Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Weight | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | Sync/Async | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
IDT71V25761YSA166BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | not_compliant | 166MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 119 | INDUSTRIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.33mA | 128KX36 | 36 | 4718592 bit | 0.035A | 3.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||
 |
70V3579S5BCI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 3.45V | 3.15V | 1.1 Mb | 100MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 415mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 5 ns | RAM, SRAM | 30b | Synchronous | 36b | COMMON | ||||||||||||||||||||||||||||
 |
70V06L20PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 3.6V | 3V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 195mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.005A | 8b | COMMON | 2V | |||||||||||||||||||||||
 |
IDT6116SA45SO8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 1 | 15.4mm | Non-RoHS Compliant | SOIC | Parallel | not_compliant | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 30 | 24 | COMMERCIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.1mA | 2KX8 | 8 | 16384 bit | 0.002A | 45 ns | YES | COMMON | 4.5V | |||||||||||||||||||||||||||
 |
71256L35YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 5.5V | 4.5V | 256 kb | 7.6mm | 2.67mm | CMOS | 3.556mm | 1 | 115mA | e3 | Matte Tin (Sn) | DUAL | J BEND | 260 | 5V | 28 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON | 2V | ||||||||||||||||||||||||||
 |
IDT71V256SA10Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2010 | no | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 1 | 17.9324mm | RoHS Compliant | 28 | Parallel | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 28 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.1mA | 32KX8 | 8 | 262144 bit | 0.002A | 10 ns | YES | COMMON | 3V | |||||||||||||||||||||||||||||
 |
71V65603S133BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2007 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | BURST COUNTER | Parallel | 3.465V | 3.135V | 9 Mb | 133MHz | 13mm | 1.2mm | CMOS | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||
 |
71V67903S85BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2004 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | 3.465V | 3.135V | 9 Mb | 87MHz | 13mm | 1.2mm | CMOS | 1 | 190mA | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | SRAMs | 3-STATE | 8.5 ns | RAM, SRAM | 19b | Synchronous | 0.05A | 18b | COMMON | |||||||||||||||||||||||||||
 |
70T633S10BFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 2.6V | 2.4V | 9 Mb | 15mm | 1.4mm | CMOS | 1.5mm | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 10 ns | 1.1MB | RAM, SDR, SRAM | 38b | Asynchronous | 18b | COMMON | |||||||||||||||||||||||||||||
 |
71V35761S183PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 183MHz | 14mm | 1.4mm | CMOS | 1 | 340mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 3.3 ns | 183MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||
 |
IDT6116SA15SO8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 1 | 15.4mm | Non-RoHS Compliant | SOIC | Parallel | not_compliant | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 30 | 24 | COMMERCIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.15mA | 2KX8 | 8 | 16384 bit | 0.002A | 15 ns | YES | COMMON | 4.5V | |||||||||||||||||||||||||||
 |
71256SA15TPG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2011 | yes | Active | 1 (Unlimited) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 34.3mm | RoHS Compliant | Lead Free | No | 28 | PDIP | Parallel | 5.5V | 4.5V | 256 kb | 7.62mm | 3.3mm | CMOS | 4.572mm | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 28 | COMMERCIAL | 2.54mm | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON | ||||||||||||||||||||||||||
 |
IDT71024S12TYI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | 3 (168 Hours) | 32 | 3A991.B.2.B | 85°C | -40°C | 20.96mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 7.62mm | CMOS | 3.76mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 32 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.16mA | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||
 |
7009L20PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 1 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 360mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 128kB | RAM, SDR, SRAM | 17b | Asynchronous | 0.006A | 8b | COMMON | |||||||||||||||||||||||||
 |
7026L25J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 256 kb | 29.21mm | 3.63mm | 265mA | 84 | 25 ns | 32kB | RAM, SDR, SRAM | 14b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||
 |
71V416L15BEG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2012 | yes | Active | 3 (168 Hours) | 48 | 70°C | 0°C | 3.3V | 1 | 9mm | RoHS Compliant | Lead Free | 48 | TFBGA | Parallel | 3.6V | 3V | 4 Mb | 9mm | 1.2mm | CMOS | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3.3V | NOT SPECIFIED | 48 | COMMERCIAL | YES | 0.75mm | SRAMs | Not Qualified | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | COMMON | 3V | ||||||||||||||||||||||||||||||
 |
70T651S10BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 2.6V | 2.4V | 9 Mb | 15mm | 1.4mm | CMOS | 1.5mm | 1 | 405mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 10 ns | RAM, SRAM | 18b | Asynchronous | 0.01A | 36b | COMMON | ||||||||||||||||||||||||||||
 |
70V07L25PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 80 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | 80 | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 80 | INDUSTRIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 15b | Asynchronous | 0.003A | 8b | COMMON | 3V | ||||||||||||||||||||||||
 |
71V65603S150BQGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | PIPELINED ARCHITECTURE | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 13mm | 1.2mm | CMOS | 1 | 345mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | SRAMs | 3-STATE | 6.7 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.06A | 36b | COMMON | |||||||||||||||||||||||||
 |
6116SA25SOGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2013 | yes | Active | 1 (Unlimited) | 24 | EAR99 | 85°C | -40°C | 5V | 1 | 15.4mm | RoHS Compliant | Lead Free | No | 24 | SOIC | Parallel | 5.5V | 4.5V | 16 kb | 7.6mm | 2.34mm | CMOS | 1 | 100mA | e3 | MATTE TIN | DUAL | GULL WING | 260 | 5V | 30 | 24 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.002A | 8b | COMMON | ||||||||||||||||||||||||
.png "70P245L65BYGI") |
70P245L65BYGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 2011 | yes | Discontinued | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | 6mm | RoHS Compliant | Lead Free | No | 100 | TFBGA | Parallel | 3V | 1.8V | 64 kb | 6mm | 1mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 65 ns | 8kB | RAM, SDR, SRAM | 24b | 0.07mA | 4KX16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||
 |
IDT71V3576S133PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2012 | no | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 128KX36 | 36 | 4718592 bit | 0.03A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
71421LA20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | BATTERY BACK UP | TQFP | Parallel | 5.5V | 4.5V | 16 kb | 1.4mm | 14mm | 1.4mm | 360.605934mg | CMOS | 110mA | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||
 |
IDT6116LA35TPG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 24 | EAR99 | 70°C | 0°C | 1 | 31.75mm | RoHS Compliant | DIP | Parallel | 7.62mm | CMOS | 4.191mm | 8542.32.00.41 | 1 | e3 | MATTE TIN | DUAL | THROUGH-HOLE | 260 | 5V | 30 | 24 | COMMERCIAL | NO | 2.54mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.095mA | 2KX8 | 8 | 16384 bit | 0.00002A | 35 ns | YES | COMMON | 2V | |||||||||||||||||||||||||||||||
 |
IDT71V256SA15Y8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | no | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 1 | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 28 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.085mA | 32KX8 | 8 | 262144 bit | 0.002A | 15 ns | YES | COMMON | 3V | |||||||||||||||||||||||||||
 |
709089L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 28.5MHz | 1.4mm | 14mm | 1.4mm | 657.000198mg | CMOS | 285mA | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | Synchronous | 0.005A | 8b | COMMON | ||||||||||||||||||||
 |
IDT71V416S12Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | no | 3 (168 Hours) | 44 | 3A991.B.2.A | 70°C | 0°C | 1 | 28.575mm | RoHS Compliant | 44 | Parallel | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 44 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.18mA | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | YES | COMMON | 3V | |||||||||||||||||||||||||||||
 |
71V321L25TFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 3.3V | 2 | 10mm | RoHS Compliant | Contains Lead | No | 64 | LQFP | Parallel | 3.6V | 3V | 16 kb | 10mm | 1.4mm | CMOS | 1.6mm | 1 | 130mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 64 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||
 |
71V256SA15PZG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 3.3V | 1 | 8mm | RoHS Compliant | Lead Free | No | 28 | TSSOP | Parallel | 3.6V | 3V | 256 kb | 11.8mm | 1mm | CMOS | 1 | 85mA | e3 | MATTE TIN | DUAL | GULL WING | 260 | 3.3V | 28 | COMMERCIAL | 0.55mm | SRAMs | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.002A | 8b | COMMON | 3V | |||||||||||||||||||||||||
 |
71321LA35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | TQFP | Parallel | 5.5V | 4.5V | 16 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 35 ns | 2kB | RAM, SDR, SRAM | 11b | Asynchronous | 0.0015A | 8b | COMMON | 2V |
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