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Configuration Proms for FPGAs
Additional Feature
- 4 WIRE INTERFACE TO FLEX 8000 DEVICES
- ALSO OPERATES AT 5V SUPPLY
- IT CAN ALSO OPERATE AT 5V SUPPLY
- IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
- IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
- USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Contact Plating
- Copper, Silver, Tin
- Gold
- Lead, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.B.1.A
- 3A991.B.1
- 3A991.B.1.A
- 3A991.B.1.B.1
- 3A991.B.2.A
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 25 Weeks
- 30 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
HTS Code
- 8542.32.00.51
- 8542.32.00.61
- 8542.32.00.71
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
Manufacturer Package Identifier
- XCF02SVOG20C
Max Operating Temperature
- 125°C
- 70°C
- 85°C
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2 (1 Year)
- 3
- 3 (168 Hours)
- Not Applicable
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 100
- 16
- 20
- 24
- 32
- 44
- 48
- 64
- 8
- 88
Number of Terminals
- 100
Number of Terminations
- 100
- 16
- 20
- 24
- 32
- 44
- 48
- 64
- 8
- 88
Operating Temperature
- -40°C~85°C
- 0°C~70°C
Package / Case
- 100-BQFP
- 16-SOIC (0.295, 7.50mm Width)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 24-LBGA
- 24-TBGA
- 32-TQFP
- 44-LCC (J-Lead)
- 44-TQFP
- 48-TFBGA, CSPBGA
- 48-TFSOP (0.724, 18.40mm Width)
- 64-TBGA
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-TDFN
- 88-LFBGA
- FBGA
- PDIP
- PLCC
- PQFP
- SOIC
Packaging
- Bulk
- Tray
- Tube
Part Status
- Active
- Discontinued
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2004
- 2005
- 2006
- 2007
- 2008
- 2010
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- EPC
- EPCQ
- EPCQ-A
- EPCQ-L
- EPCS
- EPCV
Subcategory
- Flash Memories
- OTP ROMs
Supplier Device Package
- 100-PQFP (20x14)
- 16-SOIC
- 20-PLCC (9x9)
- 20-SOIC
- 20-TSSOP
- 32-TQFP (7x7)
- 44-PLCC (16.6x16.6)
- 44-TQFP (10x10)
- 8-LAP
- 8-LAP (6x6)
- 8-PDIP
- 8-SOIC
- 8-TSOP
- 88-UBGA (11x8)
Surface Mount
- NO
- YES
Technology
- CMOS
- MOS
Terminal Finish
- MATTE TIN
- MATTE TIN (472) OVER COPPER
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL (39) PALLADIUM (2) GOLD
- NICKEL PALLADIUM GOLD
- Nickel/Gold (Ni/Au)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Termination
- SMD/SMT
- Through Hole
Type
- NOR TYPE
Weight
- 1.758804g
- 540.001716mg
- 665.986997mg
- 722.005655mg
- 930.006106mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | REACH SVHC | Reach Compliance Code | Density | Frequency | Height | Width | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Memory Size | Memory Type | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Programmable Type | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AT17LV256-10NU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tube | 1997 | yes | Active | 1 (Unlimited) | 8 | 5V | 5mm | ROHS3 Compliant | Lead Free | No | 8 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, Serial | No SVHC | 256 kb | 33MHz | 1.5mm | 3.99mm | Surface Mount | -40°C~85°C | CMOS | 10mA | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 40 | AT17LV256 | 1.27mm | 3V | 3.3V | 3.6V | 256Kb | EEPROM | 3V~3.6V 4.5V~5.5V | 256KX1 | 0.00015A | Serial EEPROM | 90 | 100000 Write/Erase Cycles | HARDWARE | |||||||||||||||||||||||
 |
XC17S30XLPD8C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | 0°C~70°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 3.3V | XC17S30XL | 8 | NO | 2.54mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 300kb | 0.005mA | 3V~3.6V | 1 | MEMORY CIRCUIT | 10MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||||||||
|
AT17LV256-10PU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | Tube | 1997 | yes | Active | 1 (Unlimited) | 8 | 10.16mm | ROHS3 Compliant | Lead Free | No | 8 | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8-DIP (0.300, 7.62mm) | 2-Wire | No SVHC | 256 kb | 12.5MHz | 5.334mm | 7.11mm | Through Hole | 930.006106mg | -40°C~85°C | CMOS | 10mA | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | 3.3V | AT17LV256 | 2.54mm | 3V | 3.3V | 3.6V | 256Kb | EEPROM | 3V~3.6V 4.5V~5.5V | 256KX1 | 0.00015A | Serial EEPROM | 90 | 100000 Write/Erase Cycles | HARDWARE | ||||||||||||||||||||||||||
 |
AT17F16A-30CU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Surface Mount | Tube | 1997 | yes | Active | 3 (168 Hours) | 8 | 3.3V | 5.99mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-TDFN | 2-Wire, Serial | 16 Mb | 10MHz | 5.99mm | Surface Mount | -40°C~85°C | CMOS | 1.14mm | 1 | 50mA | e4 | DUAL | 260 | 3.3V | 40 | AT17F16A | 1.27mm | 2.97V | 3.63V | 2.97V~3.63V | 16MX1 | 1 | CONFIGURATION MEMORY | FLASH | 0.03ms | |||||||||||||||||||||||||||||||
|
XC17512LPD8I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | no | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | -40°C~85°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 225 | 3.3V | 30 | XC17512L | 8 | NO | 2.54mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 512kb | 0.005mA | 3V~3.6V | 512KX1 | 1 | CONFIGURATION MEMORY | SERIAL | 15MHz | 0.00005A | OTP | COMMON | ||||||||||||||||||||||||||
 |
XC17V01SO20I | Rochester Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 3 (168 Hours) | 20 | 12.8mm | Non-RoHS Compliant | 20-SOIC (0.295, 7.50mm Width) | unknown | 7.5mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | 2.65mm | 1 | e0 | TIN LEAD | DUAL | GULL WING | 225 | 3.3V | 30 | 20 | YES | 1.27mm | R-PDSO-G20 | 3V | COMMERCIAL | 3.6V | 1Mb | 3V~3.6V | 1MX1 | 1 | 1048576 bit | CONFIGURATION MEMORY | SERIAL | OTP | ||||||||||||||||||||||||||||||||||
|
XC18V01SOG20C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 1999 | yes | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 12.827mm | ROHS3 Compliant | Lead Free | No | 20 | 20-SOIC (0.295, 7.50mm Width) | 1 Mb | 7.5184mm | Surface Mount | 0°C~70°C | CMOS | 2.6416mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XC18V01 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 128KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 20 |
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AT17LV256-10NU Microchip Technology
Surface Mount 256Kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) Serial EEPROM Active AT17LV256
Price: 0.0000
RFQ -
XC17S30XLPD8C Xilinx
Through Hole 300kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S30XL not_compliant
Price: 0.0000
RFQ -
AT17LV256-10PU Microchip Technology
Through Hole 256Kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) Serial EEPROM Active AT17LV256
Price: 0.0000
RFQ -
AT17F16A-30CU Microchip Technology
Surface Mount Tube Configuration Proms for FPGAs 3 (168 Hours) FLASH Active AT17F16A
Price: 0.0000
RFQ -
XC17512LPD8I Xilinx
Through Hole 512kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17512L not_compliant
Price: 0.0000
RFQ -
XC17V01SO20I Rochester Electronics
Surface Mount 1Mb Mb Tube Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete unknown
Price: 0.0000
RFQ -
XC18V01SOG20C Xilinx
Surface Mount Tube Configuration Proms for FPGAs 3 (168 Hours) In System Programmable Active XC18V01
Price: 0.0000
RFQ
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