Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Number of Terminals | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Data Bus Width | Seated Height-Max | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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R1LV0216BSB-7SI#S0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel (TR) | 2011 | yes | Active | 1 (Unlimited) | 44 | 3V | 1 | ROHS3 Compliant | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 2 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1 | DUAL | 3V | R1LV0216B | 44 | YES | 0.8mm | 2.7V | 3.6V | 3-STATE | 2Mb 128K x 16 | Volatile | 17b | 0.025mA | 2.7V~3.6V | 16 | 70 ns | COMMON | 2V | SRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SFEM032GB1EA1TO-I-LF-121-STD | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | EM-20 | Active | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (MLC) | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | 200MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS4C32M16D2A-25BIN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2014 | Active | 3 (168 Hours) | 84 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | Lead Free | AUTO/SELF REFRESH | 84-TFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 1.8V | YES | 0.8mm | R-PBGA-B84 | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 400ps | 512Mb 32M x 16 | Volatile | 0.18mA | 1.7V~1.9V | 32MX16 | 16 | 536870912 bit | 400MHz | 0.008A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR93H66RFVM-2CTR | ROHM Semiconductor | 0.3411 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Cut Tape (CT) | 2012 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 2.9mm | ROHS3 Compliant | 8 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | Unknown | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 0.9mm | 1 | DUAL | NOT SPECIFIED | 4V | NOT SPECIFIED | YES | 0.65mm | 2.5V | Not Qualified | 3/5V | 5.5V | 4Kb 256 x 16 | Non-Volatile | 0.003mA | 2.5V~5.5V | 256X16 | 16 | 4096 bit | SERIAL | 2MHz | 0.00001A | 100 | 1000000 Write/Erase Cycles | SOFTWARE | 4ms | 3-WIRE | EEPROM | SPI | 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q80BVDAIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | 2010 | SpiFlash® | Obsolete | 1 (Unlimited) | 85°C | -40°C | 3.3V | ROHS3 Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | SPI, Serial | 3.6V | 2.7V | 8 Mb | 104MHz | Through Hole | -40°C~85°C TA | FLASH - NOR | 8-PDIP | 8.5 ns | 8Mb 1M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 104MHz | 256B | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS6C8016-55ZIN | Alliance Memory, Inc. | 6.9292 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2008 | yes | Active | 3 (168 Hours) | 44 | SMD/SMT | EAR99 | 3V | 1 | 18.42mm | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | No SVHC | 8 Mb | 1mm | 10.16mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 60mA | 1 | DUAL | 260 | 3V | 40 | 44 | 0.8mm | 2.7V | 3/5V | 5.5V | 3-STATE | 8Mb 512K x 16 | Volatile | 19b | 2.7V~5.5V | 0.00005A | 55 ns | COMMON | 2V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SFEM016GB1EA1TO-I-GE-121-STD | Swissbit | 30.4110 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | EM-20 | Active | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (MLC) | 128Gb 16G x 8 | Non-Volatile | 2.7V~3.6V | 200MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1021BV33-15ZC | CYPRESS SEMICONDUCTOR CORP | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | [object Object] | 3 (168 Hours) | 3A991.B.2.B | 18.41mm | Non-RoHS Compliant | not_compliant | 10.16mm | CMOS | ASYNCHRONOUS | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 240 | 3.3V | 30 | 44 | COMMERCIAL | YES | 0.8mm | R-PDSO-G44 | 2.97V | 70°C | SRAMs | Not Qualified | 3.3V | 3.63V | 44 | 3-STATE | 0.19mA | 64KX16 | 16 | 1048576 bit | STANDARD SRAM | 1.2mm | PARALLEL | 0.005A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS7C31026B-12JCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 1996 | yes | Active | 3 (168 Hours) | 44 | 3.3V | 28.575mm | ROHS3 Compliant | Lead Free | 44 | 44-BSOJ (0.400, 10.16mm Width) | 1 Mb | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.7592mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 44 | YES | 1.27mm | 3V | 3.6V | 1Mb 64K x 16 | Volatile | 3V~3.6V | 64KX16 | 16 | 12 ns | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT45DB642D-TU | Microchip | 125.9553 |
Min: 1 Mult: 1 |
0.00000000 | download | 1997 | Lead Free | 28 | 66MHz | 8MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PCA24S08D,112 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2009 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 40 | PCA24S08 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/3.3V | 3.6V | 8Kb 1K x 8 | Non-Volatile | 0.001mA | 2.5V~3.6V | 1KX8 | 8 | 8192 bit | SERIAL | 400kHz | 0.000015A | 10 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | I2C | 10101MMR | EEPROM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S34ML02G100TFA003 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | 48 | 18.4mm | RoHS Compliant | 12mm | CMOS | ASYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | NOT SPECIFIED | 3.3V | NOT SPECIFIED | INDUSTRIAL | YES | 0.5mm | R-PDSO-G48 | 2.7V | 85°C | -40°C | 3.6V | AEC-Q100 | 256MX8 | 8 | 2147483648 bit | FLASH | PARALLEL | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W979H2KBVX2E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 134 | 1 | 11.5mm | ROHS3 Compliant | 134 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-VFBGA | 10mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.2V | YES | 0.65mm | 1.14V | 1.3V | 512Mb 16M x 32 | Volatile | 1.14V~1.95V | 16MX32 | 32 | 536870912 bit | 400MHz | FOUR BANK PAGE BURST | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24C02D-SSHM-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 3 (168 Hours) | 8 | 4.925mm | ROHS3 Compliant | Lead Free | Gold | 8 | ALSO COMPATIBLE WITH 2.5 V AT 1 MHZ | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C | No SVHC | 2 kb | 1.75mm | 3.9mm | Surface Mount | 540.001716mg | -40°C~85°C TC | CMOS | SYNCHRONOUS | 1mA | C04-057-SN | 1 | e4 | DUAL | 260 | 1.8V | 40 | AT24C02 | 1.27mm | 1.7V | Not Qualified | 3.6V | 450ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~3.6V | 8 | SERIAL | 1MHz | 4e-7A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
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EM-10 8GB I-GRADE | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Bulk | EM-10 | Active | Not Applicable | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~105°C | FLASH - NAND (MLC) | 153-BGA (11.5x13) | 8GB | Non-Volatile | 2.7V~3.6V | 52MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TH58NVG4S0HTA20 | Toshiba America Electronic Components | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree yes | unknown | FLASH | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NSEC00K008-AT | Insignis Technology Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LBGA | Surface Mount | -40°C~105°C | FLASH - NAND (MLC) | 64Gb 8G x 8 | Non-Volatile | 3.3V | 200MHz | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PCF8582C-2T/03,118 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2000 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | 8542.32.00.71 | PCF8582 | 8 | 2Kb 256 x 8 | Non-Volatile | 2.5V~6.0V | 100kHz | EEPROM | I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC16B-I/SNG | Microchip | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Bulk | 2007 | yes | Active | 3 (168 Hours) | 8 | EAR99 | 85°C | -40°C | 4.9mm | RoHS Compliant | Lead Free | No | 8 | SOIC | I2C, Serial | 5.5V | No SVHC | 2.5V | 16 kb | 400kHz | 3.91mm | CMOS | 1.75mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 5V | 40 | 8 | INDUSTRIAL | 1.27mm | 2/5V | 900 ns | 400kHz | 2kB | EEPROM | 8 | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SFEM008GB1EA1TO-I-GE-111-E04 | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | EM-26 | Active | 3 (168 Hours) | 153 | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (pSLC) | SYNCHRONOUS | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | R-PBGA-B153 | 2.7V | 3.6V | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | 4GX8 | 8 | 34359738368 bit | 200MHz | 2.7V | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PCF8582C-2P/03,112 | NXP USA Inc. | 0.6584 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 1 (Unlimited) | 8 | 9.5mm | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 4.2mm | 8542.32.00.71 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | PCF8582 | 8 | NO | 2.54mm | R-PDIP-T8 | 2.5V | Not Qualified | 3/5V | 6V | 2Kb 256 x 8 | Non-Volatile | 0.002mA | 2.5V~6.0V | 256X8 | 8 | 2048 bit | SERIAL | 100kHz | 0.0000035A | 10 | 1000000 Write/Erase Cycles | 10ms | I2C | 1010DDDR | EEPROM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9812G6KH-6 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2015 | Active | 3 (168 Hours) | 54 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G54 | 3V | 3.6V | 5ns | 128Mb 8M x 16 | Volatile | 3V~3.6V | 8MX16 | 16 | 134217728 bit | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PCA24S08D,118 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 40 | PCA24S08 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/3.3V | 3.6V | 8Kb 1K x 8 | Non-Volatile | 0.001mA | 2.5V~3.6V | 1KX8 | 8 | 8192 bit | SERIAL | 400kHz | 0.000015A | 10 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | I2C | 10101MMR | EEPROM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS45S16400J-6TLA2 | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 105°C | -40°C | ROHS3 Compliant | 54 | 54-TSOP (0.400, 10.16mm Width) | Parallel | 3.6V | 3V | 166MHz | Surface Mount | -40°C~105°C TA | SDRAM | 166MHz | 54-TSOP II | 5.4ns | 64Mb 4M x 16 | Volatile | 3V~3.6V | 16b | 166MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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28032116 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29GL256SH9C TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 56-TFBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 256Mb 16M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 90ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F512G08CMCEBJ4-37ITR:E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 132-VBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND (MLC) | 512Gb 64G x 8 | Non-Volatile | 2.7V~3.6V | 267MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS7C513B-15JCN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tube | 1993 | yes | Active | 3 (168 Hours) | 44 | 5V | 28.575mm | ROHS3 Compliant | Lead Free | 44 | 44-BSOJ (0.400, 10.16mm Width) | 512 kb | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.7592mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | 44 | YES | 1.27mm | 512Kb 32K x 16 | Volatile | 4.5V~5.5V | 32KX16 | 16 | 15 ns | SRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16FWUXIE | Winbond Electronics | 1.0892 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Last Time Buy | 8 | 3mm | Non-RoHS Compliant | 8-UFDFN Exposed Pad | 2mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.6mm | 1 | DUAL | 1.8V | YES | 0.5mm | R-PDSO-N8 | 1.65V | 1.95V | 16Mb 2M x 8 | Non-Volatile | 1.65V~1.95V | 16MX1 | 1 | 16777216 bit | SERIAL | 104MHz | 1.8V | FLASH | SPI - Quad I/O, QPI | 60μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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93LC46CT-E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 1 kb | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | 1.75mm | 1 | 2mA | e3 | DUAL | 260 | 3V | 40 | 93LC46C | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 200 ns | 1Kb 128 x 8 64 x 16 | Non-Volatile | 2.5V~5.5V | 64X16 | 16 | 3MHz | 0.000005A | 8 | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms |
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BR93H66RFVM-2CTR ROHM Semiconductor
3/5V V Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series 2.9mm mm
Price: 0.3411
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W25Q80BVDAIG Winbond Electronics
Through Hole SpiFlash® Memory IC SpiFlash® Series 8 Mb kb
Price: 0.0000
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AS6C8016-55ZIN Alliance Memory, Inc.
3/5V V Surface Mount 44 Pin Memory IC 8 Mb kb 18.42mm mm
Price: 6.9292
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AT24C02D-SSHM-T Microchip Technology
Surface Mount Memory IC AT24C02 2 kb kb 4.925mm mm
Price: 0.0000
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24LC16B-I/SNG Microchip
2/5V V Surface Mount 8 Pin Memory IC 16 kb kb 4.9mm mm 3mA mA
Price: 0.0000
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93LC46CT-E/SN Microchip Technology
3/5V V Surface Mount 8 Pin Memory IC 93LC46C 1 kb kb 4.9mm mm 2mA mA
Price: 0.0000
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