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Integrated Circuits (ICs)

Integrated Circuits (ICs)


Integrated circuits, often referred to as ICs or microchips, are miniature electronic circuits that contain thousands to billions of transistors, resistors, capacitors, and other electronic components on a small semiconductor material. ICs are the building blocks of modern electronics and are used in a vast array of devices and systems, ranging from smartphones and computers to automotive electronics and medical devices. They provide compactness, high functionality, and improved performance by integrating multiple electronic functions onto a single chip.

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Number of Terminations Max Operating Temperature Min Operating Temperature Operating Supply Voltage Number of Ports Length RoHS Status Lead Free Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage REACH SVHC Min Supply Voltage Density Width Technology Operating Mode Input Type Height Seated (Max) Number of Functions Max Input Voltage Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Pin Count Output Type Temperature Grade Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Operating Temperature (Max) Operating Temperature (Min) Number of Channels Subcategory Qualification Status Supply Voltage-Max (Vsup) Number of Elements Number of Outputs Voltage - Output Polarity Logic IC Type Number of Circuits Dropout Voltage Current - Output Load Capacitance Min Input Voltage Power Dissipation Propagation Delay Watchdog Timer Max Dual Supply Voltage Min Dual Supply Voltage Output Characteristics Propagation Delay (tpd) Quiescent Current Logic Function High Level Output Current Low Level Output Current Frequency (Max) Memory Type Number of Bits Nominal Output Voltage Organization Memory Width Voltage Gain Data Bus Width Family Max I(ol) Count Direction Prop. Delay@Nom-Sup Control Type Page Size Ihs Manufacturer: JESD-30 Code: JESD-609 Code: Manufacturer Part Number: Manufacturer: Number of Terminals: Package Body Material: Package Description: Package Shape: Package Style: Part Life Cycle Code: Peak Reflow Temperature (Cel): Reach Compliance Code: Risk Rank: Rohs Code: Surface Mount: Terminal Finish: Terminal Form: Terminal Position: ECCN Code: Lead Shape Maximum Operating Temperature (°C) Minimum Operating Temperature (°C) Mounting Package Height Package Length Package Width PCB changed Standard Package Name Supplier Package Typical Operating Supply Voltage (V) Maximum Operating Supply Voltage (V) Minimum Operating Supply Voltage (V) ECCN (US) Supplier Temperature Grade Configuration: Number of Elements: Number of Elements per Chip Process Technology Logic Family Number of Element Inputs Number of Element Outputs Maximum Propagation Delay Time @ Maximum CL (ns) Absolute Propagation Delay Time (ns) Maximum Low Level Output Current (mA) Maximum High Level Output Current (mA) Maximum Quiescent Current (uA) Propagation Delay Test Condition (pF) Typical Quiescent Current (uA)
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TMPR3912AU-92(PDZ) TMPR3912AU-92(PDZ) Toshiba 0.0000
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0.00000000 TOSHIBA CORP R-PSFM-T3 e0 2SB673 Toshiba America Electronic Components 3 PLASTIC/EPOXY FLANGE MOUNT, R-PSFM-T3 RECTANGULAR FLANGE MOUNT Obsolete NOT SPECIFIED unknown 8.75 No NO Tin/Lead (Sn/Pb) THROUGH-HOLE SINGLE EAR99 DARLINGTON WITH BUILT-IN DIODE AND RESISTOR 1
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