Items : %s%s
Application Specific Microcontrollers
Additional Feature
- ALSO HAVING SECONDARY DIGITAL SUPPLY 5V(TYP), 6 MHZ CRYSTAL INPUT.
- ALSO HAVING SECONDARY DIGITAL SUPPLY 5V(TYP).
- ALSO OPERATES AT 3.3 V
- ALSO OPERATES AT 3.3V NOMINAL
- ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE
- ALSO OPERATES AT 5 V NOMINAL
- ALSO OPERATES AT 5V SUPPLY
- ALSO REQUIRES 3.3 V I/O SUPPLY
- ALSO REQUIRES 3.3V I/O SUPPLY
- ALSO REQUIRES 3.3V SUPPLY
- DATA RETENTION => 10 YEARS
- DATA RETENTION => 10 YEARS; ENDURANCE =>100K WRITE/ERASE CYCLES
- FLASH MEMORY INCLUDES BUILT-IN 4KB IN
- IEEE 802.1P; IEEE 802.1Q; IEEE 802.3; IEEE 802.3AB; IEEE 802.3U
- IT ALSO OPERATES 1.8 V AT 8 MHZ MINIMUM SUPPLY
- IT ALSO OPERATES AT 3 TO 5.5 V SUPPLY VOLTAGE
- IT ALSO OPERATES AT 3.3 NOMINAL SUPPLY VOLTAGE
- IT ALSO OPERATES AT 3.3V
- IT CAN ALSO OPERATES WITH 5 VOLTS
- SEATED HT-CALCULATED
Applications
- Audio Record/Playback
- Authentication
- Automotive
- Automotive & Industrial Radar
- Automotive Mirror Control
- Battery Monitor
- BLDC Controller
- Bluetooth
- Capacitive Sensing
- Communications Controller
- Connectivity Processor
- Cryptography
- Desktop Embedded Controller
- Digital Imaging
- Digital Power Controller
- Embedded Multimedia Communication, Security and Entertainment
- Embedded Security Trusted Computing
- Energy Measurement
- Engine Control
- Fingerprint Authentication
- GPS
- GPS Baseband Controller
- Graphics Controller
- Graphics Processor
- Haptics and Capacitive Touch Controller
- HB LED Controller
- Home & Industrial
- Human Machine Interfaces (HMI)
- I/O Controller
- Inductive Sensor Interface
- Industrial
- Infrared Motion Detection
- Intelligent LED Driver
- Keyboard and Embedded Controller
- Keyboard Controller
- LIN Controller
- Motor Control
- Multimedia
- Multimedia, Universal Infrared Control
- Network Processor
- Networking and Communications
- Power Line Communications
- Powerline Communication
- RF4CE, Remote Control
- RKE, Security Systems
- SaTCR LNBs and Switchers
- SD2™ USB and Mass Storage Peripheral Controller
- SD3™ USB and Mass Storage Peripheral Controller
- Security
- Sensing Machine
- Set-Top Boxes, TV
- Smart Energy Appliances, Devices, and Equipment
- Smart Transceiver
- SuperSpeed USB Peripheral Controller
- System Management
- Touchscreen Controller
- Trusted Platform Module (TPM)
- TV Controller
- UHF ASK/FSK
- USB 2.0 Hub Controller
- USB 3.0 Hub Controller
- USB Host/Function Processor
- USB Host/Peripheral Controller
- USB Host/Slave Controller
- USB Hub/Microcontroller
- USB Microcontroller
- USB Serial Port Controller
- USB Streaming Controller
- USB Type C
- Wireless Audio
- Wireless Power Controller
Contact Plating
- Copper, Silver, Tin
- Gold
- Gold, Tin
- Silver, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.A.3
- 3A991.A.2
- 3A991.A.3
- 5A991.B.1
- 5A991.G
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 28 Weeks
- 3 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
fmax-Min
- 12.3 MHz
- 8 MHz
HTS Code
- 8542.31.00.01
- 8542.32.00.51
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e1
- e3/e4
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 7 months ago)
- ACTIVE (Last Updated: 8 months ago)
- LIFEBUY (Last Updated: 1 week ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 6 days ago)
Manufacturer Package Identifier
- SZ16.15
Max Operating Temperature
- 105°C
- 125°C
- 150°C
- 70°C
- 80°C
- 85°C
Min Operating Temperature
- -20°C
- -25°C
- -40°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 4 (72 Hours)
- 6 (Time on Label)
- Not Applicable
- Vendor Undefined
Mount
- Chassis Mount
- Desktop
- Surface Mount
- Through Hole
Mounting Type
- Chassis Mount
- Stud, 7/16 (M10)
- Surface Mount
- Through Hole
Number of Pins
- 100
- 103
- 113
- 120
- 121
- 128
- 131
- 132
- 14
- 144
- 16
- 169
- 177
- 18
- 20
- 208
- 224
- 24
- 265
- 272
- 28
- 289
- 30
- 32
- 35
- 352
- 38
- 388
- 40
- 400
- 42
- 44
- 472
- 48
- 484
- 516
- 52
- 56
- 57
- 64
- 68
- 8
- 80
- 84
- 88
Number of Terminals
- 124
- 132
Number of Terminations
- 100
- 113
- 121
- 128
- 131
- 132
- 14
- 144
- 16
- 169
- 177
- 18
- 1932
- 196
- 2
- 20
- 208
- 224
- 24
- 272
- 28
- 30
- 32
- 35
- 38
- 388
- 40
- 400
- 42
- 44
- 456
- 48
- 516
- 52
- 54
- 56
- 64
- 68
- 8
- 80
- 84
- 88
- 96
Operating Temperature
- -10°C~85°C
- -20°C~85°C TA
- -25°C~70°C
- -25°C~70°C TA
- -25°C~85°C
- -25°C~85°C TA
- -25°C~90°C TA
- -40°C~105°C
- -40°C~105°C TA
- -40°C~115°C
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~150°C
- -40°C~150°C TJ
- -40°C~175°C
- -40°C~80°C
- -40°C~85°C
- -40°C~85°C TA
- -40°C~85°C TC
- -40°C~90°C
- -40°C~90°C TA
- 0°C~65°C
- 0°C~70°C
- 0°C~70°C TA
- 0°C~85°C
Package / Case
- 10-UFDFN Exposed Pad
- 10-VQFN
- 100-LQFP
- 100-LQFP Exposed Pad
- 100-VFBGA
- 100-WFBGA
- 103-TFBGA
- 113-VFBGA
- 12-UFBGA, WLCSP
- 12-VFDFN Exposed Pad
- 120-LQFP
- 121-LFBGA
- 121-TFBGA
- 128-BFQFP
- 128-LQFP
- 128-TFQFN, CSP Dual Rows, Thermal Pads
- 128-TQFP
- 128-TQFP Exposed Pad
- 128-WFBGA
- 129-TFBGA
- 131-UFBGA, WLCSP
- 132-VFQFN Dual Rows, Exposed Pad
- 14-DIP (0.300, 7.62mm)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-UFDFN Exposed Pad
- 144-LFBGA
- 144-LQFP
- 144-TFBGA
- 144-WFBGA
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-UFQFN
- 16-VFQFN
- 16-WQFN Exposed Pad
- 169-LFBGA
- 169-WFBGA
- 177-LFBGA
- 18-DIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 196-BGA
- 20-DIP (0.300, 7.62mm)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFBGA, WLCSP
- 20-VQFN Exposed Pad
- 208-BFQFP
- 208-BFQFP Exposed Pad
- 208-LFBGA
- 208-LQFP
- 224-LFBGA
- 24-DIP (0.300, 7.62mm)
- 24-LSSOP (0.173, 4.40mm Width)
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-UFQFN Exposed Pad
- 24-UQFN Exposed Pad
- 24-VFQFN Exposed Pad
- 257-LFBGA
- 265-LFBGA
- 272-BBGA
- 28-DIP (0.300, 7.62mm)
- 28-LCC (J-Lead)
- 28-LSSOP (0.220, 5.60mm Width)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-TSSOP (0.240, 6.10mm Width)
- 28-VQFN Exposed Pad
- 289-TFBGA
- 292-HBGA
- 30-XFBGA, WLCSP
- 32-LQFP
- 32-SOIC (0.445, 11.30mm Width)
- 32-TQFP
- 32-UFQFN Exposed Pad
- 32-UQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 35-UFBGA, WLCSP
- 352-BBGA
- 38-TFSOP (0.173, 4.40mm Width)
- 388-BBGA
- 388-BGA
- 40-DIP (0.600, 15.24mm)
- 40-DIP (0.620, 15.75mm)
- 40-UFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 400-BGA
- 42-DIP (0.600, 15.24mm)
- 42-UFBGA, CSPBGA
- 42-UFBGA, WLCSP
- 43-WFQFN Exposed Pad
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 44-VFQFN Exposed Pad
- 456-BGA
- 472-TFBGA
- 48-BSSOP (0.295, 7.50mm Width)
- 48-LQFP
- 48-LQFP Exposed Pad
- 48-QFN
- 48-TFLGA, CSP
- 48-TQFP Exposed Pad
- 48-UFQFN Exposed Pad
- 48-VFQFN Exposed Pad
- 48-WFQFN Exposed Pad
- 484-BGA
- 484-TFBGA
- 51-VFQFN Exposed Pad
- 516-BBGA
- 52-DIP
- 52-QFP
- 52-TQFP
- 52-WFQFN Exposed Pad
- 54-BSSOP (0.295, 7.50mm Width)
- 54-SSOP (0.295, 7.50mm Width) Exposed Pad
- 56-BSSOP (0.295, 7.50mm Width)
- 56-VFBGA
- 56-VFQFN Exposed Pad
- 56-WFQFN Exposed Pad
- 57-WFQFN Exposed Pad
- 64-DIP (0.750, 19.05mm)
- 64-LQFP
- 64-LQFP Exposed Pad
- 64-TQFP
- 64-TQFP Exposed Pad
- 64-VFQFN Exposed Pad
- 64-WFBGA
- 68-VFQFN Exposed Pad
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-VDFN Exposed Pad
- 8-VQFN
- 80-BQFP
- 80-LQFP
- 80-QFP
- 84-WFBGA
- 88-TFQFN Exposed Pad
- 896-BGA, FCBGA
- 9-UFBGA, WLCSP
- 96-VFBGA
- Die
- LQFP
- M2.2 Chip Card Module
- M3.2 Chip Card Module
- M5.1 Chip Card Module
- M5.2 Chip Card Module
- M5.3 Chip Card Module
- M8.4 Chip Card Module
- MCC2 Chip Card Module
- MCC8 Chip Card Module
- MFC5.6 Chip Card Module
- MFC5.8 Chip Card Module
- Module
- QFN
- S-MFC5.6-6
- STAC177B
- TQFP
- TSSOP
- VQFN
Packaging
- Bulk
- Cut Tape (CT)
- Tape & Box (TB)
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- icon-pbfree yes
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- A71CH
- Automotive, AEC-Q100
- AVR®
- BT81x
- CapSense® Controllers
- Cartesio+
- Crimzon™
- CryptoController™
- CS3516
- DeepCover®
- enCoRe™
- enCoRe™ III
- enCoRe™ V
- EZ-Color™ CY8CLED
- EZ-Host™
- EZ-PD™ BCR
- EZ-PD™ CCG1
- EZ-PD™ CCG2
- EZ-PD™ CCG3
- EZ-PD™ CCG3PA
- EZ-PD™ CCG4
- EZ-PD™ CCG5
- EZ-PD™ CMG1
- EZ-USB CX3
- EZ-USB FX1™
- EZ-USB FX2LP™
- EZ-USB FX3S™
- EZ-USB FX3™
- EZ-USB FX™
- EZ-USB®
- EZ-USB® SD2
- EZ-USB® SD3
- HX3
- IzoT™
- Jade
- KSZx692
- LONWORKS®
- M8™
- MAXQ®
- MoBL-USB™
- MSP430
- my-d™
- my-d™ NFC
- NET+ARM®
- Neuron®
- OPTIGA™ TPM
- OPTIGA™ Trust X
- PAC52xx
- PIC®
- PL3120®
- PL3150®
- PL3170®
- PNX15xx
- PowerPSoC® CY8CLED
- S32R
- STM32
- STM8S
- STSPIN32F0
- STSPIN32F025x
- STSPIN32F060x
- TCH5E
- TrueTouch™
- TUSB3200
- TUSB3210
- TUSB3410
- XE880x
- XMC1000
- Z16FMC
- ZMOTION®
Subcategory
- Analog to Digital Converters
- Bus Controllers
- Display Drivers
- EEPROMs
- Field Programmable Gate Arrays
- Microcontrollers
- Microprocessors
- Multifunction Peripherals
- Network Interfaces
- Other Consumer ICs
- Other Microprocessor ICs
- Other uPs/uCs/Peripheral ICs
- Power Management Circuits
Supplier Device Package
- 10-VQFN (6x5)
- 100-BGA (6x6)
- 100-LQFP (14x14)
- 100-QFP (14x14)
- 100-TQFP (14x14)
- 100-VFBGA (6x6)
- 120-LQFP (14x14)
- 121-FBGA (10x10)
- 128-PQFP (14x20)
- 128-QFP (14x20)
- 14-DIP
- 14-TSSOP
- 144-LFBGA (10x10)
- 144-LQFP (16x16)
- 144-LQFP (20x20)
- 16-QFN (3x3)
- 16-SOIC
- 16-TQFN (4x4)
- 177-BGA (13x13)
- 20-QFN (5x5)
- 20-WLCSP (1.63x2.03)
- 24-QFN (4x4)
- 24-QSOP
- 24-SOIC
- 24-SQFN (4x4)
- 24-SSO
- 28-QFN (6x6)
- 28-SDIP
- 28-SOIC
- 28-TSSOP
- 32-HVQFN (5x5)
- 32-HVQFN (7x7)
- 32-QFN
- 32-QFN (5x5)
- 32-SOIC
- 32-TQFP (7x7)
- 32-VQFN (4x4)
- 38-TSSOP
- 40-PDIP
- 40-QFN (6x6)
- 40-VQFN (6x6)
- 44-PLCC (16.59x16.59)
- 48-LQFP (7x7)
- 48-PLGA (7x7)
- 48-QFN
- 48-QFN (7x7)
- 48-SSOP
- 48-TQFN (7x7)
- 48-TQFP-EP (7x7)
- 52-TQFP (10x10)
- 54-SOIC-EP
- 56-QFN (8x8)
- 56-QFN-EP (8x8)
- 56-SSOP
- 56-TQFN (8x8)
- 56-VFBGA (5x5)
- 64-DIP
- 64-LQFP (10x10)
- 64-TQFP (10x10)
- 68-QFN (8x8)
- 8-DIP
- 8-QFN
- 8-SOIC
- 84-WFBGA (7x7)
- 896-FCBGA (31x31)
- Die
- M2.2 Chip Card Module
- M3.2 Chip Card Module
- M5.2 Chip Card Module
- M5.3 Chip Card Module
- P-FQFP-208-10
- P-MCC2-2-1
- P-MCC8-3
- PG-DSO-20
- PG-DSO-8
- PG-LQFP-208
- PG-TSSOP-28-2
- PG-VQFN-32-13
- PG-VQFN-48-29
- PG-VQFN-48-31
- S-MFC5.6-6
- S-MFC5.8-9
- T-M5.1-9
- T-M6.3-8
- Wafer
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- MATTE TIN/NICKEL PALLADIUM GOLD
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- Pure Tin (Sn)
- PURE TIN/TIN SILVER COPPER
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn85Pb15)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
- Through Hole
USB
- USB 1.1
- USB 3.0
Weight
- 1.098005g
- 150.507618mg
- 174.292868mg
- 188.609377mg
- 191.387631mg
- 2.26799g
- 227.901816mg
- 258.292505mg
- 3.740011g
- 342.689036mg
- 360.605934mg
- 402.988471mg
- 453.59237mg
- 540.001716mg
- 57.09594mg
- 600.301152mg
- 61.291669mg
- 614.986205mg
- 657.000198mg
- 665.986997mg
- 70.788759mg
- 71.809342mg
- 72.206235mg
- 766.089163mg
- 810.002575mg
- 9.071791g
- 928.191737mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Interface | Reach Compliance Code | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Consumer IC Type | Applications | Supplier Device Package | Speed | Core Processor | RAM Size | Number of I/O | Voltage - Supply | uPs/uCs/Peripheral ICs Type | Clock Frequency | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM (words) | Program Memory Type | Controller Series |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
PNX1501E,557 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2002 | PNX15xx | Obsolete | 3 (168 Hours) | 456 | 27mm | ROHS3 Compliant | ALSO REQUIRES 3.3V SUPPLY | 456-BGA | I2C, 2-Wire Serial | unknown | 27mm | Surface Mount | 0°C~85°C | 2.45mm | 8542.39.00.01 | 1 | e0 | TIN LEAD | BOTTOM | BALL | 225 | 20 | PNX15* | 456 | YES | 1mm | S-PBGA-B456 | 3.13V | Other Consumer ICs | Not Qualified | 1.2V | 3.47V | CONSUMER CIRCUIT | Multimedia | TM3260 | 61 | 1.14V~1.26V | Nexperia | ||||||||||||||||||
 |
MM912JP812AMAFR2 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 26 Weeks | Tape & Reel (TR) | 2012 | Obsolete | 3 (168 Hours) | 100 | 3A991.A.2 | 14mm | ROHS3 Compliant | 100-LQFP Exposed Pad | CAN, SCI, SPI | 14mm | Surface Mount | -40°C~125°C | CMOS | 1.6mm | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 40 | MM912JP812 | YES | 0.5mm | S-PQFP-G100 | Engine Control | S12P | 6K x 8 | 8 | 4.7V~36V | MICROPROCESSOR CIRCUIT | FLASH (128kB) | HCS12 | ||||||||||||||||||||||||
 |
A7001AGHN1/T1AG315 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 32-VFQFN Exposed Pad | I2C, 2-Wire Serial | Surface Mount | -25°C~85°C | A700* | Authentication | 32-HVQFN (5x5) | MX51 | 3.2kB | 1.62V~5.5V | EEPROM (76.4kB) | A700x | |||||||||||||||||||||||||||||||||||||||||
 |
MM912G634DC1AER2 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | Tape & Reel (TR) | 2010 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | LIN, SCI | Surface Mount | -40°C~105°C | MM912G634 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (48kB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||
 |
MM908E622ACEK | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SCI, SPI | Surface Mount | -40°C~85°C | MM908E622 | Automotive Mirror Control | HC08 | 512 x 8 | 12 | 9V~16V | FLASH (16kB) | 908E | ||||||||||||||||||||||||||||||||||||||||||
 |
MM908E624AYPEW | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tube | 2003 | Active | 3 (168 Hours) | 54 | 3A991.A.2 | 17.9mm | ROHS3 Compliant | 54-BSSOP (0.295, 7.50mm Width) | SCI, SPI | 7.5mm | Surface Mount | -40°C~125°C | MOS | 2.65mm | 8542.39.00.01 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 9V | 40 | MM908E624 | YES | 0.65mm | R-PDSO-G54 | Microcontrollers | Not Qualified | Automotive Mirror Control | 32 MHz | HC08 | 512 x 8 | 16 | 5.5V~18V | MICROCONTROLLER | 9.8304MHz | 8 | YES | NO | YES | NO | FLASH (16kB) | 908E | ||||||||||||||
 |
MM912F634CV2APR2 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP | LIN, SCI | Surface Mount | -40°C~105°C | MM912F634 | Automotive | S12 | 2K x 8 | 9 | 2.25V~5.5V | FLASH (32KB) | HCS12 | |||||||||||||||||||||||||||||||||||||||||
|
MM908E625ACPEK | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tube | 2003 | Obsolete | 3 (168 Hours) | 54 | 3A991.A.2 | 17.9mm | ROHS3 Compliant | 54-SSOP (0.295, 7.50mm Width) Exposed Pad | SCI, SPI | 7.5mm | Surface Mount | -40°C~85°C | CMOS | 2.45mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 12V | 40 | MM908E625 | YES | 0.65mm | R-PDSO-G54 | Microcontrollers | Not Qualified | 9/16V | Automotive Mirror Control | 32 MHz | HC08 | 512 x 8 | 13 | 8V~18V | MICROCONTROLLER | 9.8304MHz | 8 | YES | NO | YES | NO | 16384 | FLASH (16kB) | 908E |
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