | Voltage - Supply (Vcc/Vdd) | RAM (bytes) | CPU Family | EEPROM Size | Program Memory Type | Connectivity | Core Size | Program Memory Size | Data Converter | Device Core | SPI | Data Bus Width (bit) | Family Name | HTS | Instruction Set Architecture | Interface Type | Lead Shape | Maximum Operating Temperature (°C) | Minimum Operating Temperature (°C) | Mounting | Package Height | Package Length | Package Width | PCB changed | Standard Package Name | Supplier Package | Typical Operating Supply Voltage (V) | UART | Maximum Operating Supply Voltage (V) | Minimum Operating Supply Voltage (V) | ECCN (US) | I2C | PWM | Maximum CPU Frequency (MHz) | Maximum Clock Rate (MHz) | Programmability | No. of Timers | Number of ADCs | ADC Resolution (bit) | Watchdog | Parallel Master Port | CECC Qualified | Maximum Expanded Memory Size | Data Memory Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CY8C4248LQI-BL473 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 15 Weeks | Tray | 2015 | PSOC® 4 CY8C4xx8 BLE | Obsolete | 3 (168 Hours) | 56 | 5A992.B | 7mm | ROHS3 Compliant | 56-UFQFN Exposed Pad | 7mm | Surface Mount | -40°C~85°C TA | CMOS | 0.6mm | 8542.31.00.01 | QUAD | NO LEAD | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.4mm | S-XQCC-N56 | 1.71V | 5.5V | 48MHz | Internal | ARM® Cortex®-M0 | 32K x 8 | 36 | MICROPROCESSOR CIRCUIT | Bluetooth, Brown-out Detect/Reset, DMA LVD, POR, PWM, SmartCard, SmartSense, WDT | 1.71V~5.5V | FLASH | I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | 32-Bit | 256KB 256K x 8 | A/D 16x12b SAR; D/A 2xIDAC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MB90549GPMC-GS-XXXE1") |
MB90549GPMC-GS-XXXE1 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LM3S1B21-IBZ80-C5T | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | Stellaris® ARM® Cortex®-M3S 1000 | Obsolete | 3 (168 Hours) | 108 | 3.3V | ROHS3 Compliant | Contains Lead | No | 108 | 108-LFBGA | EBI/EMI, I2C, IrDA, LIN, SPI, UART, USART | 80MHz | Surface Mount | -40°C~85°C TA | CMOS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | LM3S1B21 | 108 | 0.8mm | Microcontrollers | Yes | ARM | Internal | 256kB | ARM® Cortex®-M3 | 96K x 8 | 10 | 67 | 3 | 1 | 32b | 4 | MICROCONTROLLER | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 32 | YES | YES | YES | NO | 1.08V~3.6V | FLASH | EBI/EMI, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART | 32-Bit | 256KB 256K x 8 | A/D 8x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCF5206FT16A | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1998 | MCF520x | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 160-BQFP | Surface Mount | 0°C~70°C TA | MCF5206 | 16MHz | External | Coldfire V2 | 512 x 8 | 8 | POR, WDT | 4.75V~5.25V | ROMless | I2C, UART/USART | 32-Bit | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HD6417615ARF | RENESAS ELECTRONICS CORP | 33.7861 |
Min: 1 Mult: 1 |
0.00000000 | 3A991.A.2 | 28mm | 28mm | CMOS | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 208 | COMMERCIAL EXTENDED | YES | 0.5mm | S-PQFP-G208 | 3V | 75°C | -20°C | Not Qualified | 3.6V | 62.5 MHz | 208 | 29 | 25 | 32 | MICROCONTROLLER, RISC | 1.7mm | 31.25MHz | 32 | NO | YES | YES | NO | MROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HD6417708SF60 | RENESAS ELECTRONICS CORP | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | [object Object] | CMOS | 8542.31.00.01 | QUAD | GULL WING | 3.3V | 144 | COMMERCIAL | YES | 0.5mm | S-PQFP-G144 | 70°C | -20°C | Microcontrollers | Not Qualified | 3.3V | 60 MHz | 144 | 200mA | MICROCONTROLLER, RISC | 32 | 4096 | SH7000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PC5674FF3FZPY2 | Teledyne e2v | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 516 | e200 | 256KB | Flash | 4MB | e200z7 | 4 | 32 | 8542.31.00.01 | RISC | CAN/SCI/SPI | 125 | -55 | Surface Mount | 1.95(Max) | 27 | 27 | 516 | TE-PBGA | 5|1.2|3.3 | 1.32|5.5|3.6 | 3|4.5|1.14 | 3A001.a.2.a | 264 | 200 | Yes | Quad | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W78E054B40PL | Nuvoton Technology Corporation of America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2006 | W78 | Obsolete | 3 (168 Hours) | 5V | RoHS Compliant | 44 | 44-LCC (J-Lead) | EBI/EMI, UART, USART | 40MHz | Surface Mount | 0°C~70°C TA | Internal | 16kB | 8051 | 256 x 8 | 36 | 3 | POR, WDT | 4.5V~5.5V | FLASH | EBI/EMI, UART/USART | 8-Bit | 16KB 16K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY8C3446LTI-072 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2005 | PSOC® 3 CY8C34xx | yes | Obsolete | 3 (168 Hours) | 68 | 8mm | ROHS3 Compliant | 68-VFQFN Exposed Pad | EBI/EMI, I2C, LIN, SPI, UART, USART | 50MHz | 8mm | Surface Mount | -40°C~85°C TA | CMOS | 1mm | 8542.39.00.01 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | NO LEAD | 260 | 3.3V | 20 | CY8C3446 | 68 | YES | 0.4mm | S-XQCC-N68 | 1.71V | Other Microprocessor ICs | Not Qualified | 2/5V | 5.5V | Internal | 64kB | 8051 | 8K x 8 | 38 | YES | I2C; USB | CapSense, DMA, POR, PWM, WDT | 8000 | N | 65536Bits | 1.71V~5.5V | 2K x 8 | FLASH | EBI/EMI, I2C, LINbus, SPI, UART/USART | 8-Bit | 64KB 64K x 8 | A/D 16x12b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S9KEAZN16ACLC | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 20 Weeks | Tray | 2013 | Kinetis KEA | yes | Active | 3 (168 Hours) | 32 | 7mm | ROHS3 Compliant | 32-LQFP | 7mm | Surface Mount | -40°C~85°C TA | QUAD | GULL WING | 260 | 3V | 40 | YES | 0.8mm | 2.7V | 5.5V | 40MHz | Internal | ARM® Cortex®-M0+ | 2K x 8 | 28 | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 20MHz | 32 | YES | NO | YES | 2.7V~5.5V | 256 x 8 | FLASH | I2C, LINbus, SPI, UART/USART | 32-Bit | 16KB 16K x 8 | A/D 16x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC68HC11E1CFNE3 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Tube | 1999 | HC11 | Not For New Designs | 3 (168 Hours) | 52 | EAR99 | 19.125mm | ROHS3 Compliant | SEATED HT-CALCULATED | 52-LCC (J-Lead) | 19.125mm | Surface Mount | -40°C~85°C TA | HCMOS | 5.08mm | 8542.31.00.01 | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 40 | MC68HC11 | YES | 1.27mm | S-PQCC-J52 | 4.5V | 5.5V | 3MHz | Internal | 512 x 8 | 38 | 16 | 8 | MICROCONTROLLER | POR, WDT | 12MHz | 8 | YES | NO | NO | NO | 4.5V~5.5V | 512 x 8 | ROMless | SCI, SPI | 8-Bit | A/D 8x8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R5F100FCAFP#V0 | Intersil | 18.3707 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | RoHS Compliant | 44 | RL78 | 2KB | 40 | Flash | 32KB | RL78 | 16 | RL78 | CISC | CSI/I2C/UART | Gull-wing | 85 | -40 | Surface Mount | 1.4 | 10 | 10 | 44 | QFP | LQFP | 5|1.8|2.5|3.3 | 3 | 5.5 | 1.6 | 3A991 | 1 | 1 | 32 | 32 | Yes | 2 | Single | 10 | 1 | No | No | 1MB | 4KB |
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CY8C4248LQI-BL473 Cypress Semiconductor Corp
256KB 256K x 8 FLASH ARM® Cortex®-M0 32-Bit Microcontroller PSOC® 4 CY8C4xx8 BLE Series 3.3V 56-UFQFN Exposed Pad
Price: 0.0000
RFQ -
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LM3S1B21-IBZ80-C5T Texas Instruments
256KB 256K x 8 FLASH ARM® Cortex®-M3 32-Bit Microcontroller Stellaris® ARM® Cortex®-M3S 1000 Series LM3S1B21 108 Pin 80MHz 3.3V 108-LFBGA
Price: 0.0000
RFQ -
MCF5206FT16A NXP USA Inc.
ROMless Coldfire V2 32-Bit Microcontroller MCF520x Series MCF5206 160-BQFP
Price: 0.0000
RFQ -
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W78E054B40PL Nuvoton Technology Corporation of America
16KB 16K x 8 FLASH 8051 8-Bit Microcontroller W78 Series 44 Pin 40MHz 44-LCC (J-Lead)
Price: 0.0000
RFQ -
CY8C3446LTI-072 Cypress Semiconductor Corp
64KB 64K x 8 FLASH 8051 8-Bit Microcontroller PSOC® 3 CY8C34xx Series CY8C3446 50MHz 3.3V 68-VFQFN Exposed Pad
Price: 0.0000
RFQ -
S9KEAZN16ACLC NXP USA Inc.
16KB 16K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller Kinetis KEA Series 3V 32-LQFP
Price: 0.0000
RFQ -
MC68HC11E1CFNE3 NXP USA Inc.
ROMless 8-Bit Microcontroller HC11 Series MC68HC11 5V 52-LCC (J-Lead)
Price: 0.0000
RFQ -
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