Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Pbfree Code | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Package / Case | Interface | Density | Frequency | Technology | Operating Mode | Height Seated (Max) | Number of Functions | Terminal Position | Terminal Form | Supply Voltage | Pin Count | Temperature Grade | Surface Mount | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "RMLV0408EGSP-4S2#CA0") |
RMLV0408EGSP-4S2#CA0 | Renesas | 424.3056 |
Min: 1 Mult: 1 |
0.00000000 | yes | 32 | 85°C | -40°C | RoHS Compliant | Lead Free | SOIC | Parallel | CMOS | ASYNCHRONOUS | 1 | DUAL | GULL WING | 3V | 32 | INDUSTRIAL | YES | R-PDSO-G32 | 2.7V | 3.6V | 45 ns | 512kB | RAM, SRAM | 512KX8 | 8 | 4194304 bit | ||||||||||||||||
 |
R1LV5256ESP-5SI#B0 | Renesas | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 28 | EAR99 | 85°C | -40°C | 3V | 1 | RoHS Compliant | Lead Free | No | 28 | SOP | Parallel | 256 kb | 1MHz | CMOS | 2.4mm | 1 | DUAL | GULL WING | 3V | 28 | INDUSTRIAL | YES | 2.7V | SRAMs | 3.6V | 3-STATE | 55 ns | RAM, SRAM | 15b | 0.025mA | 32KX8 | 8 | COMMON | 2V |
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