Items : %s%s
Memory Controllers
Additional Feature
- 10 YEARS DATA RETENTION; SERIAL 64-BIT PROTOCOL; ACCURACY 1 MIN/MONTH @ 25 DEGREE C
- ALSO OPERATES AT 3.3V SUPPLY
Contact Plating
- Gold
- Gold, Tin
- Lead, Tin
- Tin
ECCN Code
- 3A991.A.3
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
JESD-609 Code
- e0
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- PRODUCTION (Last Updated: 1 month ago)
Manufacturer Package Identifier
- S8+4
Material
- Thermoplastic
Max Operating Temperature
- 70°C
- 85°C
Min Operating Temperature
- -40°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 2 (1 Year)
- 3 (168 Hours)
Mount
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 132
- 16
- 20
- 28
- 32
- 56
- 8
Number of Rows
- 2
Number of Terminals
- 16
Number of Terminations
- 132
- 14
- 144
- 16
- 20
- 28
- 32
- 44
- 56
- 68
- 8
- 84
Operating Temperature
- -20°C~70°C
- -25°C~75°C
- -40°C~85°C
- 0°C~70°C
Package / Case
- 132-BQFP Bumpered
- 14-DIP (0.300, 7.62mm)
- 144-LQFP
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 20-DIP (0.300, 7.62mm)
- 20-SOIC (0.295, 7.50mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 28-DIP (0.600, 15.24mm)
- 28-DIP (0.600, 15.24mm) Socket
- 28-LCC (J-Lead)
- 32-DIP (0.600, 15.24mm) Socket
- 44-QFP
- 53-TFBGA, FCCSPBGA
- 56-VFBGA
- 56-VFQFN Exposed Pad
- 68-LCC (J-Lead)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 84-LCC (J-Lead)
- Die
- QFP
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2011
- 2012
- 2014
Series
- EZ-USB NX2LP-Flex™
- EZ-USB NX2LP™
Supplier Device Package
- 16-SOIC
- 20-SOIC
- 20-TSSOP
- 56-QFN-EP (8x8)
- 56-VFBGA (5x5)
- 8-PDIP
- 8-SOIC
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- TIN
- Tin (Sn)
- TIN LEAD
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn85Pb15)
Termination
- SMD/SMT
- Solder
- Through Hole
Type
- Integrated Circuit (IC)
Weight
- 1.182714g
- 1.627801g
- 13.607771g
- 190.990737mg
- 2.259996g
- 2.26799g
- 200.686274mg
- 4.187905g
- 4.190003g
- 440.409842mg
- 506.605978mg
- 540.001716mg
- 61.887009mg
- 665.986997mg
- 75.891673mg
- 800.987426mg
- 930.006106mg
- 951.693491mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | RoHS Status | Technology | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Analog IC - Other Type | Supply Current-Max (Isup) | Number of Terminals |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "BQ2203APN") |
BQ2203APN | BENCHMARQ MICROELECTRONICS INC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Non-RoHS Compliant | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | NOT SPECIFIED | 5V | NOT SPECIFIED | COMMERCIAL | NO | 2.54mm | R-PDIP-T16 | 4.5V | 70°C | Power Management Circuits | Not Qualified | 5V | 5.5V | POWER SUPPLY SUPPORT CIRCUIT | 6mA | 16 |
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BQ2203APN BENCHMARQ MICROELECTRONICS INC
BQ2203APN datasheet pdf and Memory - Controllers product details from BENCHMARQ MICROELECTRONICS INC stock available at HK JDW
Price: 0.0000
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