Items : %s%s
Telecom Interface ICs
Applications
- ATM;SDH;SONET
- SDH
- SONET;SDH
Contact Plating
- Copper, Silver, Tin
- Copper, Tin
- Lead, Tin
- Tin
ECCN Code
- 5A002.A.2
- 5A991
- 5A991.B.1
- 5A991.C
- 5A992.C
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 28 Weeks
- 3 Weeks
- 33 Weeks
- 35 Weeks
- 39 Weeks
- 4 Weeks
- 5 Weeks
- 52 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e2
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- IN PRODUCTION (Last Updated: 1 month ago)
- IN PRODUCTION (Last Updated: 2 weeks ago)
- IN PRODUCTION (Last Updated: 3 weeks ago)
- IN PRODUCTION (Last Updated: 4 weeks ago)
- LIMITED TIME BUY (Last Updated: 1 month ago)
- LIMITED TIME BUY (Last Updated: 3 weeks ago)
- NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago)
- NRND (Last Updated: 6 months ago)
- NRND (Last Updated: 7 months ago)
- NRND (Last Updated: 8 months ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 6 days ago)
Max Operating Temperature
- 100°C
- 105°C
- 110°C
- 125°C
- 60°C
- 70°C
- 75°C
- 80°C
- 85°C
- 90°C
Min Operating Temperature
- -20°C
- -25°C
- -35°C
- -40°C
- -45°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 4 (72 Hours)
- 5 (48 Hours)
- 6 (Time on Label)
- Not Applicable
- NOT SPECIFIED
- Vendor Undefined
Mount
- Base
- Box
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 10
- 100
- 11
- 119
- 120
- 121
- 128
- 14
- 144
- 1517
- 16
- 160
- 176
- 18
- 196
- 20
- 208
- 217
- 22
- 220
- 225
- 24
- 256
- 272
- 28
- 289
- 30
- 300
- 304
- 316
- 32
- 324
- 329
- 344
- 349
- 36
- 365
- 38
- 40
- 400
- 416
- 42
- 420
- 44
- 444
- 48
- 484
- 49
- 52
- 520
- 535
- 552
- 56
- 6
- 60
- 64
- 640
- 672
- 676
- 68
- 8
- 80
- 81
- 84
- 9
Number of Terminals
- 100
- 128
- 22
- 225
- 44
Number of Terminations
- 10
- 100
- 1152
- 120
- 121
- 128
- 138
- 14
- 144
- 16
- 160
- 17
- 176
- 18
- 195
- 196
- 20
- 208
- 217
- 22
- 220
- 225
- 24
- 256
- 26
- 272
- 276
- 28
- 289
- 292
- 300
- 304
- 316
- 32
- 324
- 344
- 349
- 36
- 365
- 38
- 40
- 400
- 416
- 42
- 420
- 44
- 444
- 48
- 480
- 484
- 49
- 500
- 52
- 53
- 535
- 552
- 56
- 568
- 60
- 625
- 64
- 640
- 672
- 676
- 68
- 8
- 80
- 81
- 84
Operating Temperature
- -10°C~60°C
- -10°C~70°C
- -10°C~75°C
- -15°C~60°C
- -20°C~60°C
- -20°C~70°C
- -20°C~85°C
- -25°C~100°C
- -25°C~125°C
- -25°C~70°C
- -25°C~75°C
- -25°C~80°C
- -25°C~85°C
- -30°C~85°C
- -35°C~60°C
- -40°C ~ 85°C
- -40°C~105°C
- -40°C~110°C
- -40°C~125°C
- -40°C~65°C
- -40°C~70°C
- -40°C~75°C
- -40°C~80°C
- -40°C~85°C
- -45°C~85°C
- -55°C~125°C
- -5°C~90°C
- 0°C~110°C
- 0°C~125°C
- 0°C~50°C
- 0°C~70°C
- 0°C~75°C
- 0°C~85°C
- 0°C~85°C TJ
Package / Case
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-VFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 100
- 100-BQFP
- 100-LBGA
- 100-LBGA, CSBGA
- 100-LFBGA, CSPBGA
- 100-LQFP
- 100-QFP
- 100-TQFP Exposed Pad
- 1020-BGA
- 1024-BGA
- 1152-BGA
- 119-WFBGA, WLBGA
- 120-BGA
- 120-LQFP
- 121-LFBGA
- 128-BFQFP
- 128-LQFP
- 128-LQFP Exposed Pad
- 128-QFP
- 128-TQFP
- 1369-BGA
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 144-BBGA
- 144-BGA
- 144-BGA, CSPBGA
- 144-LBGA
- 144-LQFP
- 144-LQFP Exposed Pad
- 1517-BBGA
- 16-DIP (0.300, 7.62mm)
- 16-LSSOP (0.173, 4.40mm Width)
- 16-QFN
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.154, 3.90mm Width) Exposed Pad
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-TQFN Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width)
- 16-VDFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VQFN Exposed Pad
- 160-BGA
- 160-BQFP
- 160-LBGA
- 160-LQFP
- 164-QFN
- 176-LBGA
- 176-LQFP
- 18-DIP (0.300, 7.62mm)
- 18-DIP Module (0.850, 21.59mm), 11 Leads
- 18-DIP Module (0.850, 21.59mm), 9 Leads
- 18-SOIC (0.213, 5.40mm Width)
- 18-SOIC (0.295, 7.50mm Width)
- 195-BFBGA, FCBGA
- 196-BGA
- 196-LBGA
- 196-LBGA, FCBGA
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SOIC (0.433, 11.00mm Width) Exposed Pad
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-VFQFN Exposed Pad
- 208-BFQFP
- 208-BGA
- 208-LBGA
- 217-BBGA
- 217-BGA
- 22-DIP (0.400, 10.16mm)
- 220-BGA
- 220-LBGA
- 225-BGA
- 225-LFBGA
- 24-DIP (0.300, 7.62mm)
- 24-DIP (0.600, 15.24mm)
- 24-QFN
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-SSOP (0.209, 5.30mm Width)
- 24-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 244-BBGA, FCBGA
- 256-BBGA, FCBGA
- 256-BGA
- 256-LBGA
- 256-LBGA Exposed Pad
- 256-LBGA, CSBGA
- 256-LQFP
- 272-BBGA
- 272-BGA
- 28-BSOJ (0.300, 7.62mm Width)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-QFN
- 28-SOIC (0.295, 7.50mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-VDFN Exposed Pad
- 28-VFQFN
- 28-VFQFN Exposed Pad
- 289-LFBGA
- 300-BBGA
- 302-TQFP
- 304-BBGA
- 304-LBGA
- 316-BGA
- 316-LBGA
- 32-LCC (J-Lead)
- 32-LQFP
- 32-QFN
- 32-SOIC (0.295, 7.50mm Width)
- 32-TFQFN Exposed Pad
- 32-TQFP
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 323-BBGA, FCBGA
- 324-BGA
- 324-FBGA
- 324-LBGA
- 329-FBGA
- 344-BBGA
- 349-BBGA, CSBGA Exposed Pad
- 349-BGA Exposed Pad
- 36-BSOP (0.295, 7.50mm Width)
- 36-FBGA
- 36-VFQFN Exposed Pad
- 38-QFN
- 38-TFSOP (0.173, 4.40mm Width)
- 38-VFQFN Exposed Pad
- 388-BBGA
- 40-DIP (0.600, 15.24mm)
- 40-VFQFN Exposed Pad
- 416-BGA
- 42-VFQFN Exposed Pad
- 42-WFQFN Exposed Pad
- 420-LBGA
- 44-BSOP (0.295, 7.50mm Width)
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 44-TQFP
- 44-TQFP Exposed Pad
- 48-BSSOP (0.295, 7.50mm Width)
- 48-LQFP
- 48-QFN
- 48-SSOP (0.295, 7.50mm Width)
- 48-TQFP
- 48-VFQFN Exposed Pad
- 48-VQFN Exposed Pad
- 484-BGA
- 484-LFBGA
- 49-LFBGA, CSPBGA
- 52-LQFP
- 535-BGA
- 552-BGA
- 56-VFQFN Exposed Pad
- 60-WFQFN Exposed Pad
- 64-FQFP
- 64-LQFP
- 64-QFP
- 64-TQFP
- 64-VFQFN Exposed Pad
- 640-BGA Exposed Pad
- 672-BGA
- 672-LBGA
- 676-BGA
- 68-LCC (J-Lead)
- 68-VFQFN Exposed Pad
- 8-DIP (0.300, 7.62mm)
- 8-ESOP (0.250, 6.35mm Width)
- 8-SMD, Gull Wing
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.154, 3.90mm Width) Exposed Pad
- 8-SOIC (0.173, 4.40mm Width)
- 80-LQFP
- 80-QFP
- 80-TFQFN Exposed Pad
- 81-LBGA
- 81-LFBGA
- 868-BGA
- 896-BGA
- BGA
- DIP
- FBGA
- FCBGA
- LCC
- LQFP
- PDIP
- PLCC
- PQFP
- QFN
- SOIC
- SSOP
- TQFP
- VQFN
Packaging
- *
- Bag
- Bulk
- Cut Tape (CT)
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- icon-pbfree no
- no
- yes
Power (Watts)
- 1.04W
- 1.11W
- 1.1W
- 1.37W
- 1.49W
- 1.4W
- 1.5W
- 1.69W
- 1.6W
- 1.73W
- 1.75W
- 10.5mW
- 10.5W
- 100mW
- 10mW
- 130mW
- 140mW
- 150mW
- 1mW
- 1W
- 2.045W
- 2.55W
- 2.57W
- 2.89W
- 250mW
- 25mW
- 280mW
- 290mW
- 2W
- 3.1W
- 3.5W
- 300mW
- 305mW
- 310mW
- 315mW
- 350mW
- 35mW
- 370mW
- 3W
- 400mW
- 450mW
- 454mW
- 500mW
- 50mW
- 520W
- 550mW
- 650mW
- 666mW
- 700mW
- 730mW
- 740mW
- 750mW
- 78.75mW
- 800mW
- 840mW
- 900mW
- 90mW
- 941mW
PSRR-Min
- 25 dB
- 27 dB
- 30 dB
- 40 dB
Published
- 1993
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
Resistance
- 100Ohm
- 10kOhm
- 110Ohm
- 14.5Ohm
- 15Ohm
- 25Ohm
- 35Ohm
- 50Ohm
Series
- Amazon
- ARCOFI®
- Automotive, AEC-Q100
- Caracal™ Lite
- Caracal™-1
- Caracal™-2
- Cybergate™
- DS
- DualFALC™
- DuSLIC
- E-StaX-III-28
- E-StaX-III-48
- E-StaX-III-68
- ELIC®
- EPIC®
- FALC™
- FlexiSLIC™
- HOTlink II™
- INCA™
- IPAC-X
- ISAC™
- ISOmodem®
- Jaguar™-1
- Jaguar™-2
- LITELINK®
- LITELINK® II
- LITELINK® III
- LMCMOS™
- LynX™-1
- LynX™-2
- MicroDAA™
- miSLIC™
- MT8976
- MT8977
- MV1442
- OctalFALC™
- OctalLIU™
- ProSLIC®
- Q-SMINT®
- QuadFALC™
- QuadLIU™
- RSLIC18
- SCOUT™
- SEROCCO™
- Serval™ Lite
- Serval™-1
- Serval™-2
- Serval™-2 Lite
- Serval™-T
- Serval™-TE
- Serval™-TE10
- SICOFI®
- SLIC™, DuSLIC™
- SOCRATES™
- SparX™-III-10
- SparX™-III-10um
- SparX™-III-11
- SparX™-III-17um
- SparX™-III-18
- SparX™-III-24
- SparX™-III-25um
- SparX™-III-26
- SparX™-IV-34
- SparX™-IV-44
- SparX™-IV-52
- SparX™-IV-80
- SparX™-IV-90
- SWITI
- T-SMINT®
- TE3-LIU™
- UniSLIC14
- VINETIC®
- Voice Edge™
- XWAY™TANTOS
Supplier Device Package
- 10-MSOP
- 100-CSBGA (10x10)
- 100-CSBGA (11x11)
- 100-LQFP (14x14)
- 100-MQFP (14x20)
- 100-TQFP (14x14)
- 120-LQFP (14x20)
- 120-PBGA (23x23)
- 121-LFBGA (10x10)
- 128-LQFP (14x14)
- 128-LQFP (14x20)
- 128-LQFP (20x14)
- 128-PQFP (14x20)
- 128-QFP
- 128-TQFP
- 128-TQFP (14x20)
- 1292-FCBGA
- 135-QFN (12x12)
- 138-QFN (12x12)
- 14-DIP
- 14-SOIC
- 144-BGA
- 144-BGA (13x13)
- 144-LBGA
- 144-LBGA (13x13)
- 144-LQFP (15x15)
- 144-LQFP (20x20)
- 144-LQFP-EP (20x20)
- 144-PBGA (17x17)
- 144-TECSBGA (13x13)
- 16-MLP (7x6)
- 16-PDIP
- 16-QFN
- 16-QFN (4x4)
- 16-SOIC
- 16-SOP
- 16-SSOP-B
- 164-QFN (13x13)
- 176-LQFP
- 18-DIP
- 18-PDIP
- 18-SOIC
- 18-SOP
- 196-BGA
- 196-CABGA (15x15)
- 196-FBGA (15x15)
- 196-FCBGA (15x15)
- 196-PBGA (15x15)
- 20-DIP
- 20-PDIP
- 20-PLCC (9x9)
- 20-QFN (4x4)
- 20-SOIC
- 20-SSOP
- 20-TSSOP
- 208-PBGA (17x17)
- 208-PQFP (28x28)
- 217-BGA (23x23)
- 22-DIP
- 225-BGA (19x19)
- 24-PDIP
- 24-QFN
- 24-QFN (6x6)
- 24-QFNJ (4x4)
- 24-SO
- 24-SOP
- 24-SSOP
- 24-VSOP
- 244-FCBGA (17x17)
- 256-BGA
- 256-BGA (17x17)
- 256-BGA (27x27)
- 256-CABGA (17x17)
- 256-CSBGA (17x17)
- 256-FBGA (17x17)
- 256-FCBGA (17x17)
- 256-FPBGA (17x17)
- 256-LQFP (28x28)
- 256-MQFP (28x28)
- 256-PBGA (17x17)
- 272-BGA (27x27)
- 272-PBGA (27x27)
- 28-DFN
- 28-PDIP
- 28-PLCC
- 28-PLCC (11.51x11.51)
- 28-QFN
- 28-QFN (4x5)
- 28-SO
- 28-SOIC
- 28-SOJ
- 28-SOP
- 300-HBGA
- 300-PBGA (27x27)
- 302-TQFP (24x24)
- 304-PBGA (31x31)
- 32-PLCC (11.43x13.97)
- 32-QFN (5x5)
- 32-QFN (7x7)
- 32-QFN (8x8)
- 32-QFN-EP (5x5)
- 32-SOIC
- 32-TQFP (7x7)
- 323-FCLBGA
- 324-BGA (19x19)
- 324-PBGA (23x23)
- 329-FPBGA (17x17)
- 344-PBGA (27x27)
- 38-QFN (5x7)
- 38-TSSOP
- 388-BGA (35x35)
- 40-PDIP
- 40-QFN
- 400-PBGA (27x27)
- 42-PDIP
- 42-QFN (5x7)
- 44-eLQFP
- 44-MQFP (10x10)
- 44-PLCC
- 44-PLCC (16.51x16.51)
- 44-PLCC (16.58x16.58)
- 44-PLCC (16.59x16.59)
- 44-QCC
- 44-QFN (7x7)
- 44-SSO
- 44-TQFP
- 44-TQFP (10x10)
- 44-TQFP-EP (10x10)
- 444-BGA (27x27)
- 48-eTQFP
- 48-LQFP
- 48-LQFP (7x7)
- 48-QFN
- 48-QFN (5x9)
- 48-QFN (6x6)
- 48-QFN (7x7)
- 48-SSOP
- 48-VQFN (7x7)
- 484-BGA (27x27)
- 49-CSBGA (7x7)
- 50-QFN (6x8)
- 52-TQFP (10x10)
- 535-PBGA (31x31)
- 552-PBGA (35x35)
- 56-QFN (8x8)
- 64-eTQFP
- 64-LQFP
- 64-LQFP (10x10)
- 64-LQFP (14x14)
- 64-QFN
- 64-TQFP
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 640-TEPBGA (31x31)
- 672-FCBGA (27x27)
- 672-HSBGA (27x27)
- 68-PLCC (24.23x24.23)
- 68-QFN (8x8)
- 69-BGA
- 8-DIP
- 8-Flatpack
- 8-PDIP
- 8-SMD
- 8-SOIC
- 8-SOP
- 80-eLQFP
- 80-LQFP (12x12)
- 80-MQFP (14x14)
- 80-TQFP (14x14)
- 868-BGA
- 896-FCBGA
- 896-FCBGA (31x31)
- P-DSO-20-5
- P-DSO-28
- P-DSO-36-15
- P-LBGA-256
- P-LBGA-324
- P-LCC-44
- P-LCC-44-1
- P-MQFP-100
- P-MQFP-44
- P-MQFP-44-1
- P-MQFP-64
- P-MQFP-64-1
- P-MQFP-64-9
- P-TQFP-100
- P-TQFP-144
- P-TQFP-144-6
- P-TQFP-64
- P/PG-LBGA-160-1
- P/PG-LCC-28
- PG-DSO-24
- PG-LBGA-144
- PG-LBGA-176
- PG-LBGA-256
- PG-LBGA-324-2
- PG-LBGA-324-3
- PG-LQFP-176
- PG-VQFN-48-4
- PG-WFWLB-119-1
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Copper (Sn/Cu)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
- TIN/TIN COPPER
Termination
- Gull Wing
- SMD/SMT
Transistor Element Material
- SILICON
Type
- Integrated Circuit (IC)
Weight
- 1.053808g
- 1.098005g
- 1.182714g
- 1.270087g
- 1.319103g
- 1.620005g
- 1.833392g
- 100.952652mg
- 117.310327mg
- 129.387224mg
- 130.010913mg
- 140.160042mg
- 140.30179mg
- 141.690917mg
- 143.193441mg
- 150.507618mg
- 152.066842mg
- 181.692094mg
- 188.609377mg
- 189.233067mg
- 189.318115mg
- 189.403164mg
- 189.431514mg
- 2.214806g
- 2.259996g
- 2.386605g
- 2.784008g
- 220.105698mg
- 252.254057mg
- 252.565902mg
- 342.689036mg
- 356.09836mg
- 360.605934mg
- 4.190003g
- 453.59237mg
- 50.008559mg
- 503.487531mg
- 506.605978mg
- 540.001716mg
- 547.485991mg
- 600.301152mg
- 639.990485mg
- 665.986997mg
- 67.301768mg
- 72.801575mg
- 723.394782mg
- 76.997305mg
- 766.089163mg
- 77.592645mg
- 792.000628mg
- 800.987426mg
- 86.749541mg
- 9.071791g
- 927.99329mg
- 930.006106mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Frequency | Height | Width | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Current - Supply | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Operating Temperature (Max) | Operating Temperature (Min) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Max Power Dissipation | Number of Circuits | Data Rate | Supplier Device Package | Core Architecture | Logic Function | Function | Telecom IC Type | Voltage - Supply | Number of D/A Converters | Number of Transmitters | Neg Supply Voltage-Nom | Filter | Companding Law | Linear Coding |
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.png "LE9520SDDTC") |
LE9520SDDTC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | Parallel | 40mA | 1 | Subscriber Line Interface Concept (SLIC) | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PM5308-FGI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | JTAG, Microprocessor, Parallel, Serial | 1 | SONET/SDH | 1.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT3270BE1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole | Tube | 2007 | yes | Obsolete | 1 (Unlimited) | 8 | 5V | 9.59mm | ROHS3 Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | Parallel | 4.19MHz | 7.62mm | Through Hole | 930.006106mg | -40°C~85°C | 3mA | 5.33mm | e3 | MATTE TIN | DUAL | 260 | 5V | 30 | 2.54mm | Telecom Signaling Circuits | 5V | 500mW | 1 | Receiver | DTMF Receiver | DTMF SIGNALING CIRCUIT | 4.75V~5.25V | ||||||||||||||||||||||||||||||||||||||
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LE58QL02FJCT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | Surface Mount | Tape & Reel (TR) | 1993 | Active | 3 (168 Hours) | 44 | 3.3V | 16.5862mm | ROHS3 Compliant | 44 | IT ALSO OPERATES WITH 3.3V ANALOG SUPPLY VOLTAGE | 44-LCC (J-Lead) | PCM | 16.5862mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | e3 | MATTE TIN | QUAD | J BEND | 3.3V | 1.27mm | Codecs | Not Qualified | 4 | Subscriber Line Interface Concept (SLIC) | YES | A/MU-LAW | 16-BIT | ||||||||||||||||||||||||||||||||||||||||||
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MT8960AE1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | yes | Obsolete | 1 (Unlimited) | 18 | 5V | 22.86mm | ROHS3 Compliant | No | 18 | 18-DIP (0.300, 7.62mm) | PCM | 7.62mm | Through Hole | 0°C~70°C | CMOS | 3mA | 5.33mm | e3 | MATTE TIN | DUAL | 5V | 2.54mm | PCM CODEC | 4.75V~5.25V | 1 | -5V | YES | MU-LAW | |||||||||||||||||||||||||||||||||||||||||||||
 |
VSC7420XJQ-04 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | 2017 | SparX™-III-10um | Active | 4 (72 Hours) | 125°C | -40°C | ROHS3 Compliant | TQFP | Serial | Surface Mount | 1 | 1 Gbps | 302-TQFP (24x24) | Ethernet Switch | 1V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE9530DETC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tube | Active | 3 (168 Hours) | 48 | 85°C | -40°C | 3.3V | 7mm | ROHS3 Compliant | Lead Free | 48 | TQFP | Parallel | 7mm | Surface Mount | 40mA | QUAD | GULL WING | 3.3V | INDUSTRIAL | 0.5mm | 1 | 2 | 48-eTQFP | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE79Q2284MVC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tray | 1993 | Active | 3 (168 Hours) | 85°C | -40°C | 3.3V | ROHS3 Compliant | Tin | 80 | 80-LQFP | PCM | 3.465V | Surface Mount | -40°C~85°C | 4 | 80-LQFP (12x12) | ISLAC DEVICE | 3.3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT88E39ASR1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2006 | yes | Active | 3 (168 Hours) | 16 | ROHS3 Compliant | IT CAN ALSO OPERATE WITH 5V NOMINAL VOLTAGE | 16-SOIC (0.295, 7.50mm Width) | 3-Wire | 7.5mm | Surface Mount | -40°C~85°C | CMOS | 1.9mA | 2.65mm | e3 | MATTE TIN | DUAL | GULL WING | 260 | 3V | 30 | YES | Not Qualified | 1 | Telecom Circuit | TELEPHONE CALLING NO IDENTIFICATION CIRCUIT | 2.7V~5.5V | |||||||||||||||||||||||||||||||||||||||||||||
 |
MT8920BP1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2006 | yes | Obsolete | 3 (168 Hours) | 28 | 5V | 12.57mm | ROHS3 Compliant | No | 28 | 28-LCC (J-Lead) | Parallel | 4.57mm | 12.57mm | Surface Mount | 1.182714g | -40°C~85°C | CMOS | 10μA | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 30 | 1 | Telecom Circuit | 4.75V~5.25V | |||||||||||||||||||||||||||||||||||||||||||
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MT8952BPR1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | No | 28 | 28-LCC (J-Lead) | Surface Mount | -40°C~85°C | 1μA | 1μA | 1 | 28-PLCC | Controller | 4.75V~5.25V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PM4329-FXI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Active | 3 (168 Hours) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE58QL021FJC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tube | 1993 | Active | 3 (168 Hours) | 85°C | -40°C | 3.3V | ROHS3 Compliant | 44 | 44-LCC (J-Lead) | PCM | 3.135V | Surface Mount | -40°C~85°C | 4 | 44-PLCC (16.58x16.58) | Subscriber Line Interface Concept (SLIC) | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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ZL50112GAG2 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2009 | Active | 3 (168 Hours) | 552 | 1.8V | 35mm | ROHS3 Compliant | No | 552 | 552-BGA | TDM | 35mm | Surface Mount | -40°C~85°C | 950mA | 2.53mm | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1.8V | ZL50112 | Other Telecom ICs | 1 | 1 Gbps | Telecom Circuit | 1.65V~1.95V | |||||||||||||||||||||||||||||||||||||||||||||
 |
VSC7111XJW | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Tray | 2012 | Active | 3 (168 Hours) | 32 | 2.5V | 5mm | ROHS3 Compliant | 32 | 32-TFQFN Exposed Pad | 5mm | Surface Mount | 0.9mm | QUAD | NO LEAD | 2.5V | INDUSTRIAL | YES | 0.5mm | 85°C | -40°C | Other Telecom ICs | Not Qualified | 2 | 11.5 Gbps | Signal Conditioner | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||
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LE9540CUQCT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tape & Reel (TR) | Active | 3 (168 Hours) | 40 | 3.3V | 6mm | ROHS3 Compliant | No | QFN | Serial | 6mm | Surface Mount | 1mm | QUAD | 3.3V | INDUSTRIAL | 0.5mm | S-XQCC-N40 | 85°C | -40°C | 2 | 40-QFN | Subscriber Line Interface Concept (SLIC) | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
KSZ8381Q | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | Active | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | 128 | 128-BFQFP | LCD | Surface Mount | 0°C~70°C | KSZ8381 | 1 | 128-PQFP (14x20) | RISC | Telecom Circuit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
VSC7432YIH-01 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) | 2016 | E-StaX-III-48 | Not For New Designs | 3 (168 Hours) | 672 | ROHS3 Compliant | 8542.39.00.01 | 1 | BOTTOM | BALL | YES | S-PBGA-B672 | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
PM5309-FEI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tray | Active | 3 (168 Hours) | 500 | JTAG, Microprocessor, Parallel, Serial | compliant | BOTTOM | BALL | 1.2V | YES | S-PBGA-B500 | 1 | SONET/SDH | 1.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PM5397-FGI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Active | 3 (168 Hours) | 3.3V | ROHS3 Compliant | 896-BGA | GMII, SerDes | Surface Mount | -40°C~85°C | 2 | 896-FCBGA | Ethernet, SONET/SDH | 1.8V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE79234KVC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | ROHS3 Compliant | No | 128-TQFP | 2-Wire | Surface Mount | 128-TQFP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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ZL81000GGG2 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Active | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE87614MQCT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 28 | 5mm | ROHS3 Compliant | 4mm | 1mm | 1 | QUAD | NO LEAD | 12V | OTHER | YES | 0.5mm | R-XQCC-N28 | 85°C | SLIC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE58QL021BVC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Tray | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | Lead Free | Tin | No | 44 | 44-TQFP | PCM | 5V | 3.3V | Surface Mount | -40°C~85°C | 4 | 44-TQFP (10x10) | Subscriber Line Interface Concept (SLIC) | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT8962AE1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tube | 2008 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 20-DIP (0.300, 7.62mm) | PCM | Through Hole | 0°C~70°C | 3mA | 1 | 20-PDIP | PCM CODEC | 4.75V~5.25V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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VSC8489YJU-01 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | LIMITED TIME BUY (Last Updated: 1 month ago) | 2016 | Obsolete | 1 (Unlimited) | 196 | 15mm | ROHS3 Compliant | 196-BGA | SPI | 15mm | Surface Mount | -40°C~110°C | 1.4mm | BOTTOM | BALL | 1V | YES | 1mm | S-PBGA-B196 | 2 | Ethernet | 1V 1.2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
ZL50058GAG2 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Surface Mount | Tray | 2007 | Obsolete | 3 (168 Hours) | 256 | 48 | ROHS3 Compliant | No | 256 | 256-BGA | Surface Mount | -40°C~85°C | 240mA | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1.8V | ZL50058 | 1 | Switch | 1.71V~1.89V | |||||||||||||||||||||||||||||||||||||||||||||||||||
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MT9075BPR1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | yes | Active | 1 (Unlimited) | 24.23mm | ROHS3 Compliant | No | 68 | 68-LCC (J-Lead) | 24.23mm | Surface Mount | -40°C~85°C | CMOS | 150mA | 150mA | 4.57mm | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 30 | Other Telecom ICs | 5V | 2.048 Mbps | Transceiver | FRAMER | 4.75V~5.25V | 1 | |||||||||||||||||||||||||||||||||||||||||||
|
PM5336B-FGI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 20 Weeks | 2006 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PM5389-FGI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 520 | Serial | Surface Mount | 1 | 672-FCBGA (27x27) | SONET/SDH |
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LE58QL02FJCT Microchip Technology
44 Terminations3.3V 44 Pin Telecom device4 Circuits
Price: 0.0000
RFQ -
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LE9530DETC Microchip Technology
48 Terminations3.3V 48 Pin Telecom device2 Circuits
Price: 0.0000
RFQ -
LE79Q2284MVC Microchip Technology
3.3V 80 Pin Telecom device4 CircuitsMax 3.465V V
Price: 0.0000
RFQ -
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LE58QL021FJC Microchip Technology
3.3V 44 Pin Telecom device4 CircuitsMin 3.135V V
Price: 0.0000
RFQ -
ZL50112GAG2 Microchip Technology
552 Terminations1.8V 552 Pin ZL50112 Telecom device1 Circuits
Price: 0.0000
RFQ -
VSC7111XJW Microchip Technology
32 Terminations2.5V 32 Pin Telecom device2 Circuits
Price: 0.0000
RFQ -
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LE58QL021BVC Microchip Technology
44 Pin Telecom device4 CircuitsMin 3.3V VMax 5V V
Price: 0.0000
RFQ -
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ZL50058GAG2 Microchip Technology
256 Terminations256 Pin ZL50058 Telecom device1 Circuits
Price: 0.0000
RFQ -
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