Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Type | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W25Q128FVEJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~105°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT49F002ANT-55JI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C TC | AT49F002 | 55ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX29GL128EHXCI-90G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2009 | Not For New Designs | 64 | 3A991.B.1.A | 3V | 13mm | RoHS Compliant | Lead Free | FBGA | 128 Mb | 10mm | CMOS | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | NOR TYPE | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | 64 | INDUSTRIAL | YES | 1mm | R-PBGA-B64 | 2.7V | 85°C | -40°C | Flash Memories | Not Qualified | 3.6V | 90 ns | 0.1mA | 128MX16 | 16 | FLASH | PARALLEL | 0.0001A | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H64M8CB-37E IT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 12mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-FBGA | not_compliant | 10mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT47H64M8 | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 500ps | 512Mb 64M x 8 | Volatile | 0.225mA | 1.7V~1.9V | 64MX8 | 8 | 536870912 bit | 267MHz | 0.007A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V24L35PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2004 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 3.6V | 3V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 35 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | Asynchronous | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H128M8B7-5E L:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 92-VFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | MT47H128M8 | 92-FBGA (11x19) | 600ps | 1Gb 128M x 8 | Volatile | 1.7V~1.9V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC56CT-E/SN15KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | 4.9mm | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | DUAL | 5V | 93LC56C | YES | 1.27mm | R-PDSO-G8 | 4.5V | 5.5V | AEC-Q100; TS 16949 | 2Kb 256 x 8 128 x 16 | Non-Volatile | 2.5V~5.5V | 128X16 | 16 | 2048 bit | SERIAL | 2MHz | 8 | 6ms | MICROWIRE | EEPROM | SPI | 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62167GE30-45BVXIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | 2011 | MoBL® | yes | Active | 3 (168 Hours) | 48 | 3A991.B.2.B | 8mm | ROHS3 Compliant | 48 | 48-VFBGA | 6mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 30 | YES | 0.75mm | 2.2V | 3.6V | 16Mb 2M x 8 1M x 16 | Volatile | 2.2V~3.6V | 1MX16 | 16 | 16777216 bit | 45 ns | 8 | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V256SA12PZG8 | Integrated Device Technology (IDT) | 3.2070 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 3.3V | 1 | 8mm | RoHS Compliant | Lead Free | No | 28 | TSOP | Parallel | 3.6V | 3V | 256 kb | 11.8mm | 1mm | CMOS | 1 | 90mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 28 | COMMERCIAL | 0.55mm | SRAMs | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.002A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70261L20PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 315mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.01A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7016S15J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | PLCC | Parallel | 5.5V | 4.5V | 144 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 15 ns | 18kB | RAM, SDR, SRAM | 28b | 16KX9 | Asynchronous | 0.015A | 9b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL208K0RMFI040 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2013 | FL2-K | Obsolete | 3 (168 Hours) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 8 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.75mm | 1 | 25mA | DUAL | 3V | 1.27mm | 2.7V | 3/3.3V | 3.6V | 5 ns | 8Mb 1M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 76MHz | 0.000032A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3579S80PFGI | Renesas Electronics America Inc. | 11.5942 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V3579 | 100-TQFP (14x14) | 8ns | 4.5Mb 256K x 18 | Volatile | 3.135V~3.465V | 100MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V424S15YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 36 | 70°C | 0°C | 3.3V | 1 | 23.4mm | RoHS Compliant | Lead Free | No | 36 | Parallel | 3.6V | 3V | 4 Mb | 10.2mm | 2.2mm | CMOS | 3.683mm | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 36 | COMMERCIAL | SRAMs | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 19b | Asynchronous | 0.02A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39VF801C-70-4I-B3KE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tray | 2011 | SST39 MPF™ | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 8mm | ROHS3 Compliant | Lead Free | No | 48 | BOTTOM BOOT BLOCK | 48-TFBGA | No SVHC | 8 Mb | 5MHz | 750μm | 6mm | Surface Mount | -40°C~85°C TA | CMOS | 8542.32.00.51 | 1 | 18mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 40 | SST39VF801C | 48 | 2.7V | 3.6V | 70ns | 8Mb 512K x 16 | Non-Volatile | 19b | 2.7V~3.6V | 512KX16 | Asynchronous | 16b | 0.00002A | 16b | 2.7V | YES | YES | YES | 256 | YES | YES | FLASH | Parallel | 10μs | 2K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT29F2T08EMHAFJ4-3ITF:A TR") |
MT29F2T08EMHAFJ4-3ITF:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tape & Reel (TR) | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761SA200BQI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V25761 | 165-CABGA (13x15) | 5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CAT25080VP2I-GT3 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-WFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | EEPROM | 8-TDFN (2x3) | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL01GP12TFI020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2012 | GL-P | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | Tin | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | No SVHC | 1 Gb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 110mA | e3 | DUAL | 260 | 3V | 40 | 0.5mm | 2.7V | 3/3.3V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 1GX1 | 1 | Asynchronous | 8b | 0.000005A | 120 ns | 8 | 3V | YES | YES | YES | 1K | 8/16words | YES | YES | FLASH | Parallel | 120ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C2270XV18-633BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2003 | Active | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 36 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II+ | 1 | 1.23A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C2270 | 165 | 3-STATE | 450 ps | 36Mb 1M x 36 | Volatile | 19b | 1.7V~1.9V | 36 | Synchronous | 633MHz | 36b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F2G16ABAEAWP-IT:E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Surface Mount | Bulk | 2012 | Obsolete | 3 (168 Hours) | 48 | 3.3V | 18.4mm | ROHS3 Compliant | Tin | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | 2 Gb | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1.2mm | 1 | 35mA | DUAL | 3.3V | MT29F2G16 | 0.5mm | 2.7V | 3.6V | 2Gb 128M x 16 | Non-Volatile | 28b | 2.7V~3.6V | 128MX16 | 16 | Asynchronous | 0.0001A | 25 ns | 16b | 2.7V | NO | NO | YES | 2K | 1Kwords | YES | FLASH | Parallel | 64K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V424L15PHI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | no | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 18.41mm | Non-RoHS Compliant | TSOP | Parallel | not_compliant | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 20 | 44 | INDUSTRIAL | YES | 0.8mm | R-PDSO-G44 | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.145mA | 512KX8 | 8 | 4194304 bit | 0.01A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC320A-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2004 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | No SVHC | 32 kb | 1.25mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 25LC320A | 8 | 1.27mm | 160 ns | 32Kb 4K x 8 | Non-Volatile | 2.5V~5.5V | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C040-90PI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | EPROM - OTP | AT27C040 | 32-PDIP | 90ns | 4Mb 512K x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY62157DV30L-55BVXE | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | MoBL® | Obsolete | 3 (168 Hours) | 48 | 3A991.B.2.A | 8mm | ROHS3 Compliant | 48 | 48-VFBGA | unknown | 6mm | Surface Mount | -40°C~125°C TA | SRAM - Asynchronous | 1mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 20 | CY62157 | 48 | YES | 0.75mm | 2.2V | Not Qualified | 2.5/3.3V | 3.6V | 3-STATE | 8Mb 512K x 16 | Volatile | 0.02mA | 2.2V~3.6V | 512KX16 | 16 | 8388608 bit | 0.00005A | 55 ns | COMMON | 2V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CP5789EM | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NDT18PFH-9MET | Insignis Technology Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 20ns | 1Gb 128M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F8G08ADAFAWP-AIT:F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | 8Gb 1G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29RZ2B2DZZHHTB-18W.88F | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | 162-VFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND, DRAM - LPDDR2 | 2Gb 256M x 8 N 2G 64M x 32 LPDDR2 | Non-Volatile | 1.8V | 533MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PC28F128M29EWHF | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | 2012 | yes | Obsolete | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | No | 64 | 64-LBGA | 128 Mb | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 1 | 25mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 30 | PC28F128 | YES | 1mm | 3/3.3V | 2.7V | 128Mb 16M x 8 8M x 16 | Non-Volatile | 2.7V~3.6V | 8MX16 | 16 | Asynchronous | 0.00012A | 60 ns | 8 | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 60ns | 128K |
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