Items : %s%s
Full & Half-Bridge Drivers ICs
Contact Plating
- Copper, Tin
- Gold
- Tin
Diode Element Material
- SILICON
ECCN Code
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 29 Weeks
- 3 Weeks
- 30 Weeks
- 32 Weeks
- 36 Weeks
- 39 Weeks
- 4 Weeks
- 41 Weeks
- 42 Weeks
- 44 Weeks
- 46 Weeks
- 48 Weeks
- 5 Weeks
- 52 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
Feature
- 5V Regulated Output
- 5V Regulated Output, Status Flag
- Auto Restart
- Auto Restart, Bootstrap Circuit
- Auto Restart, Bootstrap Circuit, Status Flag
- Auto Restart, Charge Pump
- Auto Restart, Slew Rate Controlled
- Auto Restart, Status Flag
- Bootstrap Circuit
- Bootstrap Circuit, 5V Regulated Output
- Bootstrap Circuit, Diode Emulation
- Bootstrap Circuit, Diode Emulation, Status Flag
- Bootstrap Circuit, Internal Oscillator
- Bootstrap Circuit, Latch Function, Status Flag
- Bootstrap Circuit, Status Flag
- Charge Pump
- Charge Pump, Slew Rate Controlled, Status Flag
- Charge Pump, Status Flag
- Diode Emulation, Status Flag
- Internal Oscillator, Status Flag, Watchdog Timer
- Internal Oscillator, Watchdog Timer
- Internal Oscillators
- Latch Function, Slew Rate Controlled, Status Flag
- Slew Rate Controlled
- Slew Rate Controlled, Status Flag
- Status Flag
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e2
- e4
- e6
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 14 hours ago)
- ACTIVE (Last Updated: 16 hours ago)
- ACTIVE (Last Updated: 19 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 20 hours ago)
- ACTIVE (Last Updated: 21 hours ago)
- ACTIVE (Last Updated: 22 hours ago)
- ACTIVE (Last Updated: 23 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- ACTIVE (Last Updated: 8 months ago)
- ACTIVE, NOT REC (Last Updated: 1 week ago)
- ACTIVE, NOT REC (Last Updated: 3 days ago)
- ACTIVE, NOT REC (Last Updated: 4 days ago)
- ACTIVE, NOT REC (Last Updated: 4 hours ago)
- ACTIVE, NOT REC (Last Updated: 5 days ago)
- ACTIVE, NOT REC (Last Updated: 6 days ago)
- LAST SHIPMENTS (Last Updated: 1 month ago)
- LAST SHIPMENTS (Last Updated: 1 week ago)
- LAST SHIPMENTS (Last Updated: 2 days ago)
- LAST SHIPMENTS (Last Updated: 3 days ago)
- LAST SHIPMENTS (Last Updated: 3 weeks ago)
- LAST SHIPMENTS (Last Updated: 4 weeks ago)
- LAST SHIPMENTS (Last Updated: 5 days ago)
- LIFETIME (Last Updated: 1 day ago)
- LIFETIME (Last Updated: 1 week ago)
- LIFETIME (Last Updated: 2 days ago)
- LIFETIME (Last Updated: 2 weeks ago)
- LIFETIME (Last Updated: 3 days ago)
- LIFETIME (Last Updated: 5 days ago)
- NRND (Last Updated: 7 months ago)
- NRND (Last Updated: 8 months ago)
- OBSOLETE (Last Updated: 1 day ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 20 hours ago)
- OBSOLETE (Last Updated: 3 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 2 weeks ago)
Manufacturer Package Identifier
- SO20-SO20MEC
- VFQFPN
Max Operating Temperature
- 125°C
- 150°C
- 70°C
- 80°C
- 85°C
- 90°C
- 95°C
Min Operating Temperature
- -20°C
- -25°C
- -30°C
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- Not Applicable
Mount
- PCB, Through Hole
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 17
- 18
- 19
- 20
- 21
- 22
- 23
- 24
- 25
- 27
- 28
- 29
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 38
- 40
- 41
- 44
- 48
- 5
- 56
- 6
- 7
- 8
- 9
Number of Terminations
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 18
- 19
- 2
- 20
- 21
- 22
- 23
- 24
- 25
- 27
- 28
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 37
- 39
- 40
- 41
- 43
- 44
- 48
- 5
- 54
- 56
- 6
- 68
- 7
- 8
- 9
Operating Temperature
- -10°C~100°C
- -10°C~70°C TA
- -20°C~100°C TA
- -20°C~100°C TJ
- -20°C~125°C TJ
- -20°C~150°C TJ
- -20°C~60°C TA
- -20°C~70°C TA
- -20°C~75°C TA
- -20°C~80°C TA
- -20°C~85°C TA
- -20°C~90°C TA
- -25°C~125°C TJ
- -25°C~150°C TJ
- -25°C~75°C TA
- -25°C~85°C
- -30°C~100°C TA
- -30°C~110°C TA
- -30°C~150°C TJ
- -30°C~75°C TA
- -30°C~80°C TA
- -30°C~85°C TA
- -30°C~90°C TA
- -30°C~95°C TA
- -35°C~85°C TA
- -40°C~100°C TA
- -40°C~105°C TA
- -40°C~110°C TJ
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TC
- -40°C~125°C TJ
- -40°C~150°C TA
- -40°C~150°C TJ
- -40°C~165°C TJ
- -40°C~170°C TJ
- -40°C~175°C TJ
- -40°C~85°C TA
- -40°C~85°C TJ
- -40°C~90°C TA
- -40°C~95°C TA
- -55°C~150°C
- -55°C~150°C TA
- -55°C~150°C TJ
- -55°C~175°C TJ
- 0°C~125°C TJ
- 0°C~150°C TJ
- 0°C~70°C
- 125°C TJ
- 150°C TJ
- 175°C TJ
Package / Case
- 10-LSOP (0.173, 4.40mm Width)
- 10-PowerDIP Module
- 10-PowerVFDFN
- 10-SIP
- 10-SOP (0.154, 3.90mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 10-UFDFN
- 10-UFDFN Exposed Pad
- 10-VDFN Exposed Pad
- 10-VFBGA
- 10-WFDFN Exposed Pad
- 12-BSOP (0.295, 7.50mm Width) Exposed Pad
- 12-Power LFDFN
- 12-PowerDIP, Module
- 12-PowerSIP
- 12-PowerSIP, Formed Leads
- 12-PowerTFDFN
- 12-SIP
- 12-SIP, 11 Leads
- 12-VFDFN Exposed Pad
- 14-LSOP (0.173, 4.40mm Width)
- 14-LSSOP (0.173, 4.40mm Width) + 2 Heat Tabs
- 14-SOIC (0.154, 3.90mm Width)
- 14-SOIC (0.173, 4.40mm Width)
- 14-SOP (0.173, 4.40mm Width)
- 14-TSSOP (0.154, 3.90mm Width) Exposed Pad
- 14-VFQFN Exposed Pad
- 15-UFBGA, CSPBGA
- 16-DIP (0.300, 7.62mm)
- 16-LSOP (0.213, 5.40mm Width) + 4 Heat Tabs
- 16-LSSOP (0.173, 4.40mm Width)
- 16-SIP Formed Leads
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.154, 3.90mm Width) Exposed Pad
- 16-SOIC (0.173, 4.40mm Width)
- 16-SOIC (0.209, 5.30mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SOIC (0.295, 7.50mm Width) Exposed Pad
- 16-SSIP, 13 Leads, Exposed Pad, Formed Leads
- 16-TQFN Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 16-UFBGA, WLCSP
- 16-UFQFN Exposed Pad
- 16-VFQFN
- 16-VFQFN Exposed Pad
- 17-PowerVQFN
- 17-VFBGA, CSPBGA
- 18-DIP (0.300, 7.62mm)
- 18-DIP Module
- 18-PowerTFDFN
- 18-PowerWFDFN
- 18-VFBGA
- 18-VFQFN Exposed Pad
- 19-SSIP Formed Leads
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-LSSOP (0.154, 3.90mm Width)
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SOIC (0.433, 11.00mm Width) Exposed Pad
- 20-TSSOP (0.173, 4.40mm Width)
- 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 20-VFSOP (0.173, 4.40mm Width)
- 20-WFQFN Exposed Pad
- 22-PowerLFDFN
- 22-PowerWFQFN
- 22-SIP, 18 Leads, Formed Leads
- 23-DIP Module
- 23-PowerDIP Module (0.551, 14.00mm)
- 23-PowerSMD Module, Gull Wing
- 23-SIP Formed Leads
- 23-SIP, 19 Leads, Formed Leads
- 24-BSOP (0.295, 7.50mm Width) Exposed Pad
- 24-LSSOP (0.154, 3.90mm Width) Exposed Pad
- 24-PowerBSOP (0.295, 7.50mm Width)
- 24-PowerDIP (0.300, 7.62mm)
- 24-PowerSMD Module (0.425, 10.80mm Width), 17 Leads
- 24-PowerTFQFN
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSIP Exposed Pad, Formed Leads
- 24-SSIP Formed Leads
- 24-SSOP (0.154, 3.90mm Width)
- 24-TFSOP (0.173, 4.40mm Width)
- 24-TSSOP (0.154, 3.90mm Width) Exposed Pad
- 24-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFBGA
- 24-WFQFN Exposed Pad
- 25-PowerVFQFN
- 25-SOP (0.213, 5.40mm Width) + 2 Heat Tabs
- 27-PowerVQFN
- 28-LCC (J-Lead)
- 28-LSSOP (0.220, 5.60mm Width)
- 28-PowerVQFN
- 28-SOIC (0.295, 7.50mm Width)
- 28-SOP (0.295, 7.50mm Width)
- 28-SOP (0.295, 7.50mm Width) + 2 Heat Tabs
- 28-SOP (0.449, 11.40mm Width), 23 Leads
- 28-VFQFN Exposed Pad
- 28-VQFN Exposed Pad
- 29-PowerWFQFN
- 29-SSIP Module, 21 Leads, Formed Leads
- 30-PowerTFQFN
- 30-PowerVFQFN
- 30-SDMP
- 31-PowerVFQFN
- 31-PowerVQFN
- 31-PowerWFQFN
- 32-BSSOP (0.295, 7.50mm Width) Exposed Pad
- 32-PowerDIP Module, 23 Leads
- 32-PowerQFN
- 32-PowerSMD Module, 23 Leads
- 32-PowerVFQFN
- 32-PowerWFQFN
- 32-PowerWFQFN, Module
- 32-SSOP (0.295, 7.50mm Width) Exposed Pad
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 32-WFBGA, WLBGA
- 32-WFQFN Exposed Pad
- 33-PowerDIP (1.307, 33.20mm)
- 33-PowerDIP (1.307, 33.20mm) Exposed Pad
- 34-PowerWFQFN
- 35-SSIP, 25 Leads
- 35-SSIP, 25 Leads, Formed Leads
- 35-VFBGA
- 36-BFSOP (0.295, 7.50mm Width) Exposed Pad
- 36-BSSOP (0.295, 7.50mm Width) Exposed Pad
- 36-BSSOP (0.433, 11.00mm Width) Exposed Pad
- 36-FSOP (0.295, 7.50mm Width) Exposed Pad
- 36-PowerBFSOP (0.295, 7.50mm Width)
- 36-PowerFSOP (0.295, 7.50mm Width)
- 36-PowerVQFN
- 36-PowerWFQFN
- 36-SMD Module
- 36-SOP (0.295, 7.50mm Width) + 2 Heat Tabs
- 36-VFQFN Exposed Pad
- 38-DIP Module, 24 Leads
- 38-SDIP Module, 24 Leads, Formed
- 39-PowerVFQFN
- 40-DIP (0.657, 16.70mm), 29 Leads
- 40-PowerTFQFN
- 40-PowerWFQFN Module
- 40-TFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 41-PowerTFQFN
- 44-BSSOP (0.433, 11.00mm Width) Exposed Pad
- 44-DIP Module, 37 Leads
- 44-TSSOP (0.244, 6.20mm Width) Exposed Pad
- 44-VSOP (0.295, 7.50mm Width) Exposed Pad
- 46-PowerVFQFN
- 48-LQFP
- 48-TQFP
- 48-VFQFN Exposed Pad
- 54-SOP (0.449, 11.40mm Width) Exposed Pad
- 54-SOP (0.449, 11.40mm Width), 23 Leads
- 54-SOP (0.449, 11.40mm Width), 36 Leads
- 54-VSSOP (0.295, 7.50mm Width) Exposed Pad
- 56-PowerWFQFN Module
- 56-VFQFN Exposed Pad
- 6-UFBGA, CSPBGA
- 64-LQFP
- 64-PowerQFP
- 64-TQFP Exposed Pad
- 68-VFQFN Exposed Pad
- 8-PowerVFDFN
- 8-SMD, Flat Lead
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.154, 3.90mm Width) Exposed Pad
- 8-SOIC (0.173, 4.40mm Width)
- 8-TFSOJ (0.069, 1.75mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-UFDFN Exposed Pad
- 8-VSSOP, 8-MSOP (0.118, 3.00mm Width)
- 9-SIP
- 9-SIP, 7 Leads
- 9-SMD Module
- DFN
- LQFP
- LSOP
- Module
- Multiwatt-11 (Vertical, Bent and Staggered Leads)
- Multiwatt-15 (Horizontal, Bent and Staggered Leads)
- Multiwatt-15 (Vertical, Bent and Staggered Leads)
- PowerPAK® MLP4535-22L
- PowerPAK® MLP55-31L
- QFN
- QFN EP
- SIP
- SOIC
- SSOP
- TO-220-5
- TO-220-7
- TO-263-18 (15 Leads + 3 Tabs)
- TO-263-8, D2Pak (7 Leads + Tab), TO-263CA
- TO-3-8
- TSSOP
Packaging
- Box
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Tape & Box (TB)
- Tape & Reel
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 1.2Ohm
- 1.53Ohm
- 1.5Ohm
- 100mOhm
- 145mOhm
- 160mOhm
- 1Ohm
- 300mOhm
- 340MOhm
- 3Ohm
- 500mOhm
- 50mOhm
- 600MOhm
- 60mOhm
- 6mOhm
- 740mOhm
- 800mOhm
Series
- Apex Precision Power®
- ASPM™
- ASPM™, FastSwitch™
- Automotive, AEC-Q100
- BridgeSwitch
- CoreControl™
- HiperLCS™
- Intelli-Phase™
- NexFET™
- NovalithIC™
- OMNIFET III™, VIPower™
- OMNIFET II™, VIPower™
- PowerTrench®
- PowerTrench®, SyncFET™
- PowIRstage®
- STSPIN2
- TrilithIC™
- VIPower™
- VRPower®
- XS™ DrMOS
- µIPM™
- µIPM™-DIP
Supplier Device Package
- 10-BGA (2.9x1.1)
- 10-MFPSK
- 10-SIP
- 10-SOIC
- 12-POWER SIP
- 12-PowerDip
- 12-SIP
- 14-MFPS
- 14-SOIC
- 14-SOIC / 14MFPS
- 16-DIP
- 16-FCQFN (6x3.75)
- 16-MFP
- 16-PDIP
- 16-QFN (3x3)
- 16-QFN (6x3.75)
- 16-SIP
- 16-SO
- 16-SSOP
- 16-WLCSP (1.96x1.96)
- 16MFPFS
- 17-PQFN (5x6)
- 17-WLCSP (2.41x1.91)
- 18-BGA (2.41x1.91)
- 18-FCTQFN-EP (5x5)
- 19-SIP
- 19-WLCSP (2.41x1.91)
- 20-HSOP
- 20-PLCC (9x9)
- 20-SSOP
- 20-TSSOP
- 21-SIP
- 22-SIP
- 23-DIP
- 23-SIP
- 24-EQFN-LE (4x4)
- 24-HQFN (4x4)
- 24-QFN (4x4)
- 24-SO
- 24-TSSOP
- 24-VQFN (5x5)
- 28-SO
- 29-FC-TQFN (4x6)
- 30-SDMP
- 32-QFN (5x5)
- 32-WLP (2.47x2.47)
- 34-TQFN (6x6)
- 35-SIP
- 40-PQFN (6x6)
- 40-QFN (5x5)
- 40-QFN (6x6)
- 44-DIP
- 48-SQFP (7x7)
- 56-HVQFN (8x8)
- 56-Power88™
- 64-PowerQFP
- 64-TQFP (10x10)
- 8-MSOP
- 8-SOIC
- 8-SON (2x2)
- 8-SOP
- 9-SIP, 7 Leads
- Module
- P-DSO-28
- P-TO263-15-1
- PG-DSO-8
- PG-TO263-7
- PG-TO263-7-2
- Power66
- PowerPAK® MLP39-65
- POWERPAK® MLP4535-22L
- PowerPAK® MLP55-31L
- PowerPAK® MLP66-40
- SOT-28FL/ECH8
- SOT-28FL/VEC8
- TO-3-8
Surface Mount
- NO
- YES
Terminal Finish
- BRIGHT TIN
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel (Ni)
- NICKEL PALLADIUM GOLD
- Nickel/Gold/Palladium (Ni/Au/Pd)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- Nickel/Tin (Ni/Sn)
- NOT SPECIFIED
- Pure Matte Tin (Sn)
- SILVER
- TIN
- Tin (Sn)
- TIN LEAD
- Tin/Bismuth (Sn/Bi)
- Tin/Copper (Sn/Cu)
- Tin/Copper (Sn97.5Cu2.5)
- Tin/Lead (Sn/Pb)
- Tin/Nickel (Sn/Ni)
- Tin/Nickel/Copper (Sn/Ni/Cu)
- Tin/Silver/Copper (Sn/Ag/Cu)
- TIN/TIN COPPER
Termination
- SMD/SMT
- Through Hole
Transistor Element Material
- GALLIUM NITRIDE
Type
- Integrated Circuit (IC)
Weight
- 1.053808g
- 1.31247g
- 1.930007g
- 121.33333mg
- 144mg
- 145.646mg
- 193.06667mg
- 2.174692g
- 205mg
- 224mg
- 234mg
- 368.798946mg
- 4.535924g
- 426mg
- 43mg
- 540.001716mg
- 57.09594mg
- 639.990485mg
- 700mg
- 850.995985mg
- 951.693491mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Factory Lead Time | Lifecycle Status | Mount | Packaging | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | REACH SVHC | Reach Compliance Code | Number of Drivers | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Number of Channels | Supply Voltage-Max (Vsup) | Max Power Dissipation | Output Voltage | Output Current | Feature | Max Output Current | Input Voltage-Nom | Analog IC - Other Type | Output Polarity | Output Current per Channel | Applications | Power Dissipation | Supply Current-Max (Isup) | Turn On Delay Time | Built-in Protections | Output Characteristics | Turn-Off Delay Time | Output Configuration | Screening Level | Input Voltage (Min) | Input Voltage (Max) | Voltage - Supply | Fault Protection | Control Technique | Output Peak Current Limit-Nom | Input Characteristics | Current - Output / Channel | Voltage - Load | Load Type | Current - Peak Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CSD95491Q5MC | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | ACTIVE (Last Updated: 4 days ago) | Tape & Reel (TR) | NexFET™ | yes | Active | 2 (1 Year) | 12 | EAR99 | 6mm | ROHS3 Compliant | 12 | OUTPUT VOLTAGE-MAX= 5.5V | 12-PowerTFDFN | PWM | 5mm | 980μm | Surface Mount | -40°C~125°C TJ | Power MOSFET | 1 | e3 | Matte Tin (Sn) | DUAL | NO LEAD | CSD95491 | YES | Bootstrap Circuit | 12V | SWITCHING REGULATOR | Synchronous Buck Converters | Half Bridge (3) | 4.5V | 16V | 4.5V~5.5V | Shoot-Through | PULSE WIDTH MODULATION | 60A | 4.5V~16V | Inductive, Capacitive | 90A | |||||||||||||||||||||||||||||||||||||||||||
 |
CSD95378BQ5M | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | ACTIVE (Last Updated: 3 days ago) | Surface Mount | Tape & Reel (TR) | NexFET™ | yes | Active | 2 (1 Year) | 12 | EAR99 | 6mm | ROHS3 Compliant | Contains Lead | Gold | 12 | 12-PowerTFDFN | PWM | 1.5mm | 5mm | 1.5mm | Surface Mount | -55°C~150°C TJ | Power MOSFET | 8542.39.00.01 | 1 | e3 | Matte Tin (Sn) | DUAL | NO LEAD | 260 | NOT SPECIFIED | CSD95378 | Bootstrap Circuit, Status Flag | 90A | DUAL SWITCHING CONTROLLER | 60A | Synchronous Buck Converters | Half Bridge | 16V | 4.5V~5.5V | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO | PULSE WIDTH MODULATION | 60A | 4.5V~16V | Inductive | |||||||||||||||||||||||||||||||||||||||
 |
UC2950TG3 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Through Hole | Tube | yes | Active | Not Applicable | 5 | EAR99 | 10.16mm | ROHS3 Compliant | Lead Free | No | 5 | TO-220-5 | On/Off | No SVHC | 2 | 300kHz | 4.7mm | 8.51mm | 4.58mm | Through Hole | 1.930007g | -20°C~100°C TJ | Bipolar | 36mA | 1 | 36mA | e3 | Matte Tin (Sn) | SINGLE | 12V | UC2950 | 3 | 1 | 15W | 3V | 4A | 5V Regulated Output | 4A | TRUE | 2A | General Purpose | 15W | 500 ns | THERMAL | TRI-STATE | 2 μs | Half Bridge | 8V~35V | Over Temperature | 4A | STANDARD | 8V~35V | Inductive, Capacitive | ||||||||||||||||||||||||||||
.png "DRV8908QPWPRQ1") |
DRV8908QPWPRQ1 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 42 Weeks | yes | Active | 3 | 24 | 7.8mm | RoHS Compliant | ALSO REQUIRED MAIN SUPPLY 4.5V TO 32V | compliant | 4.4mm | 1.2mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | GULL WING | 3.3V | AUTOMOTIVE | YES | 0.65mm | R-PDSO-G24 | 3V | 125°C | -40°C | 5.5V | BRUSH DC MOTOR CONTROLLER | 5mA | AEC-Q100 |
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DRV8908QPWPRQ1 Texas Instruments
DRV8908QPWPRQ1 datasheet pdf and PMIC - Full, Half-Bridge Drivers product details from Texas Instruments stock available at HK JDW
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