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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Items : %s%s

CPLDs

Additional Feature

  • 1 EXTERNAL CLOCK
  • 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
  • 10 MACROCELLS; VARIABLE PRODUCT TERMS
  • 128 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS
  • 192 MACROCELLS; SHARED INPUT/CLOCK
  • 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • 256 MACROCELLS
  • 256 MACROCELLS; 16 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3
  • 256 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 36 MACROCELLS
  • 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 512 MACROCELLS
  • 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 580 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 676 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 72 MACROCELLS
  • 72 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • ALSO OPERATES WITH 3.3V SUPPLY VOLTAGE
  • CAN ALSO OPERATE WITH A 3.3V SUPPLY
  • CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • CONFIGURABLE I/O OPERATION WITH 3.3V+/-0.3 OR 5V+/-0.25
  • CONFIGURABLE I/O OPERATION WITH 3.3V+/-0.3 OR 5V+/-0.5
  • FOR SHIPPING METHOD CONTACT SALES
  • IN SYSTEM PROGRAMMABLE
  • IN-SYSTEM PROGRAMMABLE; 4 EXTERNAL CLOCKS
  • IT ALSO OPERATE WITH 2.5 TO 5.5, 2.3 TO 5.5V
  • IT ALSO OPERATE WITH 2.5 TO 5.5,2.3 TO 5.5 V
  • IT ALSO OPERATE WITH 4.5 TO 5.5 V AND 3 TO 3.6V
  • IT CAN ALSO HAVE AN INPUT VOLTAGE OF 3.3V
  • IT CAN ALSO OPERATE AT 3.3V
  • LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • LABS INTERCONNECTED BY PIA; 4 LABS; 64 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • MACROCELLS INTERCONNECTED BY PIA; 1 LAB; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • NO
  • PAL
  • PAL BLOCKS INTERCONNECTED BY PIA; 2 PAL BLOCKS; 4 EXTERNAL CLOCKS; SHARED INPUT/CLOCK
  • PAL WITH MACROCELLS; 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • POWER -UP RESET; SECURITY FUSE
  • PROGRAMMABLE OUTPUT POLARITY
  • REAL DIGITAL DESIGN TECHNOLOGY
  • REAL DIGITAL DESIGN TECHNOLOGY, XILIK00225-1
  • REAL DIGITAL DESIGN TECHNOLOGY, XILIK00255-1
  • REGISTER PRELOAD; POWER-ON RESET
  • REGISTER PRELOAD; POWER-UP RESET
  • USE IPLSI2032VE-300 FOR NEW DESIGNS
  • USE ISPLSI 2128VE-250 FOR NEW DESIGNS
  • YES

Contact Plating

  • Copper, Silver, Tin
  • Gold, Tin
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.A.7.A
  • 3A991
  • 3A991.D
  • EAR99

Factory Lead Time

  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 3 Weeks
  • 37 Weeks
  • 4 Weeks
  • 41 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e4
  • e4
  • e6

JTAG BST

  • YES

Manufacturer Package Identifier

  • EPM3064ATI44-10N
  • EPM9320ARI208-10

Max Operating Temperature

  • 100°C
  • 105°C
  • 125°C
  • 130°C
  • 70°C
  • 75°C
  • 85°C
  • 90 °C
  • 90°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0 °C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • 4 (72 Hours)
  • 5
  • 5 (48 Hours)
  • 6 (Time on Label)

Mount

  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 128
  • 132
  • 144
  • 160
  • 169
  • 176
  • 192
  • 20
  • 208
  • 24
  • 240
  • 256
  • 28
  • 280
  • 292
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 372
  • 388
  • 40
  • 44
  • 472
  • 48
  • 484
  • 49
  • 56
  • 64
  • 672
  • 676
  • 68
  • 84

Number of Terminals

  • 100
  • 144
  • 44
  • 49

Number of Terminations

  • 100
  • 120
  • 128
  • 132
  • 14
  • 144
  • 160
  • 169
  • 176
  • 192
  • 20
  • 208
  • 22
  • 24
  • 240
  • 256
  • 272
  • 28
  • 280
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 388
  • 40
  • 44
  • 48
  • 484
  • 49
  • 56
  • 64
  • 672
  • 676
  • 68
  • 69
  • 8
  • 84

Operating Temperature

  • -40°C~100°C TJ
  • -40°C~105°C TA
  • -40°C~105°C TJ
  • -40°C~125°C TA
  • -40°C~125°C TJ
  • -40°C~130°C TJ
  • -40°C~85°C
  • -40°C~85°C TA
  • -55°C~125°C TA
  • -55°C~125°C TC
  • 0°C~70°C TA
  • 0°C~75°C TA
  • 0°C~85°C TJ
  • 0°C~90°C TJ

Package / Case

  • 100-BQFP
  • 100-LBGA
  • 100-LFBGA
  • 100-LQFP
  • 100-TFBGA
  • 100-TQFP
  • 12-UFQFN
  • 12-WFDFN Exposed Pad
  • 120-BQFP
  • 128-BQFP
  • 128-LQFP
  • 132-LFBGA, CSPBGA
  • 132-TFBGA, CSPBGA
  • 132-VFBGA
  • 14-UFQFN
  • 144-BGA
  • 144-LQFP
  • 144-TFBGA
  • 144-TFBGA, CSPBGA
  • 16-UFQFN Exposed Pad
  • 160-BPGA
  • 160-BQFP
  • 160-LQFP
  • 169-LFBGA
  • 176-LQFP
  • 192-BPGA
  • 20-DIP (0.300, 7.62mm)
  • 20-LCC (J-Lead)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 20-UFQFN
  • 208-BFQFP
  • 208-BFQFP Exposed Pad
  • 208-BGA
  • 22-UFQFN
  • 24-CDIP (0.300, 7.62mm)
  • 24-DIP (0.300, 7.62mm)
  • 24-SOIC (0.295, 7.50mm Width)
  • 24-TSSOP (0.173, 4.40mm Width)
  • 240-BFQFP Exposed Pad
  • 256-BBGA
  • 256-BGA
  • 256-LBGA
  • 256-TFBGA
  • 272-BBGA
  • 28-CLCC
  • 28-LCC (J-Lead)
  • 28-SSOP (0.209, 5.30mm Width)
  • 280-TFBGA, CSPBGA
  • 292-BGA
  • 304-BFQFP
  • 32-VFQFN Exposed Pad
  • 324-BBGA
  • 324-BGA
  • 324-LBGA
  • 352-LBGA
  • 352-LBGA Exposed Pad, Metal
  • 356-LBGA
  • 388-BBGA
  • 40-CDIP (0.600, 15.24mm)
  • 40-CDIP (0.600, 15.24mm) Window
  • 40-DIP (0.600, 15.24mm)
  • 44-CLCC (J-Lead)
  • 44-CLCC, Window (J-Lead)
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 44-TQFP
  • 48-FBGA, CSPBGA
  • 48-LQFP
  • 48-TQFP
  • 48-VFQFN Exposed Pad
  • 484-BBGA
  • 49-LFBGA
  • 56-LFBGA, CSPBGA
  • 64-TFBGA
  • 64-TFBGA, CSPBGA
  • 64-TQFP
  • 64-TQFP Exposed Pad
  • 64-VFBGA, CSPBGA
  • 672-BBGA
  • 676-BBGA
  • 68-LCC (J-Lead)
  • 68-TFBGA
  • 8-UFQFN
  • 8-WFDFN Exposed Pad
  • 84-LCC (J-Lead)
  • A
  • BGA
  • CDIP
  • CLCC
  • DIP
  • FBGA
  • FCBGA
  • J
  • LCC
  • LQFP
  • PDIP
  • PLCC
  • PQFP
  • Q
  • QFP
  • S
  • SOIC
  • TFBGA
  • TQFP

Packaging

  • Bulk
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Not For New Designs
  • Obsolete

Pbfree Code

  • icon-pbfree yes
  • no
  • yes

Published

  • 1994
  • 1995
  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2012
  • 2013
  • 2014
  • 2016

Series

  • ATF15xx
  • ATF2500C(L)
  • ATF750C(L)
  • ATF750LVC
  • ATV2500B(L) and BQ(L)
  • CoolRunner II
  • CoolRunner XPLA3
  • Delta 39K™ ISR™
  • GAL®16LV8
  • GAL®16V8
  • GAL®18V10
  • GAL®20RA10
  • GAL®20V8
  • GAL®22LV10
  • GAL®22V10
  • GAL®26CV12
  • GAL®26V12
  • ispGAL™22LV10
  • ispGAL™22V10
  • ispLSI® 1000
  • ispLSI® 1000E
  • ispLSI® 1000EA
  • ispLSI® 2000A
  • ispLSI® 2000E
  • ispLSI® 2000VE
  • ispLSI® 3000
  • ispLSI® 5000VA
  • ispLSI® 5000VE
  • ispMACH® 4000B
  • ispMACH® 4000C
  • ispMACH® 4000V
  • ispMACH® 4000Z
  • ispMACH® 4000ZE
  • ispMACH® 4A
  • ispMACH™ 5000VG
  • ispXPLD® 5000MB
  • ispXPLD® 5000MC
  • ispXPLD® 5000MV
  • LA-ispMACH
  • LA-MachXO
  • MACH® 4
  • MACH® 5
  • MAX® 3000A
  • MAX® 7000
  • MAX® 7000A
  • MAX® 7000B
  • MAX® 7000S
  • MAX® 9000
  • MAX® 9000A
  • MAX® II
  • MAX® V
  • Ultra37000™
  • Ultralogic™
  • XA9500XL XA
  • XC9500
  • XC9500XL
  • XC9500XV

Subcategory

  • Field Programmable Gate Arrays
  • Programmable Logic Devices

Supplier Device Package

  • 0402-3P
  • 100-FBGA (11x11)
  • 100-PQFP (14x20)
  • 100-PQFP (20x14)
  • 100-TQFP (14x14)
  • 128-TQFP (14x14)
  • 144-TQFP (20x20)
  • 160-PQFP (28x28)
  • 160-TQFP (24x24)
  • 169-UBGA (11x11)
  • 176-TQFP (24x24)
  • 208-PQFP (28x28)
  • 208-RQFP (28x28)
  • 24-PDIP
  • 24-SO
  • 240-RQFP (32x32)
  • 256-BGA (27x27)
  • 256-FBGA (17x17)
  • 256-FPBGA (17x17)
  • 256-FTBGA (17x17)
  • 256-MBGA (11x11)
  • 256-PBGA (27x27)
  • 256-SBGA (27x27)
  • 28-PLCC (11.51x11.51)
  • 28-PLCC (11.5x11.5)
  • 304-RQFP (40x40)
  • 352-MBGA (35x35)
  • 352-SBGA (35x35)
  • 388-BGA (30x30)
  • 40-Cerdip
  • 40-PDIP
  • 44-PLCC (16.51x16.51)
  • 44-PLCC (16.58x16.58)
  • 44-PLCC (16.59x16.59)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 44-VQFP (10x10)
  • 48-CSBGA (7x7)
  • 48-TQFP
  • 48-TQFP (7x7)
  • 484-FPBGA (23x23)
  • 49-UBGA (7x7)
  • 56-CSBGA (6x6)
  • 676-FPBGA (31x31)
  • 68-PLCC (24.23x24.23)
  • 68-PLCC (24x24)
  • 84-PLCC (29.31x29.31)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • TTL

Terminal Finish

  • GOLD
  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Matte Tin/Copper (Sn/Cu)
  • MATTE TIN/NICKEL PALLADIUM GOLD
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN BISMUTH
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Bismuth (Sn/Bi)
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn/Pb) - hot dipped
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position

  • BOTTOM
  • DUAL
  • PERPENDICULAR
  • QUAD

Termination

  • SMD/SMT
  • Through Hole

Weight

  • 1.182714g
  • 1.319103g
  • 1.758804g
  • 1.764389g
  • 2.386605g
  • 3.740011g
  • 5.953513g
  • 503.487531mg
  • 6.777889g
  • 657.000198mg
  • 9.071791g
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Package / Case Max Supply Voltage REACH SVHC Min Supply Voltage Frequency Width Mounting Type Operating Temperature Height Seated (Max) Max Frequency JESD-609 Code Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Terminal Pitch Propagation Delay Turn On Delay Time Supplier Device Package Memory Type Number of I/O Number of Programmable I/O Number of Gates Output Function Programmable Type Number of Macro Cells Number of Logic Blocks (LABs) Voltage Supply - Internal Speed Grade Delay Time tpd(1) Max
    ATF1504ASL-25AI100 ATF1504ASL-25AI100 Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1997 ATF15xx Obsolete 3 (168 Hours) Non-RoHS Compliant 100-TQFP Surface Mount -40°C~85°C TA ATF1504ASL In System Programmable (min 10K program/erase cycles) 64 4.5V~5.5V 25ns
    ATF1502ASV-20AI44 ATF1502ASV-20AI44 Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1997 ATF15xx Obsolete 3 (168 Hours) Non-RoHS Compliant 44-TQFP Surface Mount -40°C~85°C TA ATF1502ASV In System Programmable (min 10K program/erase cycles) 32 3V~3.6V 20ns
    ATF1504AS-10AC44 ATF1504AS-10AC44 Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Surface Mount Tray 1997 ATF15xx Obsolete 3 (168 Hours) 70°C 0°C Non-RoHS Compliant Contains Lead No 44 44-TQFP 5.25V 4.75V Surface Mount 0°C~70°C TA 125MHz ATF1504AS 10 ns 44-TQFP (10x10) EEPROM 32 32 1500 In System Programmable (min 10K program/erase cycles) 64 4 4.75V~5.25V 10 10ns
    ATF1504ASV-15AU44 ATF1504ASV-15AU44 Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 14 Weeks Surface Mount Tray 1997 ATF15xx yes Active 3 (168 Hours) 44 3.3V 10mm ROHS3 Compliant Lead Free Tin No 44 44-TQFP 3.6V No SVHC 3V 76.9MHz 10mm Surface Mount -40°C~85°C TA 1.2mm e3 QUAD GULL WING 260 3.3V 40 ATF1504ASV 0.8mm 15 ns 15 ns EEPROM 32 1500 MACROCELL In System Programmable (min 10K program/erase cycles) 64 3V~3.6V 15
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