Items : %s%s
FIFOs Memory
Additional Feature
- 64X9 DUAL PORT RAM
- ALSO REQURIES 1.8 V
- ALTERNATIVE MEMORY WIDTH 10
- ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
- ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
- ALTERNATIVE MEMORY WIDTH: 10 AND 20
- ASYNCHRONOUS OPERATION ALSO POSSIBLE
- AUTO POWER DOWN
- BYPASS REGISTER
- BYPASS XCVR
- BYPASS-XCVR
- CAN ALSO BE CONFIGURED AS 131,072 X 10 X 4
- CAN ALSO BE CONFIGURED AS 16384 X 9
- CAN ALSO BE CONFIGURED AS 65536 X 9
- EASILY EXPANDABLE IN DEPTH AND WIDTH
- FALL THRU 25NS
- FALL THRU 28NS
- FALL THRU 30NS
- FALL THRU 34NS
- FALL THRU 40NS
- FALL THRU 65NS
- IT CAN ALSO BE CONFIGURED AS 128K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 4K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 64K X 9; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 8K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- MAIL BOX
- MAIL BOX BYPASS REGISTER
- MAIL BOX BYPASS REGISTER; PARITY GENERATOR/CHECKER
- MAIL BOX; PARITY GENERATOR/CHECKER
- MAIL BOX; RETRANSMIT
- MAILBOX
- MAILBOX BYPASS REGISTER
- MAILBOX; PARITY GENERATOR/CHECKER
- PARITY GENERATOR/CHECKER, MAILBOX
- PARITY GENERATOR/CHECKER; MAILBOX
- PORTA/PORTB:PARALLEL/SERIAL
- PORTB:36 OR 18 OR 9; MAILBOX; AUTO POWER DOWN
- REGISTER BASED; BUBBLE BACK 2.7US
- REGISTER BASED; BUBBLE BACK 3US
- REGISTER BASED; BUBBLE BACK 750NS
- RETRANSMIT
- RETRANSMIT; AUTO POWER DOWN
- RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
- RETRANSMIT; AUTO POWER-DOWN
- RETRANSMIT; MAILBOX
- RETRANSMIT; PARITY CHECKER; MAILBOX
- RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX
Contact Plating
- Copper, Silver, Tin
- Gold
- Gold, Tin
- Lead, Tin
- Tin
ECCN Code
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 20 Weeks
- 26 Weeks
- 35 Weeks
- 4 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
HTS Code
- 8542.32.00.71
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
- e3/e4
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- LIFEBUY (Last Updated: 1 day ago)
- LIFEBUY (Last Updated: 1 week ago)
- LIFEBUY (Last Updated: 2 days ago)
- LIFEBUY (Last Updated: 3 months ago)
- LIFEBUY (Last Updated: 6 days ago)
Max Operating Temperature
- 125°C
- 70°C
- 85°C
Max Power Dissipation
- 100mW
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2 (1 Year)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4
- 4 (72 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 100
- 120
- 121
- 128
- 132
- 144
- 16
- 20
- 208
- 209
- 24
- 240
- 256
- 28
- 32
- 324
- 44
- 56
- 64
- 68
- 80
- 84
Number of Terminations
- 100
- 120
- 121
- 128
- 132
- 144
- 16
- 20
- 208
- 209
- 24
- 240
- 256
- 28
- 32
- 324
- 44
- 56
- 64
- 68
- 80
- 84
Operating Temperature
- -40°C~125°C
- -40°C~85°C
- -55°C~125°C
- -55°C~125°C TA
- 0°C~70°C
Package / Case
- 100
- 100-LBGA
- 100-LFBGA
- 120-LQFP
- 120-LQFP Exposed Pad
- 121-BBGA
- 128-LQFP
- 132-BQFP Bumpered
- 132-QFP
- 144-BGA
- 144-QFP
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.209, 5.30mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 18-DIP (0.300, 7.62mm)
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 208-BGA
- 209-BGA
- 24-DIP (0.300, 7.62mm)
- 24-SOIC (0.295, 7.50mm Width)
- 240-BGA
- 256-BBGA
- 28-BSOJ (0.300, 7.62mm Width)
- 28-CDIP (0.300, 7.62mm)
- 28-CDIP (0.600, 15.24mm)
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SOIC (0.345, 8.77mm Width)
- 32-CLCC
- 32-LCC (J-Lead)
- 32-LQFP
- 32-TQFP
- 324-BGA
- 44-LCC (J-Lead)
- 56-BSSOP (0.295, 7.50mm Width)
- 56-TFSOP (0.240, 6.10mm Width)
- 64-LQFP
- 64-QFP
- 64-TQFP
- 68-LCC (J-Lead)
- 80-BQFP
- 80-LQFP
- 84-CPGA
- BGA
- CDIP
- CLCC
- DIP
- FBGA
- LCC
- LQFP
- PDIP
- PLCC
- PQFP
- SOIC
- TFSOP
- TQFP
- TSSOP
Packaging
- Bulk
- Cut Tape (CT)
- Rail/Tube
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
Series
- 4000B
- 7200
- 72T
- 72V
- 74ABT
- 74ACT
- 74ALS
- 74ALVC
- 74F
- 74HC
- 74HCT
- 74S
- 74V
- CY7C
Subcategory
- FIFOs
Supplier Device Package
- 100-BGA MICROSTAR (10.1x10.1)
- 100-CABGA (11x11)
- 120-HLQFP (14x14)
- 120-TQFP (14x14)
- 128-LQFP (14x20)
- 128-TQFP (14x20)
- 132-BQFP (24.54x24.54)
- 144-PBGA (13x13)
- 16-DIP
- 16-PDIP
- 16-SO
- 16-SOIC
- 16-SSOP
- 20-PDIP
- 20-PLCC (9x9)
- 20-SOIC
- 208-PBGA (17x17)
- 209-FBGA (14x22)
- 24-PDIP
- 240-PBGA (19x19)
- 28-CerDip
- 28-DIP
- 28-PDIP
- 28-SOIC
- 28-SOJ
- 32-PLCC (11.43x13.97)
- 32-PLCC (14x11.46)
- 32-TQFP (7x7)
- 324-PBGA (19x19)
- 44-PLCC (16.58x16.58)
- 56-SSOP
- 56-TSSOP
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 68-PLCC (24.23x24.23)
- 80-LQFP (12x12)
- 80-LQFP (14x14)
- 80-QFP (14x20)
- 80-TQFP (14x14)
Surface Mount
- NO
- YES
Technology
- BICMOS
- CMOS
- TTL
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- MATTE TIN/NICKEL PALLADIUM GOLD
- NICKEL PALLADIUM
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- TIN
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
Termination
- SMD/SMT
- Through Hole
Weight
- 1.1991g
- 1.713814g
- 141.690917mg
- 2.214806g
- 2.265694g
- 274.706879mg
- 360.605934mg
- 4.190003g
- 4.608697g
- 4.869796g
- 420.395078mg
- 465.697616mg
- 503.487531mg
- 513.60831mg
- 614.986205mg
- 624.398247mg
- 639.990485mg
- 694.790113mg
- 72.801575mg
- 722.005655mg
- 730.794007mg
- 740.007602mg
- 830.300833mg
- 951.693491mg
- 955.690774mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Pbfree Code | Moisture Sensitivity Level (MSL) | ECCN Code | Length | RoHS Status | Additional Feature | Reach Compliance Code | Width | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Number of Terminals | Supply Current-Max | Organization | Memory Width | Memory Density | Memory IC Type | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Output Enable | Cycle Time | Alternate Memory Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "7203L20TP") |
7203L20TP | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree no | 1 (Unlimited) | EAR99 | 34.671mm | Non-RoHS Compliant | RETRANSMIT | not_compliant | 7.62mm | CMOS | ASYNCHRONOUS | 4.572mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | THROUGH-HOLE | 245 | 5V | NOT SPECIFIED | 28 | COMMERCIAL | NO | 2.54mm | R-PDIP-T28 | 4.5V | 70°C | FIFOs | Not Qualified | 5V | 5.5V | 28 | 0.12mA | 2KX9 | 9 | 18432 bit | OTHER FIFO | PARALLEL | 33.3MHz | 0.002A | 20 ns | NO | 30 ns | ||||
|
72V2113L7-5BCGI | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||||||||||||||||||||
|
72V235L20TF | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree no | 3 (168 Hours) | EAR99 | 10mm | Non-RoHS Compliant | EASILY EXPANDABLE IN DEPTH AND WIDTH | not_compliant | 10mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 64 | COMMERCIAL | YES | 0.5mm | S-PQFP-G64 | 3V | 70°C | FIFOs | Not Qualified | 3.3V | 3.6V | 64 | 2KX18 | 18 | 36864 bit | OTHER FIFO | PARALLEL | 50MHz | 0.005A | 12 ns | YES | 20 ns | |||||
|
72T1865L5BBGI | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree yes | 3 (168 Hours) | EAR99 | 13mm | RoHS Compliant | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE | compliant | 13mm | CMOS | SYNCHRONOUS | 1.97mm | 8542.32.00.71 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 144 | INDUSTRIAL | YES | 1mm | S-PBGA-B144 | 2.375V | 85°C | -40°C | FIFOs | Not Qualified | 2.5V | 2.625V | 144 | 0.06mA | 8KX18 | 18 | 147456 bit | OTHER FIFO | PARALLEL | 83MHz | 0.05A | 3.6 ns | YES | 5 ns | 9 | ||
|
72T1895L6-7BBI | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 (168 Hours) | Non-RoHS Compliant | not_compliant | CMOS | SYNCHRONOUS/ASYNCHRONOUS | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 2.5V | INDUSTRIAL | YES | 1mm | S-PBGA-B144 | 85°C | -40°C | FIFOs | Not Qualified | 2.5V | 144 | 0.06mA | 64KX18 | 18 | 1179648 bit | OTHER FIFO | 66MHz | 0.05A | 12 ns | 9 | ||||||||||||||||||
|
72T1895L5BBI8 | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | EAR99 | compliant | 8542.32.00.71 | ||||||||||||||||||||||||||||||||||||||||||||
|
723641L15PQF | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree no | 3 (168 Hours) | EAR99 | 24.13mm | Non-RoHS Compliant | MAIL BOX; RETRANSMIT | not_compliant | 24.13mm | CMOS | SYNCHRONOUS | 4.57mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 5V | 20 | 132 | COMMERCIAL | YES | 0.635mm | S-PQFP-G132 | 4.5V | 70°C | FIFOs | Not Qualified | 5V | 5.5V | 132 | 1KX36 | 36 | 36864 bit | OTHER FIFO | PARALLEL | 66.7MHz | 11 ns | YES | 15 ns | ||||||
|
7206L25P | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree no | 1 (Unlimited) | EAR99 | 36.576mm | Non-RoHS Compliant | RETRANSMIT | not_compliant | 15.24mm | CMOS | ASYNCHRONOUS | 4.699mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | THROUGH-HOLE | 245 | 5V | NOT SPECIFIED | 28 | COMMERCIAL | NO | 2.54mm | R-PDIP-T28 | 4.5V | 70°C | FIFOs | Not Qualified | 5V | 5.5V | 28 | 0.12mA | 16KX9 | 9 | 147456 bit | OTHER FIFO | PARALLEL | 28.5MHz | 0.008A | 25 ns | NO | 35 ns |
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