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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

IC Adapters

Additional Feature

  • ADAPTER
  • SOCKET ADAPTER
  • SOCKET ADAPTER, 94V-0
  • SOCKET ADAPTER, UL 94V-0
  • STANDARD: UL 94V-0
  • UL 94V-0

Board Material

  • FR4 Epoxy Glass
  • Polyimide (PI)

Body Breadth

  • 0.7 inch

Body Depth

  • 0.3 inch

Body Material

  • Glass, Polysulfone

Cable Length

  • 3m

Connector Type

  • DIP, Socket

Contact Finish - Mating

  • GOLD
  • GOLD (10)
  • GOLD (10) OVER NICKEL (100)
  • NOT SPECIFIED
  • Silver
  • TIN
  • TIN LEAD
  • Tin-Lead

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Contact Finish Thickness - Post

  • Flash

Contact Material

  • Brass
  • Copper

Contact Material - Mating

  • Beryllium Copper
  • Brass
  • Copper
  • Phosphor Bronze

Contact Material - Post

  • Beryllium Copper
  • Brass
  • Brass Alloy
  • Phosphor Bronze

Contact Plating

  • Gold
  • Gold, Tin
  • Lead, Tin
  • Silver
  • Tin

Contact Style

  • RND PIN-SKT

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PLCC
  • PQFP
  • QFP
  • SIP
  • Socket, 0.6 (15.24mm) Row Spacing
  • SOIC
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

  • DIP
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Core Architecture

  • AVR

Current Rating

  • 1A
  • 3A

Current Rating (Amps)

  • 1A
  • 3A

Depth

  • 25.4mm
  • 32.3mm
  • 32mm
  • 43.2mm
  • 6.9mm

Device Socket Type

  • IC SOCKET

ECCN Code

  • EAR99

Factory Lead Time

  • 16 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks

Feature

  • Closed Frame
  • High Temperature
  • Socket Included

Flammability Rating

  • UL94 V-0

Gender

  • Female

Height

  • 1.58mm
  • 2.29mm
  • 2.39mm
  • 5.85mm
  • 6.08mm
  • 6.9mm

Housing Material

  • Polyamide
  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled
  • RYTON

Insulation Resistance

  • 1GOhm

JESD-609 Code

  • e0
  • e3
  • e4

Lead Free

  • Contains Lead
  • Lead Free

Lead Length

  • 2.032mm
  • 2.286mm
  • 3.175mm
  • 3.302mm
  • 3.683mm
  • 3.81mm
  • 3m
  • 5.9944mm

Lead Pitch

  • 1.27mm
  • 2.54mm

Length

  • 10.2mm
  • 100.3mm
  • 17.8mm
  • 19.4mm
  • 20.3mm
  • 22.2mm
  • 22.9mm
  • 25.4mm
  • 30.5mm
  • 34.3mm
  • 35.6mm
  • 39.4mm
  • 3m
  • 40.1mm
  • 40.5mm
  • 40.6mm
  • 43.2mm
  • 45mm
  • 50.3mm
  • 55.2mm
  • 65.5mm
  • 68.1mm
  • 69.9mm
  • 72.5mm
  • 95.7mm

Material

  • Glass, Polyester, Thermoplastic
  • Polyester

Material Flammability Rating

  • UL94 V-0

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • Not Applicable

Mount

  • Socket
  • Surface Mount
  • Through Hole
  • Through Hole, Wire
  • Wire

Mounting Type

  • Surface Mount
  • Through Hole

Number of Contacts

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 200
  • 208
  • 22
  • 24
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Positions

  • 10
  • 12
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 22
  • 24
  • 26
  • 28
  • 32
  • 40
  • 42
  • 48
  • 56
  • 64
  • 90
  • 95

Number of Rows

  • 1
  • 2

Orientation

  • Straight

Package / Case

  • PLCC
  • QFP
  • SOIC
  • TO-8
  • TSOP

Packaging

  • Box
  • Bulk

Part Status

  • Active
  • Obsolete

Pbfree Code

  • no
  • yes

PCB Contact Pattern

  • RECTANGULAR

PCB Contact Row Spacing

  • 0.3 mm
  • 0.6 mm

Pitch

  • 1.778mm
  • 1.78mm
  • 2.54mm

Pitch - Mating

  • 0.020 0.50mm
  • 0.024 0.60mm
  • 0.025 0.64mm
  • 0.026 0.65mm
  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Pitch - Post

  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Published

  • 2000
  • 2001
  • 2002
  • 2003
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2017
  • 2018

Radiation Hardening

  • No

REACH SVHC

  • No SVHC

RoHS Status

  • Non-RoHS Compliant
  • RoHS Compliant
  • ROHS3 Compliant

Row Spacing

  • 10.16 mm
  • 15.24 mm
  • 2.54 mm
  • 20.32 mm
  • 22.86 mm
  • 25.4 mm
  • 3.81 mm
  • 7.62 mm

Sensing Distance

  • 3 m

Series

  • 647
  • DS9075

Termination

  • Solder
  • Wire Wrap

Termination Post Length

  • 0.030 0.76mm
  • 0.031 0.80mm
  • 0.080 2.03mm
  • 0.089 2.28mm
  • 0.090 2.29mm
  • 0.125 3.18mm
  • 0.130 3.30mm
  • 0.145 3.68mm
  • 0.150 3.81mm
  • 0.180 4.57mm
  • 0.236 6.00mm
  • 0.620 15.75mm

Voltage - Rated

  • 1kV

Weight

  • 453.59237g
  • 680.388555g

Width

  • 24.4mm
  • 27.9mm
  • 32.3mm
  • 32mm
  • 38.5mm
  • 43.2mm
  • 6.9mm
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
    214-3339-19-0602J 214-3339-19-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 14 150°C -55°C Female Gold Straight 14 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 14 Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2 Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    32-450001-10-P 32-450001-10-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 450001 Active 1 (Unlimited) Solder 32 Non-RoHS Compliant Contains Lead 32 SOIC Through Hole 3.175mm 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
    18-354000-21-RC 18-354000-21-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 Gold 3A 18 Surface Mount 2.286mm 3A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    1111163 1111163 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 1111163 Active 1 (Unlimited) EAR99 Gold 40 Non-RoHS Compliant UL94 V-0 Gold, Tin 40 SOCKET ADAPTER, UL 94V-0 2.54mm e3 2.54mm UL94 V-0 IC SOCKET 10.0μin 0.25μm Brass Socket, 0.6 (15.24mm) Row Spacing PLCC FR4 Epoxy Glass
    800-3-6-1 800-3-6-1 TE Connectivity Deutsch Connectors 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 16 Weeks Active 1 (Unlimited)
    20-351000-10 20-351000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead Tin 1A 20 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    10-350000-10-HT 10-350000-10-HT Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 10 Tin Non-RoHS Compliant Tin 10 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
    20-354000-20 20-354000-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 20 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 20 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    1107254-36 1107254-36 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 36 ROHS3 Compliant UL94 V-0 3A 36 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    LCQT-QFP0.8-32 LCQT-QFP0.8-32 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 32 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.031 0.80mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
    16-304633-18 16-304633-18 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 6 Weeks 2009 Correct-A-Chip® 304633 Active 1 (Unlimited) Solder EAR99 16 Non-RoHS Compliant 16 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    240-1280-09-0602J 240-1280-09-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 40 150°C -55°C Female Gold Straight 6.9mm 40 65.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 40 32.3mm Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    1107254-18 1107254-18 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 3A 18 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    28-350002-11-RC-P 28-350002-11-RC-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder ROHS3 Compliant 28 SOIC Through Hole 3.175mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    16-354W00-20 16-354W00-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant 16 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
    240-1280-39-0602J 240-1280-39-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2006 Textool™ Active 1 (Unlimited) Wire Wrap 40 150°C -55°C Female Gold 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    20-555000-00 20-555000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 6 Weeks 2009 Correct-A-Chip® 555000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant Lead Free 20 SOCKET ADAPTER Surface Mount 105°C e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.050 1.27mm SSOP SOWIC FR4 Epoxy Glass
    1110087 1110087 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks 2012 Correct-A-Chip® 1110087 Active 1 (Unlimited) Solder EAR99 Gold 144 Non-RoHS Compliant 144 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm VQFP PGA FR4 Epoxy Glass
    95-132I25 95-132I25 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 95-132I25 Active 1 (Unlimited) Solder 95 EAR99 Tin 132 34.3mm Non-RoHS Compliant Contains Lead 132 SOCKET ADAPTER 2.39mm Through Hole e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    18-665000-00 18-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    44-653000-11-RC 44-653000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder 44 ROHS3 Compliant UL94 V-0 Lead Free Brass Gold 1A 44 No SVHC Through Hole 3.175mm Socket Included 1A UL94 V-0 15.24 mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    1107254-40 1107254-40 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A 40 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    84-653000-11-RC 84-653000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 105°C -55°C 84 ROHS3 Compliant UL94 V-0 Lead Free 1A 84 UL 94V-0 Through Hole 3.175mm e4 2 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    97-68340 97-68340 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 97-68340 Active 1 (Unlimited) Solder EAR99 Tin 144 39.4mm Non-RoHS Compliant Lead Free 144 SOCKET ADAPTER 2.39mm Through Hole IC SOCKET 0.026 0.65mm 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    28-651000-11-RC 28-651000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Correct-A-Chip® 651000 Obsolete Not Applicable Solder 28 Through Hole 1A 0.026 0.65mm Gold 10.0μin 0.25μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    228-1277-39-0602J 228-1277-39-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    96-100M65 96-100M65 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 2003 Obsolete 1 (Unlimited) Solder EAR99 Tin 200 34.3mm Non-RoHS Compliant Contains Lead 100 SOCKET ADAPTER 2.39mm Through Hole IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    44-305263-20 44-305263-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 305263 Active 1 (Unlimited) Solder EAR99 44 19.4mm Non-RoHS Compliant Lead Free 44 SOCKET ADAPTER 1.58mm Through Hole e3 IC SOCKET 0.024 0.60mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.050 1.27mm QFP PLCC FR4 Epoxy Glass
    24-354W00-10 24-354W00-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free 24 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
    96-160M65 96-160M65 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 96-160M65 Active 1 (Unlimited) Solder EAR99 Tin 160 39.4mm Non-RoHS Compliant Contains Lead 160 SOCKET ADAPTER 2.39mm Through Hole e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
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