Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Package / Case | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Memory Size | Memory Type | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Parallel/Serial | Clock Frequency | Standby Current-Max | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | Serial Bus Type | I2C Control Byte | Memory Format | Memory Interface |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
PCF8594C-2T/02,118 | NXP USA Inc. | 4.5653 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2000 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | 8542.32.00.71 | PCF8594 | 8 | 4Kb 512 x 8 | Non-Volatile | 2.5V~6.0V | 100kHz | EEPROM | I2C | |||||||||||||||||||||||||||||||||||
 |
PCF8598C-2T/02,112 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2003 | Obsolete | 1 (Unlimited) | 8 | 7.55mm | ROHS3 Compliant | 8-SOIC (0.295, 7.50mm Width) | 7.5mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 2.65mm | 8542.32.00.71 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 3.3V | 30 | PCF8598 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/5V | 6V | 8Kb 1K x 8 | Non-Volatile | 0.002mA | 2.5V~6.0V | 1KX8 | 8 | 8192 bit | SERIAL | 100kHz | 0.00001A | 10 | 1000000 Write/Erase Cycles | HARDWARE | 10ms | I2C | 1010DMMR | EEPROM | I2C | ||||
|
PCA24S08D,118 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 40 | PCA24S08 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/3.3V | 3.6V | 8Kb 1K x 8 | Non-Volatile | 0.001mA | 2.5V~3.6V | 1KX8 | 8 | 8192 bit | SERIAL | 400kHz | 0.000015A | 10 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | I2C | 10101MMR | EEPROM | I2C | |||||
 |
PCF8582C-2P/03,112 | NXP USA Inc. | 0.6584 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 1 (Unlimited) | 8 | 9.5mm | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 4.2mm | 8542.32.00.71 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | PCF8582 | 8 | NO | 2.54mm | R-PDIP-T8 | 2.5V | Not Qualified | 3/5V | 6V | 2Kb 256 x 8 | Non-Volatile | 0.002mA | 2.5V~6.0V | 256X8 | 8 | 2048 bit | SERIAL | 100kHz | 0.0000035A | 10 | 1000000 Write/Erase Cycles | 10ms | I2C | 1010DDDR | EEPROM | I2C | |||||
|
PCF8582C-2T/03,118 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2000 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | 8542.32.00.71 | PCF8582 | 8 | 2Kb 256 x 8 | Non-Volatile | 2.5V~6.0V | 100kHz | EEPROM | I2C |
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