Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Length | RoHS Status | Number of Pins | Package / Case | Interface | Frequency | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Number of Functions | Terminal Position | Supply Voltage | Surface Mount | Terminal Pitch | Supply Voltage-Min (Vsup) | Supply Voltage-Max (Vsup) | Supplier Device Package | Access Time | Memory Size | Memory Type | Voltage - Supply | Organization | Memory Width | Memory Density | Clock Frequency | Programming Voltage | Memory Format | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "HTEE25608") |
HTEE25608 | Honeywell Aerospace | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Bulk | 2013 | Active | 1 (Unlimited) | 225°C | -55°C | RoHS Compliant | 56 | 56-BCPGA | Parallel, Serial | Through Hole | -55°C~225°C TA | EEPROM | 56-CPGA | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 5MHz | EEPROM | Parallel, SPI | 90ms | ||||||||||||||||||||
|
HTEE25608D | Honeywell Aerospace | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 19 Weeks | Tube | 2013 | Active | 1 (Unlimited) | 56 | 38.1mm | RoHS Compliant | 56 | 56-BCPGA | Parallel, Serial | 19.05mm | Through Hole | -55°C~225°C TA | CMOS | SYNCHRONOUS | 6.8mm | 1 | PERPENDICULAR | 5V | NO | 2.54mm | 4.75V | 5.25V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 5MHz | 5V | EEPROM | Parallel, SPI | 90ms | |||||||
 |
HT6256DC | Honeywell Aerospace | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Bulk | 2012 | HTMOS™ | Active | 1 (Unlimited) | 225°C | -55°C | Non-RoHS Compliant | 28-CDIP (0.600, 15.24mm) | Parallel | 20MHz | Through Hole | -55°C~225°C TA | SRAM | 28-CDIP | 50ns | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | 20MHz | SRAM | Parallel | 50ns |
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