Items : %s%s
FPGAs
Additional Feature
- 32000 TYPICAL GATES AVAILABLE
- 72000 TYPICAL GATES AVAILABLE
- 8000 TYPICAL GATES AVAILABLE
- ALSO OPERATES AT 1 V SUPPLY
- ALSO OPERATES AT 3.3 V NOMINAL SUPPLY
- ALSO OPERATES AT 5V SUPPLY
- ALSO REQUIRES 3.3 SUPPLY
- CAN ALSO OPERATE AT 5V SUPPLY
- CAN ALSO OPERATES AT 1.1 V AND 1.15 V NOMINAL SUPPLY
- IT CAN ALSO OPERATE AT 2.5V AND 3.3V
- IT CAN ALSO OPERATE AT 5V SUPPLY
- IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
- IT CAN ASO OPERATE AT 1.2V SUPPLY
- LG-MIN; WD-MIN; TERM PITCH-MIN
- MAXIMUM USABLE GATES = 150000
- YES
Contact Plating
- Copper, Silver, Tin
- Lead, Silver, Tin
- Lead, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.A.7.A
- 3A001.A.7.B
- 3A991
- 3A991.B.2.A
- 3A991.D
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 24 Weeks
- 25 Weeks
- 3 Weeks
- 31 Weeks
- 6 Weeks
- 8 Weeks
- 9 Weeks
HTS Code
- 8542.32.00.61
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e2
- e3
- e8
Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- IN PRODUCTION (Last Updated: 2 weeks ago)
- IN PRODUCTION (Last Updated: 3 days ago)
- IN PRODUCTION (Last Updated: 3 weeks ago)
- IN PRODUCTION (Last Updated: 4 weeks ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 4 weeks ago)
Manufacturer Package Identifier
- CS/CSG324
- csBGA-328
- CSFBGA-81
- EQFP-144-A:1.65-D2:5.0
- FBGA-1517-A:350-D1:34.10
- UBGA-324-A:1.55
- ug475_c4_100_013014
- VQFP100
- XC7A75T-2FGG484I
- XC7S6-1FTGB196C
- XCKU035-1FFVA1156C
Max Operating Temperature
- 100°C
- 105°C
- 125°C
- 70°C
- 85°C
- 90°C
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 6 (Time on Label)
Mount
- Standard
- Surface Mount
Mounting Type
- Surface Mount
Number of Pins
- 100
- 1020
- 1136
- 1148
- 1152
- 1153
- 1154
- 1155
- 1156
- 1157
- 1158
- 121
- 132
- 144
- 1508
- 1517
- 16
- 160
- 164
- 169
- 1738
- 1759
- 1760
- 1761
- 1923
- 1924
- 1925
- 1930
- 196
- 20
- 208
- 225
- 236
- 240
- 256
- 272
- 281
- 32
- 320
- 323
- 324
- 325
- 328
- 329
- 332
- 352
- 36
- 363
- 388
- 400
- 44
- 456
- 48
- 484
- 49
- 64
- 665
- 668
- 672
- 676
- 68
- 780
- 784
- 81
- 84
- 896
- 900
- 957
Number of Terminations
- 100
- 1157
- 1158
- 121
- 132
- 144
- 153
- 16
- 160
- 164
- 169
- 1759
- 1761
- 184
- 1925
- 1926
- 1927
- 1930
- 196
- 20
- 208
- 225
- 236
- 240
- 25
- 256
- 272
- 281
- 301
- 32
- 320
- 323
- 324
- 325
- 328
- 329
- 332
- 352
- 356
- 358
- 36
- 363
- 383
- 388
- 400
- 432
- 44
- 456
- 48
- 484
- 49
- 560
- 572
- 600
- 627
- 64
- 652
- 665
- 668
- 672
- 676
- 68
- 680
- 780
- 784
- 80
- 81
- 84
- 896
- 900
- 901
- 956
- 957
Operating Temperature
- -20°C~85°C TJ
- -40°C~100°C
- -40°C~100°C TA
- -40°C~100°C TJ
- -40°C~105°C TJ
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~85°C TA
- -55°C~125°C TA
- -55°C~125°C TC
- -55°C~125°C TJ
- 0°C~100°C TJ
- 0°C~70°C TA
- 0°C~85°C TJ
Package / Case
- 100-BQFP
- 100-LFBGA, CSPBGA
- 100-LQFP
- 100-TQFP
- 1020-BBGA
- 1020-BBGA, FCBGA
- 1136-BBGA, FCBGA
- 1148-BBGA, FCBGA
- 1152-BBGA
- 1152-BBGA, FCBGA
- 1152-BBGA, FCBGA Exposed Pad
- 1152-BCBGA, FCBGA
- 1152-BGA
- 1153-BBGA, FCBGA
- 1156-BBGA
- 1156-BBGA, FCBGA
- 121-VFBGA
- 121-VFBGA, CSBGA
- 132-LFBGA, CSPBGA
- 132-TFBGA, CSPBGA
- 144-BGA
- 144-LBGA
- 144-LQFP
- 144-LQFP Exposed Pad
- 144-TFBGA, CSPBGA
- 1508-BBGA, FCBGA
- 1517-BBGA
- 1517-BBGA, FCBGA
- 153-VFBGA
- 16-XFBGA, WLCSP
- 160-BQFP
- 164-TFBGA
- 169-LBGA
- 169-LFBGA
- 1704-BBGA, FCBGA
- 1738-BBGA, FCBGA
- 1760-BBGA, FCBGA
- 1924-BBGA, FCBGA
- 1932-BBGA, FCBGA
- 196-LBGA, CSPBGA
- 196-TFBGA, CSBGA
- 208-BFCQFP with Tie Bar
- 208-BFQFP
- 208-BFQFP Exposed Pad
- 225-LFBGA, CSPBGA
- 238-LFBGA, CSPBGA
- 240-BFQFP
- 240-BFQFP Exposed Pad
- 240-BQFP
- 25-XFBGA, WLCSP
- 256-BBGA
- 256-BFCQFP with Tie Bar
- 256-BGA
- 256-LBGA
- 256-LFBGA
- 256-LFBGA, CSPBGA
- 256-TFBGA
- 256-VFBGA
- 272-BBGA
- 281-TFBGA, CSBGA
- 301-TFBGA
- 32-UFQFN Exposed Pad
- 320-BGA
- 323-BBGA, FCBGA
- 324-BBGA, FCBGA
- 324-BGA
- 324-LBGA
- 324-LFBGA
- 324-LFBGA, CSPBGA
- 328-LFBGA, CSBGA
- 329-BBGA
- 332-FBGA
- 352-BFCQFP with Tie Bar
- 352-LBGA Exposed Pad, Metal
- 356-LBGA
- 358-LFBGA, FCBGA
- 36-UFBGA, WLCSP
- 36-VFBGA
- 36-XFBGA, WLCSP
- 363-FBGA, FCBGA
- 383-TFBGA
- 388-BBGA
- 400-BGA
- 400-LFBGA
- 432-LBGA Exposed Pad, Metal
- 44-LCC (J-Lead)
- 456-BBGA
- 48-VFQFN Exposed Pad
- 484-BBGA
- 484-BBGA, FCBGA
- 484-BFBGA
- 484-BGA
- 484-FBGA
- 484-FBGA, CSPBGA
- 484-FBGA, FCBGA
- 484-LFBGA
- 49-VFBGA
- 560-LBGA Exposed Pad, Metal
- 572-BGA, FCBGA
- 600-BGA
- 64-VFBGA
- 652-BBGA
- 652-BGA
- 665-BBGA, FCBGA
- 668-BBGA, FCBGA
- 672-BBGA
- 672-BBGA, FCBGA
- 672-BGA
- 676-BBGA, FCBGA
- 676-BGA
- 68-VFQFN Exposed Pad
- 680-LBGA Exposed Pad
- 780-BBGA
- 780-BBGA, FCBGA
- 780-BGA
- 784-BBGA, FCBGA
- 81-UFBGA, WLCSP
- 81-VFBGA
- 81-WFBGA, CSBGA
- 84-LCC (J-Lead)
- 84-VFQFN Dual Rows, Exposed Pad
- 896-BBGA, FCBGA
- 896-BGA
- 900-BBGA
- 900-BBGA, FCBGA
- 956-BBGA
- 957-BBGA, FCBGA
- BGA
- FBGA
- FCBGA
- PLCC
- PQFP
- QFP
- TFBGA
- TQFP
Packaging
- Box
- Bulk
- Cut Tape
- Tape & Reel (TR)
- Tray
Part Status
- Active
- Discontinued
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2018
Series
- ACEX-1K®
- APEX II
- APEX-20KC®
- APEX-20KE®
- APEX-20K®
- Arria 10 GX
- Arria GX
- Arria II GX
- Arria V GT
- Arria V GX
- Arria V GZ
- Artix-7
- Automotive, AEC-Q100, ProASIC3
- Automotive, AEC-Q100, Spartan®-3E XA
- Axcelerator
- CrossLink™
- Cyclone®
- Cyclone® 10 GX
- Cyclone® 10 LP
- Cyclone® II
- Cyclone® III
- Cyclone® IV E
- Cyclone® IV GX
- Cyclone® V E
- Cyclone® V GT
- Cyclone® V GX
- EC
- ECP
- ECP2
- ECP2M
- ECP3
- EX
- FLEX 6000
- FLEX 8000
- FLEX-10KA®
- FLEX-10KE®
- FLEX-10KS®
- FLEX-10K®
- Fusion®
- iCE40 UltraLite™
- iCE40 UltraPlus™
- iCE40 Ultra™
- iCE40™ HX
- iCE40™ LM
- iCE40™ LP
- IGLOO
- IGLOO nano
- IGLOO2
- IGLOOe
- Kintex® UltraScale™
- Kintex®-7
- MachXO
- MachXO2
- MachXO3
- MAX® 10
- Mercury
- MX
- ProASIC3
- ProASIC3 nano
- ProASIC3E
- ProASIC3EL
- ProASIC3L
- ProASICPLUS
- SC
- SCM
- Spartan®-3
- Spartan®-3A
- Spartan®-3A DSP
- Spartan®-3AN
- Spartan®-3E
- Spartan®-6 LX
- Spartan®-6 LXT
- Spartan®-7
- Spartan®-II
- Spartan®-IIE
- Stratix®
- Stratix® GX
- Stratix® II
- Stratix® II GX
- Stratix® III E
- Stratix® III L
- STRATIX® IV E
- STRATIX® IV GT
- Stratix® IV GX
- Stratix® V GS
- Stratix® V GX
- SX-A
- Virtex®
- Virtex®-4 FX
- Virtex®-4 LX
- Virtex®-4 SX
- Virtex®-5 FXT
- Virtex®-5 LX
- Virtex®-5 LXT
- Virtex®-5 SXT
- Virtex®-6 HXT
- Virtex®-6 LXT
- Virtex®-6 SXT
- Virtex®-7 T
- Virtex®-7 XT
- Virtex®-E
- Virtex®-E EM
- Virtex®-II
- Virtex®-II Pro
- XC5200
- XP
- XP2
Supplier Device Package
- 100-VQFP (14x14)
- 1136-FCBGA (35x35)
- 1152-FBGA (35x35)
- 1152-FPBGA (35x35)
- 1153-FCBGA (35x35)
- 1156-FCBGA (35x35)
- 1157-FCBGA (35x35)
- 1158-FCBGA (35x35)
- 144-FPBGA (13x13)
- 144-TQFP (20x20)
- 1760-FCBGA (42.5x42.5)
- 208-PQFP (28x28)
- 256-FPBGA (17x17)
- 256-FTBGA (17x17)
- 324-CSPBGA (15x15)
- 324-FBGA (19x19)
- 484-FPBGA (23x23)
- 672-FBGA (27x27)
- 672-FPBGA (27x27)
- 676-FBGA (27x27)
- 676-FCBGA (27x27)
- 784-FCBGA (29x29)
- 900-FCBGA (31x31)
- 900-FPBGA (31x31)
- 901-FCBGA (31x31)
Surface Mount
- YES
Terminal Finish
- MATTE TIN
- MATTE TIN (402)
- MATTE TIN (472) OVER COPPER
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Tin (Sn)
- TIN LEAD
- TIN LEAD SILVER
- TIN LEAD/TIN LEAD SILVER
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Lead/Silver (Sn/Pb/Ag)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
Termination
- SMD/SMT
Weight
- 1.319103g
- 1.758804g
- 10.567001g
- 150.507618mg
- 176.986073mg
- 188.609377mg
- 2.386605g
- 2.784008g
- 400.011771mg
- 5.482996g
- 5.566797g
- 6.777889g
- 657.000198mg
- 7.349897g
- 722.005655mg
- 810.002575mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Width | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Number of Outputs | Propagation Delay | Number of Terminals | Number of Inputs | RAM Size | Number of I/O | Organization | Clock Frequency | Number of Gates | Number of Logic Blocks (LABs) | Number of Logic Elements/Cells | Speed Grade | Programmable Logic Type | Number of Logic Cells | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Registers | Number of Equivalent Gates |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "XC2S300E-6FG456I") |
XC2S300E-6FG456I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | 3 (168 Hours) | 456 | 3A991.D | 100°C | -40°C | 1.8V | 23mm | RoHS Compliant | No | MAXIMUM USABLE GATES = 300000 | FBGA | 23mm | CMOS | 8542.39.00.01 | e0 | BOTTOM | BALL | 225 | 1.8V | 30 | 456 | YES | 1mm | Field Programmable Gate Arrays | 1.89V | 329 | 329 | 8kB | 357MHz | 6 | FIELD PROGRAMMABLE GATE ARRAY | 0.47 ns | 93000 | ||||||||||||||||||||||||||||||||
|
XQ6SLX150T-3FGG676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 (168 Hours) | 3A991.D | RoHS Compliant | compliant | CMOS | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 250 | 30 | YES | 1mm | S-PBGA-B676 | Field Programmable Gate Arrays | Not Qualified | 1.21.2/3.32.5/3.3V | 396 | 676 | 396 | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 147443 | ||||||||||||||||||||||||||||||||||||||||||
 |
XC7VX1140T-1FLG1926C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | 2010 | yes | 1926 | 3A001.A.7.B | 85°C | 0°C | 1V | 45mm | RoHS Compliant | No | FCBGA | 45mm | CMOS | 3.75mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 1926 | OTHER | YES | 1mm | S-PBGA-B1926 | Field Programmable Gate Arrays | 0.91.8V | 1.03V | 720 | 120 ps | 720 | 8.3MB | 720 | 1818MHz | 89000 | 1.1392e+06 | -1 | FIELD PROGRAMMABLE GATE ARRAY | 1139200 | 0.74 ns | 1.424e+06 | |||||||||||||||||||||||
|
XC4VLX160-11FF1513C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | 1999 | no | Active | 4 (72 Hours) | 1513 | 3A001.A.7.A | 85°C | 0°C | 1.2V | 40mm | Non-RoHS Compliant | No | FCBGA | 40mm | CMOS | 3.25mm | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 30 | 1513 | OTHER | YES | 1mm | S-PBGA-B1513 | Field Programmable Gate Arrays | 1.26V | 960 | 960 | 108kB | 16896 CLBS | 12 | FIELD PROGRAMMABLE GATE ARRAY | 152064 | 16896 | |||||||||||||||||||||||||
|
XQ6SLX150T-3CS484I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 (168 Hours) | 3A991.D | Non-RoHS Compliant | compliant | CMOS | 8542.39.00.01 | e0 | TIN LEAD | BOTTOM | BALL | 240 | 30 | YES | 0.8mm | S-PBGA-B484 | Field Programmable Gate Arrays | Not Qualified | 1.21.2/3.32.5/3.3V | 296 | 484 | 296 | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 147443 | ||||||||||||||||||||||||||||||||||||||||||
|
XCV100E-6CS144CES | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XC6SLX150-L1FG676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | no | 3 (168 Hours) | 676 | 3A991.D | 100°C | -40°C | 1V | 27mm | RoHS Compliant | 676 | BGA | 27mm | CMOS | 2.44mm | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1V | 30 | 676 | INDUSTRIAL | 1mm | Field Programmable Gate Arrays | Not Qualified | 12.5/3.3V | 1.05V | 498 | 603kB | 498 | 11519 | 147443 | FIELD PROGRAMMABLE GATE ARRAY | 0.46 ns | 184304 | ||||||||||||||||||||||||||||
|
XC7K160T-2FBV676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 676 | 3A991.D | 100°C | -40°C | RoHS Compliant | Lead Free | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | 1mm | S-PBGA-B676 | 0.97V | 1.03V | 1.4MB | 2 | FIELD PROGRAMMABLE GATE ARRAY | 0.61 ns | 202800 | |||||||||||||||||||||||||||||||||||||||||||
|
XC6VHX380T-1FFG1154C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | yes | 4 (72 Hours) | 85°C | 0°C | 1V | 35mm | RoHS Compliant | 1154 | FCBGA | 35mm | CMOS | 3.5mm | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | OTHER | Field Programmable Gate Arrays | Not Qualified | 320 | 3.4MB | 320 | 29880 | 382464 | 1 | FIELD PROGRAMMABLE GATE ARRAY | 5.08 ns | |||||||||||||||||||||||||||||||||||
|
XC6VCX130T-1FF784C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | no | 784 | 85°C | 0°C | 1V | 29mm | RoHS Compliant | FCBGA | 29mm | CMOS | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | 784 | OTHER | S-PBGA-B784 | Field Programmable Gate Arrays | Not Qualified | 400 | 400 | 1.2MB | 400 | 10000 | 128000 | 1 | FIELD PROGRAMMABLE GATE ARRAY | 160000 | ||||||||||||||||||||||||||||||||||
 |
XC5VLX30-2FFG324C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | yes | 4 (72 Hours) | 324 | 3A991.D | 85°C | 0°C | 1V | 19mm | RoHS Compliant | 324 | FCBGA | 19mm | CMOS | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 250 | 1V | 30 | 324 | OTHER | 1mm | Field Programmable Gate Arrays | Not Qualified | 1.05V | 220 | 144kB | 220 | 2400 | 30720 | 2 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||
|
XC4VLX60-11FF668IS2 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2006 | no | 4 (72 Hours) | 668 | 3A991.D | 100°C | -40°C | 1.2V | Non-RoHS Compliant | No | FCBGA | CMOS | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | YES | 1mm | S-PBGA-B668 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 448 | 448 | 360kB | 1205MHz | 11 | FIELD PROGRAMMABLE GATE ARRAY | 59904 | |||||||||||||||||||||||||||||||||||
|
XQ4VLX40-10FF668M | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | 4 (72 Hours) | 668 | 3A001.A.2.C | 27mm | Non-RoHS Compliant | not_compliant | 27mm | CMOS | 2.85mm | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.2V | 30 | 668 | MILITARY | YES | 1mm | S-PBGA-B668 | 1.14V | 125°C | -55°C | Field Programmable Gate Arrays | Not Qualified | 1.21.2/3.32.5V | 1.26V | 448 | 448 | 4608 CLBS | 1028MHz | FIELD PROGRAMMABLE GATE ARRAY | 41472 | 4608 | |||||||||||||||||||||||||||||
|
XCV100E-6FGG256I4307 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 100°C | -40°C | 1.8V | RoHS Compliant | Copper, Silver, Tin | 1.89V | 1.2V | 2.9 ns | 10kB | 6 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XC3S1200E4FGG320CS1 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 3 (168 Hours) | 320 | 3A991.D | 85°C | 0°C | 1.2V | 19mm | RoHS Compliant | No | FBGA | 19mm | CMOS | 2mm | e1 | BOTTOM | BALL | 260 | 1.2V | OTHER | YES | 1mm | S-PBGA-B320 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 1.26V | 194 | 250 | 63kB | 2168 CLBS, 1200000 GATES | 572MHz | 4 | FIELD PROGRAMMABLE GATE ARRAY | 19512 | 0.76 ns | 2168 | 17344 | 1200000 | ||||||||||||||||||||||||||||
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XC2S150E-7FTG256C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 3 (168 Hours) | 256 | EAR99 | 85°C | 0°C | 1.8V | RoHS Compliant | No | 256 | MAXIMUM USABLE GATES = 150000 | CMOS | 2mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 1.8V | 30 | 256 | OTHER | YES | 1mm | Field Programmable Gate Arrays | 1.89V | 265 | 6kB | 864 CLBS, 52000 GATES | 400MHz | 7 | FIELD PROGRAMMABLE GATE ARRAY | 3888 | 0.42 ns | 864 | 52000 | |||||||||||||||||||||||||||||
|
XC4VLX60-10FF668CS2 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | 4 (72 Hours) | 668 | 3A991.D | Non-RoHS Compliant | FCBGA | not_compliant | CMOS | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | NOT SPECIFIED | YES | 1mm | S-PBGA-B668 | Field Programmable Gate Arrays | Not Qualified | 1.21.2/3.32.5V | 448 | 448 | 1028MHz | 9999 | FIELD PROGRAMMABLE GATE ARRAY | 59904 | |||||||||||||||||||||||||||||||||||||||
|
XC2V500-4FG256C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | no | 3 (168 Hours) | 256 | EAR99 | 85°C | 0°C | 1.5V | 17mm | RoHS Compliant | No | FBGA | 17mm | CMOS | 2mm | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.5V | 30 | 256 | OTHER | YES | 1mm | S-PBGA-B256 | Field Programmable Gate Arrays | 1.51.5/3.33.3V | 1.575V | 172 | 172 | 72kB | 768 CLBS, 500000 GATES | 650MHz | 4 | FIELD PROGRAMMABLE GATE ARRAY | 6912 | 768 | 6144 | 500000 | ||||||||||||||||||||||||||
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XQ6SLX75T-3FG484I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 (168 Hours) | 3A991.D | Non-RoHS Compliant | not_compliant | CMOS | 8542.39.00.01 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 30 | YES | 1mm | S-PBGA-B484 | Field Programmable Gate Arrays | Not Qualified | 1.21.2/3.32.5/3.3V | 268 | 484 | 268 | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 74637 | ||||||||||||||||||||||||||||||||||||||||||
|
XCV1000E-8FG860CES | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XCV1600E-6FG860CES | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XC3064-100PC84 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 (168 Hours) | 84 | 29.3116mm | Non-RoHS Compliant | 688 FLIP-FLOPS; TYP. GATES = 3500-4500; POWER-DOWN SUPPLY CURRENT = 170UA | 29.3116mm | CMOS | 5.08mm | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 5V | 84 | OTHER | YES | 1.27mm | S-PQCC-J84 | 4.75V | 85°C | Field Programmable Gate Arrays | Not Qualified | 5V | 5.25V | 70 | 70 | 224 CLBS, 3500 GATES | 100MHz | FIELD PROGRAMMABLE GATE ARRAY | 224 | 7 ns | 224 | 3500 | |||||||||||||||||||||||||||||||||
|
XC3S1600E-4FGG400CS1 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 3 (168 Hours) | 400 | 3A991.D | 85°C | 0°C | 1.2V | 21mm | RoHS Compliant | No | FBGA | 21mm | CMOS | e1 | BOTTOM | BALL | 250 | 1.2V | 30 | OTHER | YES | 1mm | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 1.26V | 232 | 304 | 81kB | 3688 CLBS, 1600000 GATES | 572MHz | 4 | FIELD PROGRAMMABLE GATE ARRAY | 33192 | 0.76 ns | 3688 | 29504 | 1600000 | |||||||||||||||||||||||||||||
|
XC6VCX75T-2FF784I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | no | 784 | 3A991.D | 100°C | -40°C | 1V | RoHS Compliant | FCBGA | CMOS | 3.1mm | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | 784 | 1mm | S-PBGA-B784 | Field Programmable Gate Arrays | Not Qualified | 1.05V | 360 | 360 | 702kB | 360 | 1098MHz | 5820 | 74496 | 2 | FIELD PROGRAMMABLE GATE ARRAY | 93120 | ||||||||||||||||||||||||||||||||
|
XC6VHX380T-2FFG1924E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 4 (72 Hours) | 3A001.A.7.B | 100°C | 0°C | 1V | RoHS Compliant | 1924 | FCBGA | CMOS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 30 | 1mm | Field Programmable Gate Arrays | Not Qualified | 640 | 3.4MB | 640 | 29880 | 382464 | 2 | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||
|
XA7A35T-1CSG325I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 (168 Hours) | 325 | EAR99 | 15mm | RoHS Compliant | 15mm | CMOS | 1.5mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 30 | YES | 0.8mm | S-PBGA-B325 | 0.95V | Field Programmable Gate Arrays | Not Qualified | 1V | 1.05V | 150 | 150 | 2600 CLBS | 1098MHz | FIELD PROGRAMMABLE GATE ARRAY | 33280 | 1.27 ns | 2600 | ||||||||||||||||||||||||||||||||||
|
XC6VSX475T-L1FFG1759I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | yes | 4 (72 Hours) | 3A001.A.7.A | 100°C | -40°C | 900mV | 42.5mm | RoHS Compliant | 1759 | FCBGA | 42.5mm | CMOS | 3.5mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 0.9V | 30 | INDUSTRIAL | 1mm | Field Programmable Gate Arrays | Not Qualified | 11.2/2.5V | 0.93V | 840 | 4.7MB | 840 | 1098MHz | 37200 | 476160 | FIELD PROGRAMMABLE GATE ARRAY | 5.87 ns | ||||||||||||||||||||||||||||||
|
XC2V250-4FG456C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | no | 3 (168 Hours) | 456 | 3A991.D | 85°C | 0°C | 1.5V | 23mm | Non-RoHS Compliant | No | FBGA | 23mm | CMOS | 2.6mm | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.5V | 30 | 456 | OTHER | YES | 1mm | Field Programmable Gate Arrays | 1.51.5/3.33.3V | 1.575V | 200 | 200 | 54kB | 650MHz | 4 | FIELD PROGRAMMABLE GATE ARRAY | 384 | 3072 | 250000 | ||||||||||||||||||||||||||||
|
XC4VSX25-10FFG668IS2 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2006 | yes | Discontinued | 4 (72 Hours) | 668 | 3A991.D | 100°C | -40°C | 1.2V | RoHS Compliant | No | FCBGA | CMOS | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 250 | 30 | YES | 1mm | S-PBGA-B668 | Field Programmable Gate Arrays | 1.21.2/3.32.5V | 320 | 320 | 288kB | 10 | FIELD PROGRAMMABLE GATE ARRAY | 23040 | ||||||||||||||||||||||||||||||||||
|
XC6SLX9-2CSG225I4453 | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | 2008 | 100°C | -40°C | 1.2V | RoHS Compliant | Copper, Silver, Tin | 1.26V | 1.14V | 1.53 ns | 72kB | 2 | 11440 |
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