Items : %s%s
Memory Batteries
Contact Plating
- Gold
- Gold, Lead, Tin
ECCN Code
- EAR99
Factory Lead Time
- 12 Weeks
- 6 Weeks
HTS Code
- 8504.40.95.40
- 8506.50.00.00
- 8542.39.00.01
JESD-609 Code
- e0
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 7 months ago)
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Snap in, Through Hole
- Surface Mount
- Through Hole
Mounting Type
- Snap-In
- Surface Mount
- Through Hole
Number of Pins
- 16
- 2
- 4
Number of Terminations
- 16
- 34
- 4
Operating Temperature
- -40°C~85°C
- 0°C~70°C
Package / Case
- 16-DIP Module (0.300, 7.62mm)
- 34-PowerCap™ Module
Packaging
- Bulk
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- no
- yes
Peak Reflow Temperature (Cel)
- 240
- NOT SPECIFIED
Published
- 1997
- 1999
- 2002
- 2007
- 2010
Series
- Snaphat®
Subcategory
- Power Management Circuits
- Timer or RTC
Supplier Device Package
- 34-PowerCap Module
Surface Mount
- YES
Technology
- CMOS
Terminal Finish
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Matte Tin (Sn)
- TIN LEAD
- Tin/Lead (Sn/Pb)
Terminal Form
- J INVERTED
Terminal Position
- DUAL
Termination
- Power
Voltage - Rated
- 2.8V
Voltage - Rated DC
- 3V
Weight
- 1.8g
- 10g
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Number of Pins | Package / Case | Density | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | HTS Code | Number of Functions | Type | JESD-609 Code | Terminal Finish | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Terminal Pitch | Supply Voltage-Min (Vsup) | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Memory Size | Memory Type | Voltage - Supply | Organization | Memory Width | Page Size | Memory Format | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W29N02GVSIAA | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3V | 18.4mm | ROHS3 Compliant | 48 | 48-TFSOP (0.724, 18.40mm Width) | 2 Gb | 1.2mm | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 8542.32.00.51 | 1 | Parameter | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 0.5mm | 2.7V | 3.6V | 85°C | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 2GX1 | 1 | 256B | FLASH | Parallel | 25ns |
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W29N02GVSIAA Winbond Electronics Corporation
Surface Mount Memory IC 2 Gb kb 18.4mm mm
Price: 0.0000
RFQ
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