Items : %s%s
Gate Drivers ICs
Contact Plating
- Gold
- Tin
ECCN Code
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 3 Weeks
- 30 Weeks
- 33 Weeks
- 34 Weeks
- 35 Weeks
- 36 Weeks
- 37 Weeks
- 39 Weeks
- 4 Weeks
- 42 Weeks
- 48 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 79 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
Feature
- Latched Fault
- UVLO
JESD-609 Code
- e0
- e1
- e3
- e3/e4
- e4
- e6
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 10 hours ago)
- ACTIVE (Last Updated: 12 hours ago)
- ACTIVE (Last Updated: 16 hours ago)
- ACTIVE (Last Updated: 19 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 2 weeks ago)
- ACTIVE (Last Updated: 20 hours ago)
- ACTIVE (Last Updated: 21 hours ago)
- ACTIVE (Last Updated: 22 hours ago)
- ACTIVE (Last Updated: 23 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- ACTIVE (Last Updated: 8 months ago)
- ACTIVE, NOT REC (Last Updated: 1 day ago)
- ACTIVE, NOT REC (Last Updated: 2 days ago)
- ACTIVE, NOT REC (Last Updated: 4 days ago)
- CONSULT SALES OFFICE (Last Updated: 2 weeks ago)
- LAST SHIPMENTS (Last Updated: 1 day ago)
- LAST SHIPMENTS (Last Updated: 1 week ago)
- LAST SHIPMENTS (Last Updated: 18 hours ago)
- LAST SHIPMENTS (Last Updated: 2 days ago)
- LAST SHIPMENTS (Last Updated: 2 weeks ago)
- LAST SHIPMENTS (Last Updated: 3 days ago)
- LAST SHIPMENTS (Last Updated: 4 days ago)
- LIFETIME (Last Updated: 1 day ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 3 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 days ago)
- NRND (Last Updated: 6 months ago)
- NRND (Last Updated: 7 months ago)
- NRND (Last Updated: 8 months ago)
- OBSOLETE (Last Updated: 1 day ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 3 days ago)
- OBSOLETE (Last Updated: 4 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- PRE-RELEASE (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
- PRODUCTION (Last Updated: 6 days ago)
Manufacturer Package Identifier
- 0016023 C
- 14-Lead PDIP
- M8.15E
- MS8E-8-05-08-1662
- PG-DIP-14-903
- pwp (r-pdso-g14)
- SOICN-8LD-PL-1
- SOT26 (SC74R)
Max Operating Temperature
- 100°C
- 105°C
- 110°C
- 115°C
- 125 °C
- 125°C
- 135°C
- 140°C
- 150°C
- 60°C
- 70 °C
- 70°C
- 85°C
Min Operating Temperature
- -10°C
- -20°C
- -25°C
- -40 °C
- -40°C
- -55 °C
- -55°C
- -65°C
- 0 °C
- 0°C
- 25°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- Not Applicable
- Vendor Undefined
Mount
- Chassis Mount
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Chassis Mount
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 10
- 12
- 13
- 14
- 15
- 16
- 18
- 20
- 21
- 24
- 28
- 32
- 34
- 36
- 4
- 40
- 44
- 48
- 5
- 54
- 6
- 60
- 64
- 8
- 9
Number of Positions
- 16
Number of Terminals
- 10
- 12
- 14
- 16
- 20
- 8
Number of Terminations
- 10
- 12
- 13
- 14
- 15
- 16
- 18
- 19
- 20
- 21
- 24
- 28
- 30
- 31
- 32
- 34
- 36
- 4
- 40
- 44
- 48
- 5
- 51
- 54
- 56
- 6
- 64
- 68
- 7
- 8
- 9
Operating Temperature
- -10°C~125°C TJ
- -10°C~150°C TJ
- -20°C~125°C TJ
- -20°C~150°C TJ
- -20°C~60°C TA
- -20°C~70°C TA
- -20°C~85°C
- -20°C~85°C TA
- -25°C~125°C TA
- -25°C~125°C TJ
- -25°C~150°C TJ
- -25°C~70°C TA
- -25°C~85°C
- -25°C~85°C TA
- -30°C~125°C TJ
- -30°C~85°C TA
- -40°C~100°C TA
- -40°C~105°C TA
- -40°C~105°C TJ
- -40°C~115°C TA
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~130°C TJ
- -40°C~140°C TJ
- -40°C~150°C TA
- -40°C~150°C TJ
- -40°C~175°C TJ
- -40°C~85°C
- -40°C~85°C TA
- -40°C~85°C TJ
- -45°C~125°C TJ
- -55°C~115°C TJ
- -55°C~125°C
- -55°C~125°C TA
- -55°C~125°C TJ
- -55°C~150°C
- -55°C~150°C TJ
- -55°C~155°C TJ
- -55°C~85°C TA
- -65°C~150°C TJ
- 0°C~125°C TJ
- 0°C~150°C TJ
- 0°C~70°C
- 0°C~70°C TA
- 0°C~85°C TA
- 125°C TJ
- 150°C TJ
Package / Case
- 10-SMD, Flat Lead
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 10-UFDFN Exposed Pad
- 10-VDFN Exposed Pad
- 10-VFDFN Exposed Pad
- 10-VFDFN Exposed Pad, 9 Leads
- 10-WDFN Exposed Pad
- 10-WFDFN Exposed Pad
- 11-SIP, 9 Leads
- 12-SIP
- 12-VFDFN Exposed Pad
- 12-VQFN Exposed Pad
- 12-WFBGA
- 12-WFBGA, DSBGA
- 12-WFDFN Exposed Pad
- 12-WQFN Exposed Pad
- 125
- 13-TFLGA
- 14-CDIP (0.300, 7.62mm)
- 14-DIP (0.300, 7.62mm)
- 14-DIP (0.300, 7.62mm), 13 Leads
- 14-LSSOP (0.154, 3.90mm Width) Exposed Pad
- 14-PowerTSSOP (0.173, 4.40mm Width)
- 14-SIP Module, 10 Leads
- 14-SIP Module, 12 Leads
- 14-SOIC (0.154, 3.90mm Width)
- 14-SOIC (0.154, 3.90mm Width) Exposed Pad
- 14-SOIC (0.209, 5.30mm Width)
- 14-SOIC (0.295, 7.50mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 14-VFQFN Exposed Pad
- 15-VFQFN
- 15-WFBGA, WLBGA
- 16-DIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm), 14 Leads
- 16-LSSOP (0.173, 4.40mm Width)
- 16-PowerSOIC (0.350, 8.89mm Width), 15 Leads
- 16-PowerTSSOP (0.173, 4.40mm Width)
- 16-SMD
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.154, 3.90mm Width) Exposed Pad
- 16-SOIC (0.154, 3.90mm Width), 14 Leads
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-TFSOP (0.118, 3.00mm Width) Exposed Pad
- 16-TFSOP (0.118, 3.00mm Width) Exposed Pad, 12 Leads
- 16-TSSOP (0.173, 4.40mm Width)
- 16-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 16-VDFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VFQFN Exposed Pad, 14 Leads
- 16-VQFN Exposed Pad
- 16-WFDFN Exposed Pad
- 16-WQFN Exposed Pad
- 18-DIP (0.300, 7.62mm)
- 18-PowerUFQFN
- 18-SOIC (0.295, 7.50mm Width)
- 18-SOIC (0.295, 7.50mm Width) Exposed Pad
- 180-VFBGA
- 19-WFQFN Exposed Pad
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-LSSOP (0.240, 6.10mm Width)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SOIC (0.295, 7.50mm Width), 18 Leads
- 20-SSOP (0.209, 5.30mm Width)
- 20-SSOP (0.240, 6.10mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 20-WFQFN Exposed Pad
- 21-SIP Module
- 24-DIP (0.300, 7.62mm)
- 24-LSSOP (0.154, 3.90mm Width) Exposed Pad
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.209, 5.30mm Width)
- 24-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VSSOP (0.220, 5.60mm Width) Exposed Pad
- 24-WQFN Exposed Pad
- 28-DIP (0.600, 15.24mm)
- 28-SIP, 15 Leads
- 28-SOIC (0.295, 7.50mm Width)
- 28-SOIC (0.295, 7.50mm Width), 24 Leads
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 28-UFQFN Exposed Pad
- 28-VFQFN Exposed Pad
- 30-SIP Module, 21 Leads
- 31-PowerWFQFN
- 32-BSSOP (0.295, 7.50mm Width)
- 32-LQFP
- 32-TQFP Exposed Pad
- 32-TSSOP (0.240, 6.10mm Width)
- 32-VFQFN Exposed Pad
- 34-DIP Module, 31 Leads
- 36-BSSOP (0.295, 7.50mm Width), 32 Leads
- 36-BSSOP (0.433, 11.00mm Width) Exposed Pad
- 36-DIP Module, 24 Leads
- 36-SOP (0.330, 8.40mm Width)
- 36-TFQFN Exposed Pad
- 37-VFQFN Exposed Pad
- 38-TFSOP (0.173, 4.40mm Width)
- 39-PowerVFQFN
- 4-UDFN Exposed Pad, 4-TMLF®
- 4-UQFN
- 40-VFQFN Exposed Pad
- 44-DIP Module, 28 Leads
- 44-DIP Module, 42 Leads
- 44-LCC (J-Lead)
- 44-LCC (J-Lead), 32 Leads
- 45-DIP Module, 43 Leads
- 48-PowerTQFP
- 48-TQFP Exposed Pad
- 48-VFQFN
- 48-VFQFN Exposed Pad
- 48-VFQFN Exposed Pad, 34 Leads
- 6-SMD, Flat Lead Exposed Pad
- 6-SMD, Flat Leads
- 6-TSSOP, SC-88, SOT-363
- 6-UFBGA, DSBGA
- 6-UFBGA, WLCSP
- 6-VDFN Exposed Pad
- 6-WDFN Exposed Pad
- 6-XFDFN Exposed Pad
- 64-BQFP
- 64-LQFP Exposed Pad
- 64-TQFP Exposed Pad
- 68-DIP Module, 58 Leads
- 68-PLCC
- 7-SMD, Flat Lead
- 8-CDIP (0.300, 7.62mm)
- 8-DIP (0.300, 7.62mm)
- 8-DIP (0.300, 7.62mm), 6 Leads
- 8-PowerSOIC (0.154, 3.90mm Width)
- 8-SIP Module, 5 Leads
- 8-SIP Module, 6 Leads
- 8-SMD, Flat Lead
- 8-SMD, Gull Wing
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.154, 3.90mm Width) Exposed Pad
- 8-SOIC (0.173, 4.40mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
- 8-VDFN Exposed Pad
- 8-VDFN Exposed Pad, 8-MLF®
- 8-VFDFN Exposed Pad
- 8-VFDFN Exposed Pad, 8-MLF®
- 8-VFDFN Exposed Pad, CSP
- 8-VQFN Exposed Pad
- 8-WDFN Exposed Pad
- 8-WFDFN Exposed Pad
- 8-WQFN Exposed Pad
- 9-VFDFN Exposed Pad
- 9-WDFN Exposed Pad
- CDIP
- CLCC
- DFN
- DFN EP
- Die
- DIP
- HTSSOP EP
- LCC
- LQFP
- Metal
- Module
- MSOP
- N
- PDIP
- PLCC
- QFN
- QSOP
- S
- SC-74A, SOT-753
- SO
- SOIC
- SOIC N
- SOIC W
- SOP
- SOT
- SOT-143
- SOT-23
- SOT-23-5
- SOT-23-5 Thin, TSOT-23-5
- SOT-23-6
- SOT-23-6 Thin, TSOT-23-6
- SOT-665
- SSOP
- TO-220-5
- TO-220-5 Formed Leads
- TO-253-4, TO-253AA
- TO-263-6, D2Pak (5 Leads + Tab), TO-263BA
- TO-263-7, D2Pak (6 Leads + Tab), TO-263CB
- TSOT
- TSSOP
- VQFN
Packaging
- Box
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Rail/Tube
- Strip
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- LTB
- Not For New Designs
- NRND
- Obsolete
- Preliminary
- Unconfirmed
Pbfree Code
- icon-pbfree yes
- no
- yes
Published
- 1993
- 1994
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 1.5Ohm
- 1.85Ohm
- 100mOhm
- 100Ohm
- 10kOhm
- 11Ohm
- 125Ohm
- 12Ohm
- 14Ohm
- 2.3Ohm
- 2.7Ohm
- 200Ohm
- 20Ohm
- 28Ohm
- 30Ohm
- 310mOhm
- 4Ohm
- 5Ohm
- 60Ohm
- 75Ohm
- 9.5mOhm
Series
- Advanced Smart Rectifier™
- Automotive
- Automotive, AEC-Q100
- Automotive, AEC-Q100, EiceDriver™
- Automotive, AEC-Q100, FLEXMOS™
- Automotive, AEC-Q101
- Combi-Sense®
- CoreControl™
- EiceDriver™
- FLEXMOS™
- iMOTION™
- ISL78424
- ISL78434
- ISL78444
- ISOSMART™
- IttyBitty®
- Military, MIL-STD-883
- SCALE™-1
- SCALE™-2
- SmartRectifier™
- µHVIC™
Supplier Device Package
- 10-DFN (3x3)
- 10-QFN (3x3)
- 10-QFN (4x4)
- 10-TDFN (2.5x2.5)
- 10-TDFN (4x4)
- 10-TDFN-EP (3x3)
- 10-WSON (4x4)
- 11-SIP
- 14-DIP
- 14-HTSSOP
- 14-PDIP
- 14-SOIC
- 14-SOP
- 16-HTSSOP
- 16-MLP (7x6)
- 16-MLPQ (4x4)
- 16-PDIP
- 16-QFN (3x3)
- 16-QFN (4x4)
- 16-QSOP
- 16-SOIC
- 16-SOIC-EP
- 16-TDFN (5x3)
- 16-TSSOP
- 18-DIP
- 18-SOIC
- 20-PLCC (9x9)
- 20-SOIC
- 20-SSOP
- 24-SOIC
- 24-SOP
- 24-SSOP
- 28-PDIP
- 28-QFN (4x4)
- 28-SOIC
- 28-SSOP
- 28-TSSOP
- 32-QFN (5x5)
- 4-TQFN (1.2x1.2)
- 44-PLCC
- 44-PLCC, 32 Leads (16.58x16.58)
- 6-DFN (1.6x1.6)
- 6-TDFN-EP (3x3)
- 6-WSON (3x3)
- 64-MQFP (20x14)
- 8-CERDIP
- 8-DFN (2x2)
- 8-DFN (2x3)
- 8-DFN (3x3)
- 8-DFN-EP (2x2)
- 8-DFN-EP (3x3)
- 8-DFN-EP (5x4)
- 8-DIP
- 8-LFCSP
- 8-MLF® (2x2)
- 8-MLF® (3x3)
- 8-MLP (3x3)
- 8-MLP (5x6)
- 8-MSOP
- 8-MSOP-EP
- 8-MSOP-PowerPad
- 8-PDIP
- 8-QFN (3x3)
- 8-SO
- 8-SO PowerPad
- 8-SOIC
- 8-SOIC-EP
- 8-SON
- 8-SOP
- 8-TDFN (3x3)
- 8-TSSOP
- 8-uMAX
- 8-uMax-EP
- 8-WDFN (3x3)
- Die
- Module
- OctaPAK 7+1
- P-DSO-20-7
- SOT-143
- SOT-23-6
- SOT-89-5
- TO-220-5
- TO-263
- TO-263 (D2Pak)
- TO-263-5
- TSOT-23-6
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Matte Tin (Sn) - with Nickel (Ni) barrier
- MATTE TIN/NICKEL PALLADIUM GOLD
- NICKEL PALLADIUM GOLD
- Nickel/Gold/Palladium (Ni/Au/Pd)
- Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- NOT SPECIFIED
- Pure Tin (Sn)
- TIN
- Tin (Sn)
- Tin (Sn) - with Nickel (Ni) barrier
- TIN LEAD
- TIN SILVER COPPER
- Tin/Bismuth (Sn/Bi)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
- Through Hole
Type
- FET
- IGBT
- IGBT|MOSFET
- Integrated Circuit (IC)
- MOSFET
- MOSFET|IGBT
Weight
- 1.04g
- 1.053808g
- 1.098005g
- 1.098g
- 1.206g
- 1.59999g
- 1.620005g
- 1.930007g
- 10.886217mg
- 122.611688mg
- 124.596154mg
- 129mg
- 13.012431mg
- 133.412856mg
- 14.996898mg
- 140.30179mg
- 141.690917mg
- 142.994995mg
- 143.703733mg
- 143mg
- 150mg
- 156.489368mg
- 157.991892mg
- 170.494032mg
- 172.109955mg
- 172.39345mg
- 173.300635mg
- 181.692094mg
- 188.609377mg
- 2.214806g
- 2.26799g
- 2.299997g
- 2.386605g
- 206.101033mg
- 208.397344mg
- 21.99923mg
- 210.013267mg
- 218.3mg
- 23.700201mg
- 230.4mg
- 24.012046mg
- 24.408939mg
- 259.19969mg
- 29.993795mg
- 3.000003g
- 30mg
- 338.011364mg
- 36.003894mg
- 37.393021mg
- 39.008944mg
- 4.535924g
- 440.409842 mg
- 440.409842mg
- 449.991981mg
- 473.692182mg
- 496mg
- 50.008559mg
- 506.605978mg
- 510.007921mg
- 528.605208mg
- 540.001716mg
- 550.009098mg
- 57.09594mg
- 58.003124mg
- 599.989307mg
- 62.709145mg
- 665.986997mg
- 70.590313mg
- 72.603129mg
- 73.992255mg
- 74.162352mg
- 75.891673mg
- 787.436354mg
- 800.987426mg
- 801mg
- 82.298666mg
- 851mg
- 9.695537mg
- 930.006106mg
- 951.693491mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Package / Case | REACH SVHC | Number of Drivers | Height | Width | Mounting Type | Operating Temperature | Technology | Max Supply Current | Input Type | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Subcategory | Power Supplies | Max Power Dissipation | Number of Outputs | Max Output Current | Power Dissipation | Propagation Delay | Turn On Delay Time | Interface IC Type | Rise Time | Fall Time (Typ) | Turn On Time | Channel Type | Voltage - Supply | Output Peak Current Limit-Nom | Turn Off Time | High Side Driver | Rise / Fall Time (Typ) | Driven Configuration | Gate Type | Current - Peak Output (Source, Sink) | Logic Voltage - VIL, VIH | High Side Voltage - Max (Bootstrap) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MIC4609YWM-TR | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 24 Weeks | Surface Mount | Tape & Reel (TR) | 2015 | Active | 3 (168 Hours) | EAR99 | ROHS3 Compliant | 28 | 28-SOIC (0.295, 7.50mm Width) | 6 | Surface Mount | -40°C~125°C TJ | Non-Inverting | 8542.39.00.01 | e3 | Matte Tin (Sn) - annealed | 250 | 40 | MIC4609 | 1A | BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER | 3-Phase | 10V~20V | 20ns 20ns | Half-Bridge | IGBT, N-Channel, P-Channel MOSFET | 1A 1A | 0.8V 2.2V | 600V | |||||||||||||||||||||||||||||||
 |
TC4426AEPA | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole | Tube | 2004 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 10.16mm | ROHS3 Compliant | Lead Free | No | 8 | 8-DIP (0.300, 7.62mm) | No SVHC | 2 | 4.06mm | 6.6mm | Through Hole | -40°C~150°C TJ | CMOS | 2mA | Inverting | 2 | 4.5mA | e3 | Matte Tin (Sn) | DUAL | TC4426A | 8 | MOSFET Drivers | 730mW | 1.5A | 730mW | 35 ns | 35 ns | BUFFER OR INVERTER BASED MOSFET DRIVER | 35ns | 35 ns | 0.045 μs | Independent | 4.5V~18V | 1.5A | 0.045 μs | YES | 25ns 25ns | Low-Side | N-Channel, P-Channel MOSFET | 1.5A 1.5A | 0.8V 2.4V | ||||||||||
 |
TC4423COE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2004 | yes | Active | 1 (Unlimited) | 16 | EAR99 | 10.3mm | ROHS3 Compliant | No | 16 | 16-SOIC (0.295, 7.50mm Width) | 2.31mm | 7.49mm | Surface Mount | 0°C~150°C TJ | CMOS | 2.5mA | Inverting | 2 | 2.5mA | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | TC4423 | 16 | MOSFET Drivers | 4.5/18V | 470mW | 2 | 3A | 470mW | 75 ns | 75 ns | BUFFER OR INVERTER BASED MOSFET DRIVER | 35ns | 35 ns | 0.1 μs | Independent | 4.5V~18V | 3A | 0.1 μs | YES | 23ns 25ns | Low-Side | N-Channel, P-Channel MOSFET | 3A 3A | 0.8V 2.4V | ||||||||
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TC4429EMF713 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2001 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | 1 | 5mm | Surface Mount | -40°C~150°C TJ | CMOS | 1.5mA | Inverting | 0.95mm | 1 | 3mA | e3 | Matte Tin (Sn) | QUAD | 260 | 40 | TC4429 | 8 | MOSFET Drivers | 6A | 75 ns | 75 ns | BUFFER OR INVERTER BASED MOSFET DRIVER | 35ns | 35 ns | Single | 4.5V~18V | 6A | YES | 25ns 25ns | Low-Side | N-Channel, P-Channel MOSFET | 6A 6A | 0.8V 2.4V |
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Surface Mount Tape & Reel (TR) Active EAR99 Gate Drivers ICs Non-Inverting 6 600V V 28-SOIC (0.295, 7.50mm Width) MIC4609 Half-Bridge
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TC4426AEPA Microchip Technology
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