Items : %s%s
ADC
Contact Plating
- Copper, Silver, Tin
- Gold
- Gold, Silver
- Gold, Tin
- Lead, Silver, Tin
- Lead, Tin
- Silver, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.A.5.A.1
- 3A001.A.5.A.3
- 3A001.A.5.A.4
- 3A001.A.5.A.5
- 3A001A5A1
- 3A001A5A3
- 3A001A5A4
- 3A001A5A5
- 3A991.C.1
- 3A991.C.2
- 3A991.C.3
- 3A991.C.4
- 3A991C2
- 3A991C3
- 5A991.B
- 5A991.B.1
- 5A991.G
- 5A991B
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 3 Weeks
- 30 Weeks
- 35 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
Feature
- Digital Window Comparator, GPIO, Oscillator
- Interleavable, Simultaneous Sampling
- Internal Oscillator
- Internal Oscillator, PGA
- Internal Oscillator, PGA, Temperature Sensor
- Internal Oscillator, Temperature Sensor
- PGA
- PGA, Selectable Address
- PGA, Selectable Address, Temperature Sensor
- PGA, Simultaneous Sampling
- PGA, Simultaneous Sampling, Temperature Sensor
- PGA, Temperature Sensor
- Selectable Address
- Selectable Address, Simultaneous Sampling
- Selectable Address, Simultaneous Sampling, True Bipolar
- Selectable Address, Temperature Sensor
- Simultaneous Sampling
- Simultaneous Sampling, Temperature Sensor
- Simultaneous Sampling, True Bipolar
- Temperature Sensor
- Temperature Sensor, True Bipolar
- True Bipolar
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 11 hours ago)
- ACTIVE (Last Updated: 12 hours ago)
- ACTIVE (Last Updated: 14 hours ago)
- ACTIVE (Last Updated: 16 hours ago)
- ACTIVE (Last Updated: 18 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 2 hours ago)
- ACTIVE (Last Updated: 2 months ago)
- ACTIVE (Last Updated: 2 weeks ago)
- ACTIVE (Last Updated: 21 hours ago)
- ACTIVE (Last Updated: 23 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 4 hours ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 hours ago)
- CONTACT ADI (Last Updated: 1 month ago)
- CONTACT ADI (Last Updated: 1 week ago)
- CONTACT ADI (Last Updated: 6 days ago)
- LAST TIME BUY (Last Updated: 1 month ago)
- LAST TIME BUY (Last Updated: 3 days ago)
- LAST TIME BUY (Last Updated: 3 months ago)
- LAST TIME BUY (Last Updated: 4 days ago)
- LAST TIME BUY (Last Updated: 6 days ago)
- LIFEBUY (Last Updated: 2 days ago)
- LIFEBUY (Last Updated: 3 days ago)
- LIFEBUY (Last Updated: 3 weeks ago)
- LIFEBUY (Last Updated: 4 days ago)
- LIFEBUY (Last Updated: 5 days ago)
- NRND (Last Updated: 1 day ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 days ago)
- OBSOLETE (Last Updated: 1 day ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 3 months ago)
- OBSOLETE (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 4 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- OBSOLETE (Last Updated: 6 days ago)
- PREVIEW (Last Updated: 2 months ago)
- Production (Last Updated: 1 day ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 days ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 days ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 days ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
- PRODUCTION (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 6 days ago)
Manufacturer Package Identifier
- 8-uMAX
- DBV (R-PDSO-G6
- L72.10x10E
- PAP
- RGZ(PVQFN-N48)
- RGZ(S-PVQFN-N48)
- RU-28
- WB SOIC
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 5 (48 Hours)
Mount
- Surface Mount
- Surface Mount, Through Hole
- Surface Mount, Wire
- Through Hole
Mounting Feature
- SURFACE MOUNT
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 10
- 100
- 12
- 124
- 128
- 14
- 140
- 144
- 16
- 18
- 192
- 196
- 198
- 20
- 221
- 24
- 256
- 257
- 28
- 292
- 30
- 32
- 323
- 36
- 38
- 40
- 44
- 48
- 5
- 52
- 56
- 6
- 60
- 64
- 68
- 72
- 8
- 80
- 84
- 88
Number of Terminations
- 10
- 100
- 12
- 121
- 124
- 128
- 14
- 140
- 144
- 16
- 18
- 192
- 196
- 198
- 20
- 24
- 256
- 257
- 28
- 292
- 30
- 32
- 323
- 36
- 38
- 40
- 44
- 48
- 5
- 52
- 56
- 6
- 60
- 64
- 68
- 72
- 8
- 80
- 84
- 88
Operating Temperature
- -10°C~70°C
- -10°C~85°C
- -20°C~70°C
- -20°C~75°C
- -20°C~85°C
- -25°C~85°C
- -35°C~85°C
- -40°C~105°C
- -40°C~124°C
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~175°C
- -40°C~70°C
- -40°C~75°C
- -40°C~80°C
- -40°C~84°C
- -40°C~85°C
- -40°C~85°C TA
- -45°C~125°C
- -50°C~105°C
- -50°C~125°C
- -55°C~105°C
- -55°C~115°C TA
- -55°C~125°C
- -55°C~125°C TA
- -55°C~175°C
- -55°C~210°C
- -55°C~225°C
- -55°C~85°C
- 0°C~105°C
- 0°C~125°C
- 0°C~70°C
- 0°C~75°C
- 0°C~85°C
- 20°C~75°C
Package / Case
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 10-VFDFN Exposed Pad
- 10-VFDFN Exposed Pad, CSP
- 10-WFDFN Exposed Pad
- 10-XFQFN
- 10-XFQFN Exposed Pad
- 100-LFBGA
- 100-TQFP Exposed Pad
- 12-TSSOP (0.118, 3.00mm Width)
- 12-WFBGA, WLBGA
- 12-WFDFN Exposed Pad
- 12-WQFN Exposed Pad
- 121-TFBGA
- 124-VFTLA Dual Rows, Exposed Pad
- 128-LQFP Exposed Pad
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 14-SOIC (0.295, 7.50mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-WFDFN Exposed Pad
- 140-BFBGA
- 144-FBGA, FCBGA
- 144-LFBGA
- 144-LFBGA, CSPBGA
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-SSOP (0.209, 5.30mm Width)
- 16-TFSOP (0.118, 3.00mm Width)
- 16-TFSOP (0.118, 3.00mm Width) Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width)
- 16-VFQFN Exposed Pad
- 16-VQFN Exposed Pad
- 16-WFDFN Exposed Pad
- 16-WFQFN Exposed Pad
- 16-WFQFN Exposed Pad, CSP
- 16-WQFN Exposed Pad
- 18-CDIP (0.300, 7.62mm)
- 18-DIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 196-LFBGA
- 196-LFBGA Exposed Pad
- 20-CDIP (0.300, 7.62mm)
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SOIC (0.209, 5.30mm Width)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.154, 3.90mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 20-WQFN Exposed Pad
- 24-CDIP (0.300, 7.62mm)
- 24-DIP (0.300, 7.62mm)
- 24-FLGA
- 24-SOIC (0.209, 5.30mm Width)
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-SSOP (0.209, 5.30mm Width)
- 24-TSSOP (0.173, 4.40mm Width)
- 24-VFQFN Exposed Pad
- 24-WFDFN Exposed Pad
- 24-WFQFN Exposed Pad
- 256-BGA, CSPBGA
- 257-LFBGA
- 28-CDIP (0.600, 15.24mm)
- 28-CLCC
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.154, 3.90mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-VQFN Exposed Pad
- 28-WFQFN Exposed Pad
- 292-BGA
- 292-BGA Exposed Pad
- 30-TFSOP (0.173, 4.40mm Width)
- 32-CDIP (0.900, 22.86mm)
- 32-LQFP
- 32-TQFP
- 32-TSSOP (0.240, 6.10mm Width)
- 32-VFQFN Exposed Pad
- 32-VFQFN Exposed Pad, CSP
- 32-VQFN Exposed Pad
- 32-WFQFN Exposed Pad
- 32-WFQFN Exposed Pad, CSP
- 36-BSOP (0.295, 7.50mm Width)
- 36-SSOP (0.209, 5.30mm Width)
- 38-TFSOP (0.173, 4.40mm Width)
- 38-WFQFN Exposed Pad
- 40-CDIP (0.600, 15.24mm)
- 40-DIP (0.600, 15.24mm)
- 40-VFQFN Exposed Pad
- 40-VFQFN Exposed Pad, CSP
- 40-WFQFN Exposed Pad
- 40-WFQFN Exposed Pad, CSP
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 48-LQFP
- 48-PowerTQFP
- 48-TFSOP (0.240, 6.10mm Width)
- 48-TQFP
- 48-TQFP Exposed Pad
- 48-VFQFN Exposed Pad
- 48-VFQFN Exposed Pad, CSP
- 48-WFQFN Exposed Pad
- 48-WFQFN Exposed Pad, CSP
- 52-LQFP
- 52-QFP
- 52-TQFP Exposed Pad
- 52-WFQFN Exposed Pad
- 56-VFQFN Exposed Pad
- 56-VFQFN Exposed Pad, CSP
- 56-WFQFN Exposed Pad
- 6-TSSOP, SC-88, SOT-363
- 6-WDFN Exposed Pad
- 6-WFDFN Exposed Pad
- 60-WFQFN Exposed Pad
- 64-LQFP
- 64-PowerTQFP
- 64-TQFP
- 64-TQFP Exposed Pad
- 64-VFQFN Exposed Pad
- 64-VFQFN Exposed Pad, CSP
- 64-WFQFN Exposed Pad
- 64-WFQFN Exposed Pad, CSP
- 68-CLCC
- 68-TQFN Exposed Pad
- 68-VFQFN Exposed Pad
- 72-VFQFN Exposed Pad
- 72-VFQFN Exposed Pad, CSP
- 8-DIP (0.300, 7.62mm)
- 8-SMD, Gull Wing
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-VDFN Exposed Pad
- 8-VFDFN Exposed Pad
- 8-VFSOP (0.091, 2.30mm Width)
- 8-WDFN Exposed Pad
- 8-WFDFN Exposed Pad
- 8-XFQFN
- 80-LQFP
- 80-TQFP Exposed Pad
- BGA
- CDIP
- D
- DFN
- DIP
- LCC
- LFCSP EP
- LQFP
- MSOP
- PDIP
- PLCC
- QFN
- QFN EP
- QFP
- QSOP
- SC
- SC-74A, SOT-753
- SOIC
- SOIC N
- SOIC W
- SOT-23
- SOT-23-6
- SOT-23-6 Thin, TSOT-23-6
- SOT-23-8
- SOT-23-8 Thin, TSOT-23-8
- SSOP
- TFSOP
- TQFP
- TSOT
- TSSOP
- UMAX
- VQFN
- VSSOP
Packaging
- Box
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Rail/Tube
- Strip
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- AD9208
- AD9680
- ADS869x
- Automotive
- Automotive, ADI0012
- Automotive, AEC-Q100
- Automotive, AEC-Q100, microPOWER™
- Automotive, AEC-Q101
- iCMOS®
- iCMOS®, PulSAR®
- LinCMOS™
- LTC2311-16
- microPort™
- microPOWER™
- Military, MIL-STD-883
- PowerWise®
- PulSAR®
- SoftSpan™
- SpeedPlus™
- THine®
- µModule®
Supplier Device Package
- 10-LFCSP-WD (3x3)
- 10-MSOP
- 10-MSOP-EP
- 10-TDFN-EP (3x3)
- 10-uMAX
- 124-VTLA (9x9)
- 144-CSPBGA (10x10)
- 16-CDIP
- 16-MSOP
- 16-QFN (3x3)
- 16-SOIC
- 16-TSSOP
- 196-BGA (12x12)
- 20-PDIP
- 20-PLCC (9x9)
- 20-SOIC
- 20-SSOP
- 20-TQFN (4x4)
- 20-TSSOP
- 20-WLCSP (2.39x2.39)
- 24-CDIP
- 24-HQFN (4x4)
- 24-QFN (4x4)
- 24-SOIC
- 24-SSOP
- 28-CDIP
- 28-SOIC
- 28-SSOP
- 28-TQFN (5x5)
- 32-HVQFN (7x7)
- 32-LFCSP-VQ (5x5)
- 32-LFCSP-WQ (5x5)
- 40-HVQFN (6x6)
- 48-LFCSP-VQ (7x7)
- 48-QFN (7x7)
- 52-QFN (7x8)
- 56-HVQFN
- 56-LFCSP-VQ (8x8)
- 56-QFN (8x8)
- 64-HVQFN (9x9)
- 64-LFCSP (9x9)
- 64-LFCSP-WQ (9x9)
- 64-LQFP (10x10)
- 64-SMT (9x9)
- 64-TQFP-EP (10x10)
- 72-LFCSP-VQ (10x10)
- 72-QFN (10x10)
- 8-DFN (2x3)
- 8-MSOP
- 8-PDIP
- 8-SOIC
- 80-LQFP (14x14)
- TSOT-23-6
Surface Mount
- NO
- YES
Terminal Finish
- GOLD
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- Gold/Nickel (Au/Ni)
- MATTE TIN
- MATTE TIN (800)
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- NOT SPECIFIED
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Lead/Silver (Sn62Pb36Ag2)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
- Through Hole
Tolerance
- 10%
- 4%
Type
- General Purpose
Weight
- 1.098005g
- 1.182714g
- 130.010913mg
- 138.005479mg
- 186.993455mg
- 2.26799g
- 2.386605g
- 203.804722mg
- 23.700201mg
- 241.793083mg
- 26.506804mg
- 274.706879mg
- 29.993795mg
- 378.607881mg
- 4.535924g
- 446.703436mg
- 496.003257mg
- 5.896701mg
- 62.99264mg
- 665.986997mg
- 730.794007mg
- 800.987426mg
- 850.995985mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Mount | Packaging | Pbfree Code | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Min Supply Voltage | Height | Width | Technology | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Signal to Noise Ratio (SNR) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Analog IC - Other Type | Number of Circuits | Power Dissipation-Max | Quiescent Current | Resolution | Number of Bits | Number of Converters | Number of Analog In Channels | Output Bit Code | Number of A/D Converters | Analog Input Voltage-Max | Output Format | Analog Input Voltage-Min | Sampling Rate | Conversion Rate | Number of D/A Converters | Converter Type | Linearity Error-Max (EL) | Sample and Hold / Track and Hold |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "UDA1361TSDK") |
UDA1361TSDK | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | RoHS Compliant | Lead Free | 16 | SSOP | 2 | 24 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
TDA8784HLBE-S | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 75°C | -20°C | 5V | RoHS Compliant | Lead Free | LQFP | 1 | 1.25 B | 10 | 1 | 18 Msps | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
ADC1005S060TS/C1,118 | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | RoHS Compliant | Lead Free | SSOP | 1 | 60 Msps | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
TDA8763M5DB | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 28 | EAR99 | 85°C | -40°C | RoHS Compliant | Lead Free | SSOP | Parallel | 5.25V | 4.75V | 5.3mm | 2mm | 1 | DUAL | GULL WING | 260 | 5V | 40 | INDUSTRIAL | YES | 0.65mm | R-PDSO-G28 | 58 dB | Not Qualified | 305mW | 1.25 B | 10 | 1 | 1 | BINARY, 2'S COMPLEMENT BINARY | 5 MHz | 50 Msps | ADC, PROPRIETARY METHOD | |||||||||||||||||||||||||||||||||
 |
PCF8591P | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Through Hole | yes | 16 | 85°C | -40°C | 19.5mm | RoHS Compliant | 16 | PDIP | 6V | No SVHC | 2.5V | 3.2mm | 6.48mm | CMOS | 1 | 1mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | NOT APPLICABLE | 5V | NOT APPLICABLE | 16 | INDUSTRIAL | 2.54mm | Not Qualified | ANALOG CIRCUIT | 1 B | 8 | 1 | 11.1 ksps | |||||||||||||||||||||||||||||||||||
|
UDA1345TSDB | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 85°C | -40°C | 3.6V | RoHS Compliant | Lead Free | SSOP | I2S, Serial | 10mA | 100 dB | 10mA | 3 B | 24 | 2 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
TDA8763AM4DB-T | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 28 | EAR99 | 85°C | -40°C | RoHS Compliant | Lead Free | 28 | SOT-341 | 5.3mm | 2mm | 8542.39.00.01 | 1 | DUAL | GULL WING | 260 | 5V | 40 | 28 | COMMERCIAL | YES | 0.65mm | Not Qualified | 247mW | 10 | 1 | BINARY, 2'S COMPLEMENT BINARY | PARALLEL, WORD | 40 MHz | 40 Msps | ADC, PROPRIETARY METHOD | 0.1953% | ||||||||||||||||||||||||||||||||||||
|
TDA8763M/4DB-T | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 28 | EAR99 | 85°C | -40°C | RoHS Compliant | Lead Free | SSOP | Parallel | 5.25V | 4.75V | 5.3mm | 2mm | 1 | DUAL | GULL WING | 5V | INDUSTRIAL | YES | 0.65mm | R-PDSO-G28 | 58 dB | Not Qualified | 305mW | 1.25 B | 10 | 1 | 1 | BINARY, 2'S COMPLEMENT BINARY | 4 MHz | 40 Msps | ADC, PROPRIETARY METHOD | ||||||||||||||||||||||||||||||||||
|
PCF8591TD-T | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Cut Tape | 16 | 10.3mm | RoHS Compliant | Lead Free | 16 | SOIC | 7.5mm | CMOS | 2.65mm | 1 | 1μA | e4 | NICKEL PALLADIUM GOLD | DUAL | GULL WING | 5V | 16 | INDUSTRIAL | YES | 1.27mm | 2.5V | 4 | Not Qualified | 6V | ANALOG CIRCUIT | 8 | ||||||||||||||||||||||||||||||||||||||||
 |
ADC1412D065HN/C1,5 | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3.4V | RoHS Compliant | No | 64 | SOT-804-3 | SPI, Serial | 72 dB | 2 | 1.2W | 1.75 B | 14 | 2 | 65 Msps | 125 Msps | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
UDA1361TSDK-T | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 85°C | -40°C | RoHS Compliant | Lead Free | 16 | SOT-369 | 100 dB | 2 | 3 B | 24 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
ADC1206S040H/C1,51 | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | yes | 3 (168 Hours) | 44 | 85°C | -40°C | 5.25V | RoHS Compliant | No | 44 | PQFP | Parallel | BICMOS | 1 | e3 | TIN | QUAD | GULL WING | 260 | 5V | 30 | 44 | INDUSTRIAL | YES | 0.8mm | Analog to Digital Converters | 5V | 660mW | 12 | 1 | 1 | BINARY, 2'S COMPLEMENT BINARY | 2V | 1V | 40 Msps | 40 Msps | ADC, PROPRIETARY METHOD | SAMPLE | ||||||||||||||||||||||||||||||
|
PCF8591TD | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 16 | 10.3mm | RoHS Compliant | Lead Free | 16 | SOIC | 7.5mm | CMOS | 2.65mm | 1 | 1μA | e4 | NICKEL PALLADIUM GOLD | DUAL | GULL WING | 5V | 16 | INDUSTRIAL | YES | 1.27mm | 2.5V | 4 | Not Qualified | 6V | ANALOG CIRCUIT | 8 | ||||||||||||||||||||||||||||||||||||||||
|
ADC1206S055H/C1,51 | NXP Semiconductors / Freescale | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | RoHS Compliant | No | PQFP | Parallel | 12 | 1 | 55 Msps |
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