Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | Sync/Async | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
IDT6116SA20TP | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Rail/Tube | 2008 | 24 | EAR99 | 70°C | 0°C | 5V | 1 | Non-RoHS Compliant | 24 | PDIP | Parallel | 5.5V | not_compliant | 4.5V | 16 kb | CMOS | 1 | 105mA | e0 | DUAL | 225 | 5V | 30 | 24 | COMMERCIAL | 2.54mm | SRAMs | Not Qualified | 5V | 3-STATE | 20 ns | RAM, SRAM - Asynchronous | 11b | 2KX8 | 8 | Asynchronous | 0.002A | 8b | YES | COMMON | |||||||||||||||||||||||||||||||
 |
7024L45J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; ARBITER; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 29.21mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 45 ns | 8kB | RAM, SDR, SRAM | 12b | 4KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | |||||||||||||||||||||||||
 |
70T651S12BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 2.6V | 2.4V | 9 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 355mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 12 ns | 1.1MB | RAM, SDR, SRAM | 18b | Asynchronous | 0.01A | 36b | COMMON | ||||||||||||||||||||||||||
 |
71V3577S75BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | FLOW THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 117MHz | 2.15mm | 22mm | 2.15mm | CMOS | 255mA | 1 | 255mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 117MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||
 |
IDT71V65802S150BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 70°C | 0°C | Non-RoHS Compliant | 165 | Parallel | 150MHz | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9279L6PRF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2008 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | TQFP | Parallel | 3.6V | 3V | 512 kb | 52.6MHz | 14mm | 1.4mm | CMOS | 350mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 6 ns | 64kB | RAM, SDR, SRAM | 30b | Synchronous | 0.003A | 16b | COMMON | 3V | ||||||||||||||||||||||||||
 |
IDT71V65602S133PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.32mA | 256KX36 | 36 | 9437184 bit | 0.06A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||
 |
7142LA25JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2004 | Active | 85°C | -40°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 16 kb | 19mm | 3.63mm | 220mA | 25 ns | RAM, SRAM | 22b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||
.png "70V06L20J8") |
70V06L20J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 3.6V | 3V | 128 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 175mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 8b | COMMON | 2V | ||||||||||||||||||||||||||
 |
IDT71V65803S100PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 100MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.27mA | 512KX18 | 18 | 9437184 bit | 0.06A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
IDT71V3559SA80BQGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 165 | 3A991.B.2.A | 85°C | -40°C | 15mm | RoHS Compliant | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | unknown | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.26mA | 256KX18 | 18 | 4718592 bit | 95MHz | 0.045A | 8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
 |
IDT71V65603S150PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2012 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | LQFP | Parallel | not_compliant | 150MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.345mA | 256KX36 | 36 | 9437184 bit | 0.06A | 3.8 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
 |
71V3556SA150BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2015 | yes | Active | 3 (168 Hours) | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 4 Mb | 150MHz | 22mm | 2.15mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | RAM, SRAM | 17b | ||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P79804S250BQI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 3 (168 Hours) | 165 | 3A991.B.2.A | 85°C | -40°C | 15mm | Non-RoHS Compliant | 165 | Parallel | not_compliant | 250MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.8V | 20 | 165 | INDUSTRIAL | YES | 1mm | 1.7V | SRAMs | Not Qualified | 1.5/1.81.8V | 1.9V | 3-STATE | DDR, RAM, SRAM | 0.9mA | 1MX18 | 18 | 18874368 bit | 0.41A | 0.45 ns | SEPARATE | 1.7V | |||||||||||||||||||||||||||||
 |
7140LA100J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 100 ns | 1kB | RAM, SDR, SRAM | 10b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||
 |
71V124SA12YGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 32 | 85°C | -40°C | 3.3V | 1 | 20.9mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3V | 1 Mb | 10.2mm | 2.2mm | CMOS | 140mA | 3.683mm | 1 | 140mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | INDUSTRIAL | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | 3V | ||||||||||||||||||||||||||||
 |
IDT71V3558SA133BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | Non-RoHS Compliant | BGA | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.3mA | 256KX18 | 18 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
 |
IDT71V256SA12Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2010 | no | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 1 | 17.9324mm | RoHS Compliant | 28 | Parallel | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 28 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.09mA | 32KX8 | 8 | 262144 bit | 0.002A | 12 ns | YES | COMMON | 3V | |||||||||||||||||||||||||||||
 |
70V657S12BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 3.45V | 3.15V | 1.1 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 465mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.015A | 36b | COMMON | ||||||||||||||||||||||||||||
 |
IDT71T75902S80BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | unknown | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 2.5V | 119 | COMMERCIAL | YES | 1.27mm | 2.375V | Not Qualified | 2.625V | RAM, SRAM | 1MX18 | 18 | 18874368 bit | 8 ns | |||||||||||||||||||||||||||||||||||||||
 |
70T3589S166DR | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 28mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | PQFP | Parallel | 2.6V | 2.4V | 2.3 Mb | 166MHz | 28mm | 3.5mm | CMOS | 4.1mm | 1 | 450mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 20 | 208 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 32b | 64KX36 | Synchronous | 0.015A | 36b | COMMON | ||||||||||||||||||||||||
|
70V06S15J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 3.6V | 3V | 128 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 215mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 15 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.005A | 8b | COMMON | 2V | |||||||||||||||||||||||||
 |
71321SA25JG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2008 | yes | 1 (Unlimited) | 52 | EAR99 | 70°C | 0°C | 2 | 19.1262mm | RoHS Compliant | AUTOMATIC POWER DOWN | LCC | Parallel | 19.1262mm | CMOS | ASYNCHRONOUS | 4.572mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 30 | 52 | COMMERCIAL | YES | 1.27mm | S-PQCC-J52 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM | 0.22mA | 2KX8 | 8 | 16384 bit | 0.015A | 25 ns | COMMON | 4.5V | ||||||||||||||||||||||||||
 |
71V65803S100BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2005 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 9 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 270mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 5 ns | RAM, SRAM | 19b | Synchronous | 0.06A | 18b | COMMON | |||||||||||||||||||||||||
 |
71V321L25TF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 3.3V | 2 | 10mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 3.6V | 3V | 16 kb | 10mm | 1.4mm | CMOS | 1.6mm | 1 | 100mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 64 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||
 |
70T3339S133BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||
 |
71V2556S150PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2011 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 150MHz | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 30 | 100 | COMMERCIAL | YES | 0.65mm | SRAMs | 3-STATE | 3.8 ns | 150MHz | 512kB | RAM, SDR, SRAM | 17b | 0.325mA | 0.04A | COMMON | ||||||||||||||||||||||||||
 |
IDT709199L7PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 2 | 14mm | Non-RoHS Compliant | PIPELINED OR FLOW-THROUGH ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | YES | 0.5mm | S-PQFP-G100 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM | 0.465mA | 128KX9 | 9 | 1179648 bit | 83MHz | 0.003A | 18 ns | COMMON | 4.5V | |||||||||||||||||||||||||
 |
70V639S12BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 3.45V | 3.15V | 2.3 Mb | 15mm | 1.4mm | CMOS | 1 | 465mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 12 ns | 256kB | RAM, SDR, SRAM | 17b | Asynchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||
 |
71256SA15YG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 5.5V | 4.5V | 256 kb | 7.6mm | 2.67mm | CMOS | 150mA | 3.556mm | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON |
-
IDT6116SA20TP Integrated Device Technology (IDT)
5V V Through Hole 24 Pin Memory IC 16 kb kb 105mA mA 8b b
Price: 0.0000
RFQ -
7024L45J8 Integrated Device Technology (IDT)
5V V Surface Mount 84 Pin Memory IC 64 kb kb 29.21mm mm 16b b
Price: 0.0000
RFQ -
70T651S12BC Integrated Device Technology (IDT)
Surface Mount 256 Pin Memory IC 9 Mb kb 17mm mm 355mA mA 36b b
Price: 0.0000
RFQ -
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