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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Items : %s%s

I/O Expanders

Additional Feature

  • CAN ALSO OPERATE AT 5V SUPPLY
  • IT ALSO OPERATES AT 2.5V, 3.3V AND 5V
  • IT ALSO OPERATES AT 3.3V SUPPLY
  • IT ALSO OPERATES AT 5 V
  • SEATED HGT-NOM

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Gold, Tin
  • Tin

ECCN Code

  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 21 Weeks
  • 27 Weeks
  • 28 Weeks
  • 3 Weeks
  • 35 Weeks
  • 4 Weeks
  • 45 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks

Feature

  • ADC, EEPROM, POR, PWM
  • Buzzer Outputs, LED Outputs, POR
  • DAC, POR
  • EEPROM
  • EEPROM, POR
  • EEPROM, POR, PWM
  • EEPROM, POR, PWM, WDT
  • Fan Speed Controller
  • Keypad Controller, LED Output, POR
  • Keypad Controller, POR
  • Keypad Controller, POR, PWM
  • LED Output(s), POR
  • POR
  • PWM

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e2
  • e3/e4
  • e4
  • e6

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 1 week ago)
  • ACTIVE (Last Updated: 13 hours ago)
  • ACTIVE (Last Updated: 16 hours ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 23 hours ago)
  • ACTIVE (Last Updated: 3 days ago)
  • ACTIVE (Last Updated: 3 months ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 5 days ago)
  • ACTIVE (Last Updated: 6 days ago)
  • CONSULT SALES OFFICE (Last Updated: 1 week ago)
  • CONSULT SALES OFFICE (Last Updated: 2 days ago)
  • CONSULT SALES OFFICE (Last Updated: 4 days ago)
  • LIFEBUY (Last Updated: 1 week ago)
  • LIFEBUY (Last Updated: 2 days ago)
  • LIFEBUY (Last Updated: 4 days ago)
  • NRND (Last Updated: 1 week ago)
  • NRND (Last Updated: 2 days ago)
  • NRND (Last Updated: 3 days ago)
  • NRND (Last Updated: 4 days ago)
  • NRND (Last Updated: 5 days ago)
  • NRND (Last Updated: 6 days ago)
  • NRND (Last Updated: 7 months ago)
  • PRODUCTION (Last Updated: 1 month ago)
  • PRODUCTION (Last Updated: 3 months ago)

Manufacturer Package Identifier

  • MCP23018/MCP23S18

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • 4
  • Not Applicable

Mount

  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 10
  • 100
  • 14
  • 16
  • 18
  • 20
  • 24
  • 25
  • 28
  • 32
  • 36
  • 40
  • 44
  • 48
  • 8

Number of Terminals

  • 16
  • 24

Number of Terminations

  • 10
  • 100
  • 12
  • 14
  • 16
  • 18
  • 20
  • 24
  • 25
  • 28
  • 32
  • 36
  • 40
  • 44
  • 48
  • 56
  • 8

Operating Temperature

  • -20°C~85°C
  • -30°C~70°C
  • -30°C~85°C
  • -40°C~125°C
  • -40°C~85°C
  • -55°C~125°C
  • 0°C~70°C
  • 0°C~85°C

Package / Case

  • 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
  • 100-LQFP
  • 12-XFQFN
  • 14-DIP (0.300, 7.62mm)
  • 14-SOIC (0.154, 3.90mm Width)
  • 14-SSOP (0.209, 5.30mm Width)
  • 16-DIP (0.300, 7.62mm)
  • 16-SOIC (0.154, 3.90mm Width)
  • 16-SOIC (0.209, 5.30mm Width)
  • 16-SOIC (0.295, 7.50mm Width)
  • 16-SSOP (0.154, 3.90mm Width)
  • 16-SSOP (0.154, 3.90mm Width) Exposed Pad
  • 16-SSOP (0.209, 5.30mm Width)
  • 16-TFSOP (0.173, 4.40mm Width)
  • 16-TSSOP (0.173, 4.40mm Width)
  • 16-UFBGA, CSPBGA
  • 16-UFBGA, WLPBGA
  • 16-UFQFN
  • 16-VFQFN Exposed Pad
  • 16-VQFN Exposed Pad
  • 16-WFBGA, DSBGA
  • 16-WFQFN Exposed Pad
  • 16-WQFN Exposed Pad
  • 16-XFBGA
  • 16-XFLGA
  • 16-XFQFN
  • 16-XFQFN Exposed Pad
  • 18-DIP (0.300, 7.62mm)
  • 18-SOIC (0.295, 7.50mm Width)
  • 20-LSSOP (0.173, 4.40mm Width)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-SSOP (0.209, 5.30mm Width)
  • 20-TFSOP (0.173, 4.40mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 20-UFBGA
  • 20-UFQFN Exposed Pad
  • 20-VFQFN Exposed Pad
  • 20-VQFN Exposed Pad
  • 24-DIP (0.600, 15.24mm)
  • 24-SOIC (0.295, 7.50mm Width)
  • 24-SOP (0.236, 6.00mm Width)
  • 24-SSOP (0.154, 3.90mm Width)
  • 24-SSOP (0.209, 5.30mm Width)
  • 24-TFSOP (0.173, 4.40mm Width)
  • 24-TSSOP (0.173, 4.40mm Width)
  • 24-UFBGA
  • 24-VFBGA
  • 24-VFQFN Exposed Pad
  • 24-WFQFN Exposed Pad
  • 24-WFQFN Exposed Pad, CSP
  • 24-XFBGA
  • 24-XFLGA
  • 25-UFBGA, WLCSP
  • 25-WFBGA, WLCSP
  • 25-XFBGA, DSBGA
  • 28-DIP (0.300, 7.62mm)
  • 28-SOIC (0.295, 7.50mm Width)
  • 28-SSOP (0.209, 5.30mm Width)
  • 28-TSSOP (0.173, 4.40mm Width)
  • 28-UFQFN Exposed Pad
  • 28-VQFN Exposed Pad
  • 28-WFQFN Exposed Pad
  • 32-UFQFN Exposed Pad
  • 32-UQFN Exposed Pad
  • 32-WFQFN Exposed Pad
  • 36-BSOP (0.295, 7.50mm Width)
  • 36-SOP (0.311, 7.90mm Width)
  • 36-TFBGA
  • 36-VFBGA
  • 40-CDIP (0.600, 15.24mm)
  • 40-DIP (0.600, 15.24mm)
  • 40-WFQFN Exposed Pad
  • 42-VFBGA
  • 44-LCC (J-Lead)
  • 44-QFP
  • 48-BSSOP (0.295, 7.50mm Width)
  • 56-TFSOP (0.240, 6.10mm Width)
  • 56-VFQFN Exposed Pad
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TFSOJ (0.069, 1.75mm Width)
  • 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
  • 8-UFQFN Exposed Pad
  • 8-VFDFN Exposed Pad
  • 8-XFBGA, DSBGA
  • 8-XFQFN Exposed Pad
  • CDIP
  • Die
  • DIP
  • PDIP
  • PLCC
  • QFN
  • QFP
  • QSOP
  • SOIC
  • SSOP
  • TFSOP
  • TSSOP
  • VQFN

Packaging

  • Bulk
  • Cut Tape (CT)
  • Digi-Reel®
  • Rail/Tube
  • Tape & Reel
  • Tape & Reel (TR)
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Pbfree Code

  • icon-pbfree yes
  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017

Resistance

  • 100Ohm
  • 2.1Ohm
  • 3.8Ohm
  • 6Ohm

Series

  • Agile
  • Automotive, AEC-Q100
  • Xpander Logic™

Supplier Device Package

  • 16-DIP
  • 16-QFN (3x3)
  • 16-QFN (4x4)
  • 16-QSOP
  • 16-SO
  • 16-SOIC
  • 16-SOP
  • 16-SSOP
  • 16-TQFN (4x4)
  • 16-TSSOP
  • 20-BGA Microstar Junior (2.5x3.0)
  • 20-QFN-EP (4x4)
  • 20-SSOP
  • 20-TSSOP
  • 24-HVQFN (4x4)
  • 24-HWQFN (4x4)
  • 24-QFN (4x4)
  • 24-SO
  • 24-SSOP
  • 24-TQFN (4x4)
  • 24-TSSOP
  • 28-SSOP
  • 28-TQFN (5x5)
  • 8-SO
  • 8-TSSOP

Surface Mount

  • NO
  • YES

Terminal Finish

  • MATTE TIN
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL PALLADIUM GOLD
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN
  • Tin (Sn)
  • TIN LEAD
  • Tin/Bismuth (Sn/Bi)
  • Tin/Lead (Sn/Pb)
  • TIN/NICKEL PALLADIUM GOLD
  • Tin/Silver (Sn/Ag)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • TIN/TIN COPPER

Termination

  • DIP
  • SMD/SMT
  • Through Hole

Type

  • Voltage Detector

Weight

  • 1.098005g
  • 1.270087g
  • 128.593437mg
  • 129.500622mg
  • 172.39345mg
  • 172.98879mg
  • 18.99418mg
  • 190.990737mg
  • 2.214806g
  • 2.26799g
  • 2.296311mg
  • 2.386605g
  • 211.997734mg
  • 220.105698mg
  • 24.097095mg
  • 255.5993mg
  • 288.002805mg
  • 307.790773mg
  • 37.194574mg
  • 4.190003g
  • 41.900595mg
  • 42.467586mg
  • 420.395078mg
  • 43.006227mg
  • 45.387587mg
  • 453.59237mg
  • 5.953513g
  • 57.09594mg
  • 59.987591mg
  • 6.54mg
  • 60.186038mg
  • 60.894776mg
  • 600.301152mg
  • 61.887009mg
  • 624.398247mg
  • 657.000198mg
  • 665.986997mg
  • 69.598079mg
  • 70.788759mg
  • 72.603129mg
  • 723.394782mg
  • 76.997305mg
  • 89.499445mg
  • 928.191737mg
  • 951.693491mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Number of Ports Length RoHS Status Lead Free Number of Pins Package / Case Interface Max Supply Voltage REACH SVHC Min Supply Voltage Frequency Width Mounting Type Weight Operating Temperature Technology Nominal Supply Current Max Frequency JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Output Type Terminal Pitch Number of Channels Qualification Status Power Supplies Max Power Dissipation Output Current Feature Power Dissipation Supplier Device Package Number of Bits Number of I/O Voltage - Supply Clock Frequency Current - Output Source/Sink Interrupt Output
    MCP23S08-E/ML MCP23S08-E/ML Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Surface Mount Tray 2006 Active 1 (Unlimited) 125°C -40°C ROHS3 Compliant Lead Free 20 20-VFQFN Exposed Pad SPI 5.5V No SVHC 1.8V 10MHz Surface Mount -40°C~125°C 1mA 10MHz MCP23S08 Push-Pull 1 POR 700mW 20-QFN-EP (4x4) 8 1.8V~5.5V 10MHz 25mA Yes
    MCP23017-E/ML MCP23017-E/ML Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks Surface Mount Tube 2005 yes Active 1 (Unlimited) 28 EAR99 2 6mm ROHS3 Compliant Lead Free 28 28-VQFN Exposed Pad I2C No SVHC 6mm Surface Mount 70.788759mg -40°C~125°C CMOS 1mA e3 Matte Tin (Sn) - annealed QUAD NO LEAD 260 5V 40 MCP23017 28 Push-Pull 0.65mm 1 Not Qualified 5V 700mW 25mA POR 16 16 1.8V~5.5V 1.7MHz Yes
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