Items : %s%s
Special Purpose Analog Switches
Additional Feature
- 16 X 8 ARRAY
- 2-PORT DEVICE
- 4 X 1 ARRAY
- 8 X 4 ARRAY
- ALSO OPERATE AT 5V SUPPLY
- ALSO OPERATE WITH 2.7V TO 5V SINGLE SUPPLY
- ALSO OPERATE WITH 5V SINGLE SUPPLY
- ALSO OPERATES AT 5V SUPPLY
- ALSO OPERATES WITH 6V TO 11V SINGLE SUPPLY AND +/-5V SUPPLY
- ALSO REQUIRES 3.0 TO 3.6
- ALSO REQUIRES 5V NEGATIVE SUPPLY
- ALSO REQUIRES VPP (40V TO 110V) AND VNN (-10V TO VPP-220V) SUPPLY
- ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY
- ALSO REQUIRES VPP (40V TO VNN +250V) AND VNN (-40V TO -210V) SUPPLY
- BUILT-IN AUDIO SWITCH
- CAN ALSO BE OPERATED AT +/-5 VOLT SUPPLY FOR VIDEO APPLICATIONS
- CAN ALSO BE OPERATED FROM 4.5 TO 5.5V
- CAN ALSO OPERATE WITH 4.5V AND 12V SINGLE SUPPLY
- CAN ALSO OPERATE WITH 5 V SUPPLY
- CAN ALSO OPERATE WITH 5V SINGLE SUPPLY
- CAN ALSO OPERATE WITH 5V SUPPLY
- CAN ALSO OPERATE WITH SINGLE 5V SUPPLY
- CONFIGURABLE AS +/-15V VCC
- IT ALSO OPERATES AT 2.5 AND 3.3
- IT ALSO OPERATES AT 4.5 TO 5.5
- IT ALSO REQUIRES 5V
- IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY
- IT CAN ALSO OPERATE WITH 5 V SUPPLY
- MUX/DMUX SWITCH
- SBG IS SPDT
- SELECTABLE DUAL 4-CHANNEL
- SINGLE T-SWITCH
- SPDT
- SPST
- SUPPLY VOLTAGE CAN ALSO OPERATE WITH 1.8V TO 5.5V
- VIDEO APPLICATION
Applications
- Analog
- Audio
- Audio, Telecommunications, USB, Video
- Audio, Telecommunications, Video
- Audio, UART, USB
- Audio, USB
- Audio, USB, Video
- Audio, Video
- Backplane
- Backplane, Cable Interconnect
- Backplane, PCIe, Telecommunications, Video
- Backplane, Telecommunications, Video
- Controller
- DDR3/DDR4
- Detection
- Detection, Video
- DisplayPort
- DisplayPort, PCIe
- DisplayPort, PCIe, USB
- DisplayPort, PCIe, USB, Video
- DisplayPort, PCIe, Video
- Force Sense
- HDMI
- High Temperature
- I2C
- I2C, Networking
- I2C, USB
- Isolation
- JTAG
- LVDS
- Memory
- MIPI
- Networking
- Networking, Telecommunications
- PCI Express®
- PCIe 4.0, USB
- Telecommunications
- Telecommunications, Ultrasound
- Telecommunications, Video
- Thunderbolt
- UART, USB
- Ultrasound
- Ultrasound, Video
- USB
- USB, Telecommunications
- USB, UART
- USB, Video
- VGA Connector
- Video
Contact Plating
- Copper, Silver, Tin
- Copper, Tin
- Gold
- Tin
ECCN Code
- 3A001.A.3
- 3A991.A.3
- 3A991.C.2
- 5A991
- 5A991.B
- 5A991.G
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 29 Weeks
- 3 Weeks
- 30 Weeks
- 32 Weeks
- 36 Weeks
- 38 Weeks
- 39 Weeks
- 4 Weeks
- 5 Weeks
- 51 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
Feature
- 10/100 Base-T
- 10/100 Base-T, LAN
- 10/100,1000 Base-T, LVDS, LVPECL
- 10/100/1000 Base-T
- 10/100/1000 Base-T, LAN, LED
- 10/100/1000, Bi-Directional, LAN
- 1000 Base-T, Bi-Directional, Differential Switching, LAN
- Advanced Signal Equalization
- Bi-Directional
- Bi-Directional, Break-Before-Make, T-Switch Configuration
- Bi-Directional, Buffered, T-Switch Configuration
- Bi-Directional, DDC, HSYNC, RGB, VSYNC
- Bi-Directional, HDMI
- Bi-Directional, LAN
- Bi-Directional, RGB
- Bi-Directional, SATA
- Bi-Directional, SATA, USB 2.0, USB 3.0
- Bi-Directional, SATA, USB 3.0
- Bi-Directional, T-Switch Configuration
- Bi-Directional, USB 2.0
- Bi-Directional, USB 3.0
- Bi-Directional, USB 3.0, USB 3.1
- Bi-Directional, USB 3.1
- Break-Before-Make
- Break-Before-Make, Buffers, T-Switch Configuration
- Break-Before-Make, Clickless
- Break-Before-Make, Clickless, I2C
- Break-Before-Make, Clickless, SPI
- Break-Before-Make, Depop
- Break-Before-Make, I2C
- Break-Before-Make, I2C, T-Switch Configuration
- Break-Before-Make, RGB
- Break-Before-Make, SPI
- Break-Before-Make, SPI, T-Switch Configration
- Break-Before-Make, USB 1.1
- Break-Before-Make, USB 1.1, USB 2.0
- Break-Before-Make, USB 2.0
- Buffered
- Buffered, RGB
- Buffered, Serial Interface
- Buffered, SPI
- Buffers, I2C, RGB, SCART
- Buffers, RGB
- Buffers, RGB, SCART
- Charger Detection, ID Pass Switch, I2C, UART, USB 2.0
- Clickless, I2C
- Clickless, SPI
- Configurable
- CVBS, I2C, RGB
- CVBS, I2C, SCART
- DDC CLK, DDC DAT, HSYNC, RGB, VSYNC
- DDC, LVDS
- DDR2, DDR3, DDR4
- DDR3
- Depop
- Depop, I2C, USB 2.0
- Depop, USB 2.0
- Differential Compatibility
- Differential Compatibility, LAN, 1000 Base-T
- Diode Bridge, Programmable Bias Current
- DVI, HDMI
- E1, T1
- Equalization, RXAUI, SATA, XAUI
- Fault Protection
- Fault Protection, T-Switch Configuration
- Fault Protection, USB 2.0
- HDMI
- HDMI 2.0, USB 3.1
- HDMI, USB 2.0, USB 3.0
- HSYNC, RGB, VSYNC
- I2C
- I2C, ALC Output
- I2C, RGB
- I2C, UART, USB 2.0
- I2C, USB 2.0
- I2C, USB 3.1
- I2C, Voltage Divider
- Isolation
- LVDS, MIPI, USB 2.0
- LVDS, SATA
- Noise Reduction
- OVP
- Programmable Output
- RGB
- RGB, SCART
- RGB, T-Switch Configuration
- RXAUI, SATA, XAUI
- SAS/SATA
- SATA
- Serial Interface
- Shutdown, Disable
- SPI
- T-Switch Configuration
- T1/E1
- TMDS, HDMI, DVI, Buffered
- USB 2.0
- USB 2.0, USB 3.0
- USB 2.0, USB 3.1
- USB 3.0
- USB 3.1
HTS Code
- 8542.31.00.01
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e4
- e4
- e6
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 15 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 21 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 5 hours ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 7 months ago)
- ACTIVE, NOT REC (Last Updated: 3 days ago)
- CONSULT SALES OFFICE (Last Updated: 4 days ago)
- CONTACT ADI (Last Updated: 1 week ago)
- CONTACT ADI (Last Updated: 2 weeks ago)
- IN PRODUCTION (Last Updated: 1 month ago)
- IN PRODUCTION (Last Updated: 3 weeks ago)
- LAST SHIPMENTS (Last Updated: 1 day ago)
- LAST SHIPMENTS (Last Updated: 1 week ago)
- LAST SHIPMENTS (Last Updated: 2 days ago)
- LAST SHIPMENTS (Last Updated: 21 hours ago)
- LAST SHIPMENTS (Last Updated: 3 days ago)
- LAST SHIPMENTS (Last Updated: 4 days ago)
- LAST SHIPMENTS (Last Updated: 6 days ago)
- LIFETIME (Last Updated: 2 days ago)
- LIFETIME (Last Updated: 4 days ago)
- LIFETIME (Last Updated: 6 days ago)
- LIMITED TIME BUY (Last Updated: 1 month ago)
- NRND (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 1 day ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 3 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- OBSOLETE (Last Updated: 6 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
Manufacturer Package Identifier
- RSE (R-PUQFN-N10))
Max Operating Temperature
- 100°C
- 105°C
- 110°C
- 125°C
- 225°C
- 70°C
- 75°C
- 80°C
- 85°C
- 95°C
Min Operating Temperature
- -10°C
- -20°C
- -25°C
- -30°C
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 4 (72 Hours)
- Not Applicable
- Vendor Undefined
Mount
- Cable
- Standard
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 10
- 100
- 12
- 128
- 1397
- 14
- 144
- 16
- 176
- 18
- 196
- 20
- 208
- 24
- 25
- 26
- 272
- 28
- 30
- 304
- 32
- 356
- 36
- 364
- 388
- 40
- 42
- 44
- 48
- 484
- 50
- 52
- 54
- 56
- 596
- 6
- 64
- 676
- 69
- 72
- 736
- 78
- 8
- 80
- 9
Number of Terminations
- 10
- 100
- 1156
- 12
- 121
- 128
- 132
- 136
- 14
- 144
- 16
- 172
- 176
- 18
- 196
- 20
- 208
- 24
- 25
- 256
- 26
- 272
- 28
- 30
- 304
- 32
- 324
- 356
- 36
- 364
- 388
- 40
- 42
- 44
- 48
- 484
- 50
- 54
- 56
- 6
- 60
- 64
- 676
- 680
- 69
- 72
- 736
- 78
- 8
- 80
- 9
Operating Temperature
- -10°C~70°C TA
- -10°C~85°C TA
- -20°C~70°C TA
- -20°C~75°C TA
- -20°C~85°C
- -20°C~85°C TA
- -25°C~70°C TA
- -25°C~75°C TA
- -25°C~85°C TA
- -30°C~75°C TA
- -30°C~80°C TA
- -30°C~85°C TA
- -40°C~100°C TA
- -40°C~105°C
- -40°C~105°C TA
- -40°C~105°C TJ
- -40°C~110°C
- -40°C~110°C TA
- -40°C~125°C TA
- -40°C~70°C TA
- -40°C~80°C TA
- -40°C~85°C
- -40°C~85°C TA
- -55°C~125°C
- -55°C~125°C TA
- -55°C~225°C TA
- 0°C~105°C TA
- 0°C~70°C
- 0°C~70°C TA
- 0°C~75°C TA
- 0°C~85°C TA
- 0°C~90°C TJ
Package / Case
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-UFDFN
- 10-UFDFN Exposed Pad
- 10-UFLGA
- 10-UFQFN
- 10-UFQFN Exposed Pad
- 10-VFDFN Exposed Pad
- 10-WFBGA, CSPBGA
- 10-WFDFN
- 10-WFDFN Exposed Pad
- 10-WFQFN
- 10-WFQFN Exposed Pad
- 10-XFQFN
- 100-LBGA
- 100-LQFP
- 100-VFQFN Exposed Pad, CSP
- 11-UFBGA, CSPBGA
- 1156-BBGA, FCBGA
- 12-UFBGA, DSBGA
- 12-UFBGA, WLCSP
- 12-UFQFN
- 12-WFBGA, CSPBGA
- 12-WFBGA, WLBGA
- 12-WFBGA, WLCSP
- 12-WFDFN Exposed Pad
- 12-WFQFN
- 12-WFQFN Exposed Pad
- 12-XFBGA, DSBGA
- 121-TFBGA
- 128-LQFP
- 128-TQFP
- 132-TFBGA, CSPBGA
- 1397-BBGA
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-VFQFN Exposed Pad
- 14-WFDFN Exposed Pad
- 14-XFQFN Exposed Pad
- 144-LQFP
- 144-TQFP
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-LFCQFN Exposed Pad
- 16-LSSOP (0.154, 3.90mm Width)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.173, 4.40mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-SSOP (0.173, 4.40mm Width)
- 16-TFSOP (0.173, 4.40mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 16-UFBGA, DSBGA
- 16-UFBGA, WLCSP
- 16-UFDFN Exposed Pad
- 16-UFQFN
- 16-UFQFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VFQFN Exposed Pad, 16-MLF®
- 16-WFQFN Exposed Pad
- 16-WQFN Exposed Pad
- 16-XFQFN
- 16-XFQFN Exposed Pad
- 172-QFN Dual Rows, Exposed Pad
- 176-LQFP
- 176-LQFP Exposed Pad
- 18-CDIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 18-XFQFN Exposed Pad
- 196-BBGA, FCBGA
- 196-BGA
- 196-FCBGA
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.154, 3.90mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFBGA, WLCSP
- 20-UFQFN Exposed Pad
- 20-VFQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 20-XFBGA, DSBGA
- 208-BFQFP
- 208-BGA
- 24-SDIP (0.300, 7.62mm)
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-TFCQFN Exposed Pad
- 24-TSSOP (0.173, 4.40mm Width)
- 24-VFQFN Exposed Pad
- 24-VFQFN Exposed Pad, CSP
- 24-WFQFN Exposed Pad
- 24-XFQFN Exposed Pad
- 241-BBGA, FCBGA
- 25-UFBGA, DSBGA
- 25-UFBGA, WLCSP
- 25-WFBGA, WLBGA
- 256-BGA
- 272-BBGA
- 28-CDIP (0.600, 15.24mm)
- 28-DIP (0.600, 15.24mm)
- 28-LCC
- 28-LCC (J-Lead)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.154, 3.90mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-UQFN Exposed Pad
- 28-VFQFN Exposed Pad
- 28-WFQFN Exposed Pad
- 28-XFBGA, DSBGA
- 30-DMP
- 30-SDIP (0.400, 10.16mm)
- 30-UFBGA, WLCSP
- 30-WFQFN Exposed Pad
- 304-BGA Exposed Pad
- 32-TFCQFN Exposed Pad
- 32-TQFP
- 32-VFQFN Exposed Pad
- 32-VFQFN Exposed Pad, CSP
- 32-WFQFN Exposed Pad
- 356-BBGA
- 356-BBGA Exposed Pad
- 36-BSOP (0.295, 7.50mm Width)
- 36-LBGA, FCBGA
- 36-UFBGA, WLCSP
- 36-VFQFN Exposed Pad
- 36-WFQFN Exposed Pad
- 364-BGA
- 388-BBGA
- 40-DIP (0.600, 15.24mm)
- 40-VFBGA
- 40-WFQFN Exposed Pad
- 42-VFQFN Exposed Pad
- 42-WFQFN Exposed Pad
- 44-LCC
- 44-LCC (J-Lead)
- 44-WFQFN Exposed Pad
- 48-LFBGA
- 48-LQFP
- 48-TFBGA
- 48-TFSOP (0.173, 4.40mm Width)
- 48-TFSOP (0.240, 6.10mm Width)
- 48-TQFP
- 48-VFBGA
- 48-WFQFN Exposed Pad
- 484-BBGA
- 484-BBGA, FCBGA
- 50-TFBGA
- 50-VFBGA
- 52-WFQFN Exposed Pad
- 54-WFQFN Exposed Pad
- 56-VFQFN Exposed Pad
- 56-WFQFN Exposed Pad
- 596-BGA
- 60-WFQFN Exposed Pad
- 64-LQFP
- 64-TQFP Exposed Pad
- 64-VFBGA
- 64-VFLGA
- 64-VFQFN Exposed Pad
- 676-BGA
- 69-CBGA
- 69-FBGA
- 69-LBGA, FCBGA
- 72-VFQFN Exposed Pad, CSP
- 78-VFBGA
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.110, 2.80mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-UFLGA
- 8-UFQFN
- 8-VFSOP (0.091, 2.30mm Width)
- 8-VSSOP, 8-MSOP (0.110, 2.80mm Width)
- 8-WDFN Exposed Pad
- 8-WFDFN
- 8-WFDFN Exposed Pad
- 8-XFQFN
- 80-LQFP
- 80-QFP
- 80-TQFP Exposed Pad
- 9-UFBGA, WLCSP
- 9-WFBGA, CSPBGA
- BGA
- Die
- DIP
- FCBGA
- MSOP
- PLCC
- PQFP
- QFN
- QSOP
- SOIC
- SOP
- SOT-23-6
- SSOP
- TO-100-10 Metal Can
- TSSOP
- VQFN
Packaging
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Rail/Tube
- Strip
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 1.5Ohm
- 1.75mOhm
- 1.75Ohm
- 1.9Ohm
- 100mOhm
- 100Ohm
- 10Ohm
- 11.2Ohm
- 11.5Ohm
- 120Ohm
- 125Ohm
- 12Ohm
- 13Ohm
- 14Ohm
- 150Ohm
- 15Ohm
- 16Ohm
- 17.7Ohm
- 17Ohm
- 18Ohm
- 19Ohm
- 1Ohm
- 2.5Ohm
- 2.7Ohm
- 2.8Ohm
- 200mOhm
- 200Ohm
- 20mOhm
- 20Ohm
- 22Ohm
- 23Ohm
- 24Ohm
- 250Ohm
- 25Ohm
- 26Ohm
- 27Ohm
- 29Ohm
- 2Ohm
- 3.5Ohm
- 300mOhm
- 300Ohm
- 30Ohm
- 32Ohm
- 350mOhm
- 350Ohm
- 35Ohm
- 38Ohm
- 3Ohm
- 4.5Ohm
- 400mOhm
- 400Ohm
- 40Ohm
- 4Ohm
- 5.5Ohm
- 5.6Ohm
- 5.7Ohm
- 500Ohm
- 50Ohm
- 55Ohm
- 5Ohm
- 6.5Ohm
- 600MOhm
- 60Ohm
- 65Ohm
- 67Ohm
- 6Ohm
- 7.5Ohm
- 700Ohm
- 750mOhm
- 75Ohm
- 7Ohm
- 800mOhm
- 80Ohm
- 850mOhm
- 8Ohm
- 900mOhm
- 90Ohm
- 950mOhm
- 95Ohm
- 9Ohm
Series
- AnyRate®
- Automotive, ADI0012
- Automotive, AEC-Q100
- DisplayPort™
- ExpressLane™
- HTMOS™
- ispGDX2®
- ispGDX®
- NanoSwitch™
- Ocelot-8
- Ocelot™-10
- Ocelot™-10um
- Ocelot™-4um
- PCI Express® (PCIe)
- PCI Express®, TDP™
- PEX88000
- Precision Edge®
- ReDriver™
- TETHYS™
Supplier Device Package
- 10-MicroPak™
- 10-MSOP
- 10-QFN (1.8x1.4)
- 10-TDFN (3x3)
- 10-UMLP (1.8x1.4)
- 10-UQFN (1.8x1.4)
- 10-UTQFN (2.1x1.6)
- 10-XQFN (1.55x2)
- 1156-FBGA (35x35)
- 1156-FCBGA (35x35)
- 12-TDFN (3.5x3)
- 12-UQFN (1.7x2)
- 12-WLP
- 128-TQFP (14x14)
- 136-aQFN (10x10)
- 14-CDIP
- 14-DQFN (3x2.5)
- 14-PDIP
- 14-SOIC
- 14-TSSOP
- 16-CERDIP
- 16-CSMT (3x3)
- 16-DIP Side Brazed
- 16-DQFN (2.5x3.5)
- 16-MLF® (3x3)
- 16-PDIP
- 16-QSOP
- 16-SO
- 16-SOIC
- 16-SOP
- 16-TQFN (5x5)
- 16-TSSOP
- 16-UMLP (1.8x2.6)
- 16-VQFN (4x4)
- 16-WLCSP (1.78x1.78)
- 172-QFN
- 18-SOIC W
- 1924-FCBGA (45x45)
- 196-BGA
- 196-BGA (15x15)
- 196-FCBGA (15x15)
- 196-PBGA (15x15)
- 20-DIP
- 20-PDIP
- 20-PLCC (9x9)
- 20-QSOP
- 20-SOIC
- 20-SSOP
- 20-TSSOP
- 20-UMLP (4x3)
- 208-PBGA (17x17)
- 24-CSMT (4x4)
- 24-LFCSP-VQ (4x4)
- 24-QSOP
- 24-SDIP
- 24-TQFN (3x3)
- 24-TSSOP
- 25-DSBGA
- 28-CDIP
- 28-PLCC (11.51x11.51)
- 28-SOIC
- 28-SSOP
- 28-TQFN (5.5x3.5)
- 28-TQFN-EP (3.5x5.5)
- 30-PDIP
- 30-SDMP
- 30-SO
- 32-CSMT (5x5)
- 32-LFCSP-VQ (5x5)
- 32-MLF® (5x5)
- 32-QFN (5x5)
- 32-TQFN (3x6)
- 324-FCBGA (19x19)
- 324-HSBGA (19x19)
- 324-PBGA (19x19)
- 356-HPBGA (27x27)
- 356-PBGA (27x27)
- 36-FCBGA (7x7)
- 36-WLCSP (2.34x2.34)
- 388-FPBGA (23x23)
- 40-BQSOP
- 40-PDIP
- 40-TQFN (3x6)
- 42-HVQFN
- 42-TQFN (9x3.5)
- 42-TQFN-EP (3.5x9)
- 42-WQFN (3.5x9.0)
- 44-PLCC
- 48-BQSOP
- 48-LQFP
- 48-LQFP (7x7)
- 48-TFBGA (5x5)
- 48-TQFN (7x7)
- 48-TSSOP
- 484-FCBGA (23x23)
- 56-HWQFN
- 56-TQFN (11x5)
- 56-WQFN (5x11)
- 596-BGA (35x35)
- 676-BGA (27x27)
- 676-FCBGA (27x27)
- 680-FPBGA (35x35)
- 72-QFN (10x10)
- 757-BGA (40x40)
- 8-MicroPak™
- 8-PDIP
- 8-SOIC
- 8-TDFN-EP (3x3)
- 80-EPAD-TQFP (14x14)
- 80-QFH
- 80-QFH (14x20)
- 88-QFN (12x12)
- Die
- MP8
- SOT-23-6
Surface Mount
- NO
- YES
Terminal Finish
- GOLD
- GOLD (80) OVER NICKEL (50)
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Gold/Nickel (Au/Ni)
- MATTE TIN
- MATTE TIN (787)
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- MATTE TIN/NICKEL PALLADIUM GOLD
- Nickel (Ni)
- NICKEL PALLADIUM GOLD
- Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)
- Nickel/Palladium (Ni/Pd)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- NOT SPECIFIED
- TIN
- Tin (Sn)
- TIN COPPER
- TIN LEAD
- TIN SILVER COPPER
- Tin/Bismuth (Sn/Bi)
- Tin/Copper (Sn/Cu)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
- Solder
- Through Hole
USB
- USB 2.0
Weight
- 1.182714g
- 1.319103g
- 1.627801g
- 1.700971mg
- 1.899702g
- 10.007382mg
- 105.687022mg
- 110mg
- 112.5mg
- 120mg
- 122mg
- 123.490523mg
- 123mg
- 126mg
- 127.402757mg
- 13.155386mg
- 130.010913mg
- 141.690917mg
- 143.193441mg
- 143mg
- 173mg
- 18.08g
- 181.692094mg
- 188.609377mg
- 190.990737mg
- 191.387631mg
- 191mg
- 2.259996g
- 2.26799g
- 2.386605g
- 2.508989g
- 200.686274mg
- 204mg
- 206.29948mg
- 211.997734mg
- 212mg
- 218mg
- 223.195796mg
- 240.999296mg
- 25.2mg
- 25mg
- 26.109911mg
- 26.506804mg
- 26mg
- 288.002805mg
- 288mg
- 29.993795mg
- 30g
- 30mg
- 36.003894mg
- 37.194574mg
- 37.3333mg
- 39.292439mg
- 4.190003g
- 40mg
- 41.6mg
- 41.900595mg
- 42.013993mg
- 42.666666mg
- 453.59237mg
- 5.301361mg
- 50.008559mg
- 503.487531mg
- 54.601182mg
- 54.799628mg
- 547.485991mg
- 55.3mg
- 58.66667mg
- 6.54mg
- 6.5mg
- 61.887009mg
- 614.986205mg
- 639.990485mg
- 63mg
- 665.986997mg
- 7.002332mg
- 722.005655mg
- 723.394782mg
- 73.793809mg
- 73mg
- 74.502547mg
- 75.891673mg
- 76.997305mg
- 800.987426mg
- 9.071791g
- 9.49709mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Height | Width | Resistance | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Terminal Pitch | JESD-30 Code | Number of Channels | Subcategory | Qualification Status | Power Supplies | Max Power Dissipation | Number of Outputs | Feature | Polarity | Analog IC - Other Type | Throw Configuration | Data Rate | Applications | Power Dissipation | Output | Propagation Delay | Turn On Delay Time | Max Dual Supply Voltage | Min Dual Supply Voltage | Drain to Source Resistance | Neg Supply Voltage-Nom (Vsup) | On-State Resistance (Max) | Supplier Device Package | -3db Bandwidth | Turn-Off Delay Time | Quiescent Current | Logic Function | High Level Output Current | Dual Supply Voltage | Supply Current-Max | Supply Type | Number of Input Lines | Number of Output Lines | Switch-on Time-Max | Switch-off Time-Max | Normal Position | Off-state Isolation-Nom | On-state Resistance Match-Nom | Voltage - Supply, Single/Dual (±) | Switch Circuit | Voltage - Supply, Single (V+) | Multiplexer/Demultiplexer Circuit |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "VSC7514EV") |
VSC7514EV | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Active | Not Applicable | Surface Mount | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
VSC3308EV | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Active | Not Applicable | Surface Mount | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
HV2761FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | ROHS3 Compliant | 48 | 48-LQFP | 5.5V | 3V | 26Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | 4.5mA | 10μA | 8542.39.00.01 | 10μA | e3 | Matte Tin (Sn) - annealed | 260 | 40 | HV2761 | 24 | 1W | Ultrasound | 5 μs | 200V | 40V | 26Ohm Typ | 50MHz | 5 μs | 100V | Dual, Single | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
HV2201PJ-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | 2011 | Active | 1 (Unlimited) | 28 | 11.51mm | ROHS3 Compliant | Tin | 28 | 28-LCC (J-Lead) | 5.5V | 3V | 3.68mm | 11.51mm | 38Ohm | Surface Mount | 1.182714g | 0°C~70°C TA | CMOS | 5mA | -5mA | 8 | e3 | QUAD | J BEND | 245 | 5V | 40 | HV2201 | 1.27mm | 8 | Multiplexer or Switches | Not Qualified | 1.2W | 16 | Non-Inverting | SINGLE-ENDED MULTIPLEXER | Ultrasound | 1.2W | 5 μs | -160V | 40V | 19Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | NO | 33 dB | 1.35Ohm | 40V~200V ±40V~160V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||
 |
SY87724LHY | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | AnyRate® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 80-TQFP Exposed Pad | Surface Mount | -40°C~85°C TA | SY87724 | 2 | Networking | 80-EPAD-TQFP (14x14) | 3.15V~3.45V | 2:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
VSC7395XYV-03 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | Obsolete | 4 (72 Hours) | 364 | 100°C | -40°C | ROHS3 Compliant | 364-BGA | unknown | Surface Mount | Network Interfaces | Not Qualified | 1.23.3V | Telecommunications | 1000mA | Single | 3.3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
HV2801K6-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 64 | 8mm | ROHS3 Compliant | 64-VFQFN Exposed Pad | 5.5V | 3V | 38Ohm | Surface Mount | 0°C~70°C TA | CMOS | 10μA | 1mm | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | NO LEAD | 260 | 3.3V | 40 | HV2801 | 0.5mm | S-XQCC-N64 | 32 | SPST | Ultrasound | 38Ohm | 50MHz | Single | 5000ns | 5000ns | 33 dB | 5Ohm | 40V~200V ±40V~160V | 2:1 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
HV238FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 48 | 5V | 7mm | ROHS3 Compliant | 48 | 48-LQFP | 12.6V | 4.75V | 1.4mm | 7mm | 22Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | CMOS | 8.8mA | 10μA | 8542.39.00.01 | 2 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 40 | HV238 | 0.5mm | 16 | Multiplexer or Switches | Not Qualified | 5/12V | 1W | DIFFERENTIAL MULTIPLEXER | Ultrasound | SEPARATE OUTPUT | 5 μs | 110V | 50V | 22Ohm | 5 μs | Dual | 5000ns | NO | 33 dB | 1.6Ohm | 15V~50V ±100V~225V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||||
|
HV2701FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 48 | 5V | 7mm | ROHS3 Compliant | Tin | No | 48 | 48-LQFP | 5.5V | 3V | 1.4mm | 7mm | 38Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | CMOS | 7mA | 10μA | 8542.39.00.01 | 1 | e3 | QUAD | GULL WING | 260 | 3.3V | 40 | HV2701 | 0.5mm | 1 | Multiplexer or Switches | 1W | 16 | Ultrasound | 1W | 5 μs | 200V | 40V | 38Ohm | 38Ohm | 50MHz | 5 μs | 700μA | 100V | Dual | 5000ns | 5000ns | 33 dB | 0.05Ohm | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||
 |
VSC3340XJJ-01 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 1 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tray | Active | 4 (72 Hours) | 100°C | -40°C | ROHS3 Compliant | Lead Free | 484-BBGA, FCBGA | Surface Mount | 40 | Advanced Signal Equalization | Backplane, PCIe, Telecommunications, Video | 484-FCBGA (23x23) | Single | 2.5V | 40:40 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
VSC7323XVH | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | ROHS3 Compliant | BGA | 10 Gbps | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HV2705FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tray | 2012 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | Tin | 48 | 48-LQFP | 5.5V | 3V | 38Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | CMOS | 7mA | 10μA | 1.6mm | 8542.39.00.01 | 1 | 7mA | e3 | QUAD | GULL WING | 260 | 5V | 40 | HV2705 | 0.5mm | 16 | 1W | Non-Inverting | Ultrasound | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | 33 dB | 5Ohm | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||||||||
|
HV232PJ-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2013 | Active | 1 (Unlimited) | 28 | 13.2V | 11.51mm | ROHS3 Compliant | 28 | ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 28-LCC (J-Lead) | 13.2V | 4.5V | 3.68mm | 11.51mm | 22Ohm | Surface Mount | 1.182714g | 0°C~70°C TA | CMOS | 7mA | -7mA | 8 | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 245 | 5V | 40 | HV232 | 1.27mm | 8 | Multiplexer or Switches | Not Qualified | 1.2W | Ultrasound | SEPARATE OUTPUT | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | NO | 33 dB | 1.35Ohm | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||||
 |
VSC3312YYP-31 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 4 (72 Hours) | Surface Mount | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
VSC3340XJJ-31 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2007 | Active | 4 (72 Hours) | 100°C | -40°C | ROHS3 Compliant | 484-BBGA, FCBGA | Surface Mount | 40 | Advanced Signal Equalization | Backplane, PCIe, Telecommunications, Video | Single | 2.5V | 40:40 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HV2733FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 23 Weeks | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | ROHS3 Compliant | 48 | 48-LQFP | 5.5V | 3V | 38Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | 5.6mA | 10μA | 8542.39.00.01 | e3 | Matte Tin (Sn) - annealed | 260 | 40 | HV2733 | 1W | 16 | SPDT | Ultrasound | 1W | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 40V~200V ±40V~160V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HV2705FG-G-M931 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48 | 48-LQFP | 5.5V | 3V | 38Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | HVCMOS | 7mA | 10μA | 1.6mm | 8542.39.00.01 | 1 | QUAD | GULL WING | 5V | HV2705 | 0.5mm | 16 | 1W | Ultrasound | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | 33 dB | 1.9Ohm | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||||||||||||||
|
HV230GA-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2013 | Obsolete | 3 (168 Hours) | 26 | 6mm | ROHS3 Compliant | No | 26 | 26-TFBGA | 13.2V | 4.5V | 800μm | 5.35mm | 25Ohm | Surface Mount | 0°C~70°C TA | CMOS | 10μA | 1 | BOTTOM | BALL | HV230 | 0.65mm | 1 | 1W | 8 | Ultrasound | 1W | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | 30 dB | 20Ohm | 40V~200V ±40V~160V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||
|
HV2601BD-M936 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | Active | 1 (Unlimited) | 42 | 5.3mm | ROHS3 Compliant | 42 | Die | 5.5V | 3V | 38Ohm | Surface Mount | 0°C~70°C TA | CMOS | 7mA | 10μA | 1.01mm | 1 | BOTTOM | BALL | 3.3V | HV2601 | 0.6mm | 16 | Not Qualified | 1.5W | Ultrasound | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | 33 dB | 5Ohm | 40V~200V ±40V~160V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||
|
HV214FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 48 | 5V | 7mm | ROHS3 Compliant | 48 | ALSO REQUIRES VPP (40V TO VNN +250V) AND VNN (-40V TO -210V) SUPPLY | 48-LQFP | 13.2V | 4.5V | 1.4mm | 7mm | 55Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | CMOS | 7mA | 4μA | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 5V | 40 | HV214 | 0.5mm | 8 | Multiplexer or Switches | Not Qualified | 1W | 8 | SINGLE-ENDED MULTIPLEXER | Ultrasound | 1W | 5 μs | 250V | 40V | 55Ohm | 50MHz | 5 μs | 125V | Dual | 5000ns | 5000ns | NO | 60 dB | 40V~250V ±40V~210V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||
 |
VSC3304YHV-01 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | Active | 2A (4 Weeks) | ROHS3 Compliant | 36-LBGA, FCBGA | Surface Mount | 4 | Advanced Signal Equalization | Backplane, Cable Interconnect | 36-FCBGA (7x7) | 1.8V~3.3V | 4:4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HV2201PJ-G-M904 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | yes | Active | 3 (168 Hours) | 28 | 11.43mm | ROHS3 Compliant | 28 | IT ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 28-LCC (J-Lead) | 5.5V | 3V | 38Ohm | Surface Mount | 1.182714g | 0°C~70°C TA | CMOS | 5mA | 10μA | 4.573mm | 8 | QUAD | J BEND | 5V | HV2201 | 1.27mm | 8 | 1.2W | SINGLE-ENDED MULTIPLEXER | Ultrasound | 5 μs | 200V | 40V | 19Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | 33 dB | 5Ohm | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||||||||||||
 |
MT8806AE1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | yes | Obsolete | 1 (Unlimited) | 24 | 30.99mm | ROHS3 Compliant | No | 24 | 8 X 4 ARRAY | 24-DIP (0.600, 15.24mm) | 13.2V | 4.5V | 65Ohm | Through Hole | -40°C~85°C TA | CMOS | 6.35mm | 1 | e3 | MATTE TIN | DUAL | 5V | 24 | 2.54mm | 1 | CROSS POINT SWITCH | Telecommunications | 65Ohm | 45MHz | Single | 95 dB | 5Ohm | 4.5V~13.2V ±4.5V | 8:4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SY54017RMG | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tube | 2008 | Precision Edge® | Active | 2 (1 Year) | 85°C | -40°C | 2.5V | ROHS3 Compliant | Lead Free | 16 | 16-VFQFN Exposed Pad, 16-MLF® | 2.625V | 2.375V | Surface Mount | -40°C~85°C TA | 22mA | SY54017 | 2 | Networking | 320 ps | 16-MLF® (3x3) | 21mA | Multiplexer | Single | 2 | 1 | 1.2V 1.8V 2.5V | 2:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HV219PJ-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 24 Weeks | Surface Mount | Tube | 2013 | Active | 3 (168 Hours) | 28 | 11.43mm | ROHS3 Compliant | 28 | ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 28-LCC (J-Lead) | 13.2V | 4.5V | 19Ohm | Surface Mount | 1.182714g | 0°C~70°C TA | CMOS | 7mA | -7mA | 4.572mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 245 | 5V | 40 | HV219 | 1.27mm | 8 | Multiplexer or Switches | Not Qualified | 1.2W | SINGLE-ENDED MULTIPLEXER | Ultrasound | SEPARATE OUTPUT | 5 μs | -160.2kV | 5V | 19Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | NO | 33 dB | 0.7Ohm | 40V~200V ±40V~160V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||||
|
HV20220FG-G-M931 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48 | ALSO REQUIRES VPP (40V TO VNN +200V) AND VNN (-40V TO -160V) SUPPLY | 48-LQFP | 13.2V | 4.5V | 38Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | CMOS | 7mA | 10μA | 1.6mm | 1 | QUAD | GULL WING | NOT SPECIFIED | 5V | NOT SPECIFIED | HV20220 | 0.5mm | 8 | 1W | 8 | SINGLE-ENDED MULTIPLEXER | Ultrasound | 1.2W | 5 μs | 200V | 40V | 38Ohm | 50MHz | 5 μs | 100V | Dual | 5000ns | 5000ns | 33 dB | 40V~200V ±40V~160V | SPST | 1:1 | |||||||||||||||||||||||||||||||||||||||||
 |
HV2605BD-M936 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 30 Weeks | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | 16 | Ultrasound | 38Ohm | Die | 50MHz | 40V~200V ±40V~160V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
VSC3008XSX-01 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 3 (168 Hours) | RoHS Compliant | FCBGA | 3.3V | 2.5V | Surface Mount | 11 Gbps | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HV2321FG-G | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | 48 | 28V | 7mm | ROHS3 Compliant | No | 48 | 48-LQFP | 5.5V | 3V | 1.4mm | 7mm | 14Ohm | Surface Mount | 181.692094mg | 0°C~70°C TA | CMOS | 5.6mA | 10μA | 8 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 40 | HV2321 | 0.5mm | 1 | Multiplexer or Switches | 3.3/5V | 1W | 8 | SINGLE-ENDED MULTIPLEXER | Ultrasound | 1W | 5 μs | 50V | 15V | 23Ohm | 50MHz | 5 μs | Dual | 5000ns | 5000ns | NO | 33 dB | 5Ohm | 15V~50V ±100V~225V | SPST | 1:1 | ||||||||||||||||||||||||||||||||||
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MT8815AP1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2001 | Active | 3 (168 Hours) | 44 | 16.66mm | ROHS3 Compliant | Lead Free | No | 44 | 44-LCC | 13.2V | 4.5V | 4.57mm | 16.66mm | 65Ohm | Surface Mount | 2.386605g | -40°C~85°C TA | CMOS | 1 | e3 | MATTE TIN | QUAD | J BEND | 5V | 44 | 1 | Multiplexer or Switches | CROSS POINT SWITCH | Telecommunications | SEPARATE OUTPUT | -7V | 65Ohm | 45MHz | Single | 95 dB | 5Ohm | 4.5V~13.2V ±4.5V | 8:12 |
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