Items : %s%s
FIFOs Memory
Additional Feature
- 64X9 DUAL PORT RAM
- ALSO REQURIES 1.8 V
- ALTERNATIVE MEMORY WIDTH 10
- ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
- ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
- ALTERNATIVE MEMORY WIDTH: 10 AND 20
- ASYNCHRONOUS OPERATION ALSO POSSIBLE
- AUTO POWER DOWN
- BYPASS REGISTER
- BYPASS XCVR
- BYPASS-XCVR
- CAN ALSO BE CONFIGURED AS 131,072 X 10 X 4
- CAN ALSO BE CONFIGURED AS 16384 X 9
- CAN ALSO BE CONFIGURED AS 65536 X 9
- EASILY EXPANDABLE IN DEPTH AND WIDTH
- FALL THRU 25NS
- FALL THRU 28NS
- FALL THRU 30NS
- FALL THRU 34NS
- FALL THRU 40NS
- FALL THRU 65NS
- IT CAN ALSO BE CONFIGURED AS 128K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 4K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 64K X 9; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 8K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- MAIL BOX
- MAIL BOX BYPASS REGISTER
- MAIL BOX BYPASS REGISTER; PARITY GENERATOR/CHECKER
- MAIL BOX; PARITY GENERATOR/CHECKER
- MAIL BOX; RETRANSMIT
- MAILBOX
- MAILBOX BYPASS REGISTER
- MAILBOX; PARITY GENERATOR/CHECKER
- PARITY GENERATOR/CHECKER, MAILBOX
- PARITY GENERATOR/CHECKER; MAILBOX
- PORTA/PORTB:PARALLEL/SERIAL
- PORTB:36 OR 18 OR 9; MAILBOX; AUTO POWER DOWN
- REGISTER BASED; BUBBLE BACK 2.7US
- REGISTER BASED; BUBBLE BACK 3US
- REGISTER BASED; BUBBLE BACK 750NS
- RETRANSMIT
- RETRANSMIT; AUTO POWER DOWN
- RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
- RETRANSMIT; AUTO POWER-DOWN
- RETRANSMIT; MAILBOX
- RETRANSMIT; PARITY CHECKER; MAILBOX
- RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX
Contact Plating
- Copper, Silver, Tin
- Gold
- Gold, Tin
- Lead, Tin
- Tin
ECCN Code
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 20 Weeks
- 26 Weeks
- 35 Weeks
- 4 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
HTS Code
- 8542.32.00.71
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
- e3/e4
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- LIFEBUY (Last Updated: 1 day ago)
- LIFEBUY (Last Updated: 1 week ago)
- LIFEBUY (Last Updated: 2 days ago)
- LIFEBUY (Last Updated: 3 months ago)
- LIFEBUY (Last Updated: 6 days ago)
Max Operating Temperature
- 125°C
- 70°C
- 85°C
Max Power Dissipation
- 100mW
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2 (1 Year)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4
- 4 (72 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 100
- 120
- 121
- 128
- 132
- 144
- 16
- 20
- 208
- 209
- 24
- 240
- 256
- 28
- 32
- 324
- 44
- 56
- 64
- 68
- 80
- 84
Number of Terminations
- 100
- 120
- 121
- 128
- 132
- 144
- 16
- 20
- 208
- 209
- 24
- 240
- 256
- 28
- 32
- 324
- 44
- 56
- 64
- 68
- 80
- 84
Operating Temperature
- -40°C~125°C
- -40°C~85°C
- -55°C~125°C
- -55°C~125°C TA
- 0°C~70°C
Package / Case
- 100
- 100-LBGA
- 100-LFBGA
- 120-LQFP
- 120-LQFP Exposed Pad
- 121-BBGA
- 128-LQFP
- 132-BQFP Bumpered
- 132-QFP
- 144-BGA
- 144-QFP
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.209, 5.30mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 18-DIP (0.300, 7.62mm)
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 208-BGA
- 209-BGA
- 24-DIP (0.300, 7.62mm)
- 24-SOIC (0.295, 7.50mm Width)
- 240-BGA
- 256-BBGA
- 28-BSOJ (0.300, 7.62mm Width)
- 28-CDIP (0.300, 7.62mm)
- 28-CDIP (0.600, 15.24mm)
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SOIC (0.345, 8.77mm Width)
- 32-CLCC
- 32-LCC (J-Lead)
- 32-LQFP
- 32-TQFP
- 324-BGA
- 44-LCC (J-Lead)
- 56-BSSOP (0.295, 7.50mm Width)
- 56-TFSOP (0.240, 6.10mm Width)
- 64-LQFP
- 64-QFP
- 64-TQFP
- 68-LCC (J-Lead)
- 80-BQFP
- 80-LQFP
- 84-CPGA
- BGA
- CDIP
- CLCC
- DIP
- FBGA
- LCC
- LQFP
- PDIP
- PLCC
- PQFP
- SOIC
- TFSOP
- TQFP
- TSSOP
Packaging
- Bulk
- Cut Tape (CT)
- Rail/Tube
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
Series
- 4000B
- 7200
- 72T
- 72V
- 74ABT
- 74ACT
- 74ALS
- 74ALVC
- 74F
- 74HC
- 74HCT
- 74S
- 74V
- CY7C
Subcategory
- FIFOs
Supplier Device Package
- 100-BGA MICROSTAR (10.1x10.1)
- 100-CABGA (11x11)
- 120-HLQFP (14x14)
- 120-TQFP (14x14)
- 128-LQFP (14x20)
- 128-TQFP (14x20)
- 132-BQFP (24.54x24.54)
- 144-PBGA (13x13)
- 16-DIP
- 16-PDIP
- 16-SO
- 16-SOIC
- 16-SSOP
- 20-PDIP
- 20-PLCC (9x9)
- 20-SOIC
- 208-PBGA (17x17)
- 209-FBGA (14x22)
- 24-PDIP
- 240-PBGA (19x19)
- 28-CerDip
- 28-DIP
- 28-PDIP
- 28-SOIC
- 28-SOJ
- 32-PLCC (11.43x13.97)
- 32-PLCC (14x11.46)
- 32-TQFP (7x7)
- 324-PBGA (19x19)
- 44-PLCC (16.58x16.58)
- 56-SSOP
- 56-TSSOP
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 68-PLCC (24.23x24.23)
- 80-LQFP (12x12)
- 80-LQFP (14x14)
- 80-QFP (14x20)
- 80-TQFP (14x14)
Surface Mount
- NO
- YES
Technology
- BICMOS
- CMOS
- TTL
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- MATTE TIN/NICKEL PALLADIUM GOLD
- NICKEL PALLADIUM
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- TIN
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
Termination
- SMD/SMT
- Through Hole
Weight
- 1.1991g
- 1.713814g
- 141.690917mg
- 2.214806g
- 2.265694g
- 274.706879mg
- 360.605934mg
- 4.190003g
- 4.608697g
- 4.869796g
- 420.395078mg
- 465.697616mg
- 503.487531mg
- 513.60831mg
- 614.986205mg
- 624.398247mg
- 639.990485mg
- 694.790113mg
- 72.801575mg
- 722.005655mg
- 730.794007mg
- 740.007602mg
- 830.300833mg
- 951.693491mg
- 955.690774mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Max Supply Voltage | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Direction | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Number of Circuits | Data Rate | Element Configuration | Supplier Device Package | Output Characteristics | Access Time | Bus Directional | FWFT Support | Programmable Flags Support | Retransmit Capability | Frequency (Max) | Memory Size | Function | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Word Size | Output Enable | Expansion Type | Cycle Time | Current - Supply (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "IDT7202LA15SOI8") |
IDT7202LA15SOI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2009 | no | 3 | 28 | EAR99 | 85°C | -40°C | 18.3642mm | Non-RoHS Compliant | RETRANSMIT | SOIC | 8.763mm | CMOS | 80mA | 3.048mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 5V | 30 | 28 | INDUSTRIAL | 1.27mm | R-PDSO-G28 | 4.5V | FIFOs | 5V | 5.5V | 15 ns | Unidirectional | No | Yes | 1KX9 | 9 | 9216 bit | OTHER FIFO | PARALLEL | 40MHz | 0.005A | NO | 25 ns | |||||||||||||||||||||||||||||||||||||||
 |
72V3613L20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel | 2009 | no | Discontinued | 4 | 120 | EAR99 | 70°C | 0°C | 3.3V | 14mm | Non-RoHS Compliant | Contains Lead | No | 120 | MAIL BOX BYPASS REGISTER | TQFP | 3.6V | 3V | 2.3 kb | 50MHz | 14mm | 1.4mm | CMOS | 1.6mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 120 | COMMERCIAL | 0.4mm | FIFOs | Dual | 12 ns | Bidirectional | Yes | 50MHz | 64X36 | OTHER FIFO | Synchronous | 36b | PARALLEL | 0.0004A | 36b | YES | 20 ns | |||||||||||||||||||||||||||||||||
 |
72V36100L15PF | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 72V | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 128-LQFP | Surface Mount | 0°C~70°C | 72V36100 | 66.7MHz | 128-TQFP (14x20) | 10ns | Uni-Directional | Yes | Yes | Yes | 2.25M 64K x 36 | Synchronous | 3.15V~3.45V | Depth, Width | 40mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V201L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2005 | no | Active | 3 | 32 | EAR99 | 70°C | 0°C | 3.3V | 7mm | RoHS Compliant | Contains Lead | Lead, Tin | 32 | TQFP | 3.6V | 3V | 2.3 kb | 66.7MHz | 7mm | 1.4mm | CMOS | 20mA | 1.6mm | 1 | 20mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 32 | COMMERCIAL | 0.8mm | FIFOs | Dual | 10 ns | Unidirectional | No | Yes | 66.7MHz | 256X9 | OTHER FIFO | Synchronous | PARALLEL | 0.005A | 9b | YES | 15 ns | |||||||||||||||||||||||||||||||||
 |
72V815L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 | 128 | EAR99 | 70°C | 0°C | 3.3V | 20mm | RoHS Compliant | Contains Lead | Lead, Tin | 128 | TQFP | 3.6V | 3V | 18 kb | 66.7MHz | 14mm | 1.4mm | CMOS | 60mA | 1.6mm | 8542.32.00.71 | 1 | 60mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | FIFOs | 10 ns | Bidirectional | Yes | No | 66.7MHz | 512X18 | OTHER FIFO | Synchronous | PARALLEL | 0.01A | 18b | YES | 15 ns | |||||||||||||||||||||||||||||||||
 |
7202LA15PI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Bulk | 2005 | no | Active | 1 | 28 | EAR99 | 85°C | -40°C | 5V | 36.6mm | RoHS Compliant | Contains Lead | Lead, Tin | 28 | RETRANSMIT | PDIP | 5.5V | 4.5V | 9 kb | 15.24mm | 3.8mm | CMOS | 80mA | 4.699mm | 8542.32.00.71 | 1 | 80mA | e0 | Tin/Lead (Sn85Pb15) | 245 | 5V | 28 | INDUSTRIAL | 2.54mm | FIFOs | 5V | Dual | 15 ns | Unidirectional | No | Yes | 1KX9 | OTHER FIFO | Asynchronous | PARALLEL | 40MHz | 0.005A | 9b | NO | 25 ns | |||||||||||||||||||||||||||||||||
 |
7206L25P | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 7200 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 28-DIP (0.600, 15.24mm) | Through Hole | 0°C~70°C | 7206 | 28.5MHz | 28-PDIP | 25ns | Uni-Directional | No | No | Yes | 144K 16K x 9 | Asynchronous | 4.5V~5.5V | Depth, Width | 120mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72261LA15TFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2002 | Active | 85°C | -40°C | 5V | 10mm | RoHS Compliant | Contains Lead | Lead, Tin | 64 | LQFP | 5.5V | 4.5V | 144 kb | 66.7MHz | 10mm | 1.4mm | 75mA | 75mA | Dual | 10 ns | Unidirectional | Yes | 66.7MHz | Synchronous | 9b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V215L10TFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 | 64 | EAR99 | 70°C | 0°C | 3.3V | 10mm | RoHS Compliant | Lead Free | Tin | 64 | EASILY EXPANDABLE IN DEPTH AND WIDTH | TQFP | 3.6V | 3V | 9 kb | 100MHz | 10mm | 1.4mm | CMOS | 30mA | 1.6mm | 8542.32.00.71 | 1 | 30mA | e3 | QUAD | GULL WING | 260 | 3.3V | 64 | COMMERCIAL | 0.5mm | FIFOs | Dual | 6.5 ns | Unidirectional | Yes | No | 100MHz | 512X18 | OTHER FIFO | Synchronous | PARALLEL | 0.005A | 18b | YES | 10 ns | |||||||||||||||||||||||||||||||||
 |
72T18125L5BBI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 | 240 | EAR99 | 85°C | -40°C | 2.5V | 19mm | RoHS Compliant | Contains Lead | Lead, Tin | 240 | BGA | 2.625V | 2.375V | 9 Mb | 1.76mm | 19mm | 1.76mm | CMOS | 70mA | 8542.32.00.71 | 1 | 70mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 240 | INDUSTRIAL | 1mm | FIFOs | Not Qualified | Dual | 3.6 ns | Unidirectional | Yes | 200MHz | 1.1MB | 512KX18 | OTHER FIFO | Asynchronous | 18b | PARALLEL | 83MHz | 0.02A | YES | 5 ns | ||||||||||||||||||||||||||||||
|
72T18105L5BB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | Active | 70°C | 0°C | 2.5V | 19mm | RoHS Compliant | Contains Lead | Lead, Tin | 240 | BGA | 2.625V | 2.375V | 2.3 Mb | 19mm | 1.76mm | 70mA | 70mA | Dual | 3.6 ns | Unidirectional | Yes | 200MHz | Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V2111L20PF | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 72V | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | 0°C~70°C | 72V2111 | 50MHz | 64-TQFP (14x14) | 12ns | Uni-Directional | Yes | Yes | Yes | 4.5M 512K x 9 | Synchronous | 3.15V~3.45V | Depth, Width | 55mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
72225LB25JI | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 7200 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | -40°C~85°C | 72225 | 40MHz | 15ns | Uni-Directional | Yes | No | 18K 1K x 18 | Synchronous | 4.5V~5.5V | Depth, Width | 60mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
72T72105L4-4BB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 | 324 | EAR99 | 70°C | 0°C | 2.5V | 19mm | RoHS Compliant | Contains Lead | Lead, Tin | 324 | BGA | 2.625V | 2.375V | 4.5 Mb | 225MHz | 19mm | 1.76mm | CMOS | 130mA | 1.97mm | 8542.32.00.71 | 1 | 130mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 324 | COMMERCIAL | 1mm | FIFOs | Not Qualified | Dual | 3.4 ns | Unidirectional | Yes | 225MHz | 64KX72 | OTHER FIFO | Synchronous | PARALLEL | 0.05A | 72b | YES | 4.44 ns | ||||||||||||||||||||||||||||||||
 |
SN74ABT7820-30PH | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 74ABT | no | Obsolete | 3 (168 Hours) | 80 | EAR99 | 5V | 14mm | ROHS3 Compliant | Contains Lead | 80 | BYPASS XCVR | 80-BQFP | 18 kb | 33.4MHz | Surface Mount | 0°C~70°C | BICMOS | 95mA | 3.1mm | 95mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | GULL WING | 260 | 5V | 74ABT7820 | Bidirectional | 0.8mm | FIFOs | 5V | 2 | 33.3MHz | Dual | 3-STATE | 17ns | Bi-Directional | Yes | No | 18K 512 x 18 x 2 | Asynchronous | 4.5V~5.5V | 18 | 18b | PARALLEL | 18b | YES | 30 ns | |||||||||||||||||||||||||||||||||||
 |
72V3670L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 | 128 | EAR99 | 70°C | 0°C | 3.3V | 20mm | RoHS Compliant | Contains Lead | Lead, Tin | 128 | TQFP | 3.45V | 3.15V | 288 kb | 66.7MHz | 14mm | 1.4mm | CMOS | 40mA | 1.6mm | 8542.32.00.71 | 1 | 40mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | NOT SPECIFIED | 128 | COMMERCIAL | 0.5mm | FIFOs | Not Qualified | Dual | 10 ns | Unidirectional | Yes | 66.7MHz | 8KX36 | OTHER FIFO | Synchronous | PARALLEL | 0.015A | 36b | YES | 15 ns | ||||||||||||||||||||||||||||||||
 |
72V3642L10PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel | 2013 | no | Discontinued | 4 | 120 | EAR99 | 70°C | 0°C | 3.3V | 14mm | Non-RoHS Compliant | Contains Lead | No | 120 | MAIL BOX BYPASS REGISTER | TQFP | 3.6V | 3V | 72 kb | 100MHz | 14mm | 1.4mm | CMOS | 400mA | 1.6mm | 8542.32.00.71 | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 120 | COMMERCIAL | 0.4mm | FIFOs | Dual | 6.5 ns | Bidirectional | Yes | 100MHz | 1KX36 | BI-DIRECTIONAL FIFO | Synchronous | 36b | PARALLEL | 0.001A | 36b | YES | 10 ns | |||||||||||||||||||||||||||||||
 |
7201LA12J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 1 | 32 | EAR99 | 70°C | 0°C | 5V | 13.97mm | RoHS Compliant | Contains Lead | Lead, Tin | 32 | RETRANSMIT | PLCC | 5.5V | 4.5V | 4.5 kb | 11.43mm | 2.79mm | CMOS | 80mA | 3.55mm | 1 | 80mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 20 | 32 | COMMERCIAL | 1.27mm | FIFOs | 5V | Dual | 12 ns | Unidirectional | No | Yes | 512X9 | OTHER FIFO | Asynchronous | PARALLEL | 50MHz | 0.0005A | 9b | NO | 20 ns | ||||||||||||||||||||||||||||||||
 |
IDT72T54262L5BBG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | 3 | 324 | EAR99 | 70°C | 0°C | 2.5V | 19mm | RoHS Compliant | 324 | CAN ALSO BE CONFIGURED AS 131,072 X 10 X 4 | BGA | 2.625V | 2.375V | 5 Mb | 200MHz | 19mm | CMOS | 1.97mm | 8542.32.00.71 | 1 | 350mA | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 2.5V | 30 | 324 | COMMERCIAL | Unidirectional | 1mm | Not Qualified | 5 ns | 128KX20 | 20 | Synchronous | PARALLEL | 10b | YES | ||||||||||||||||||||||||||||||||||||||||||||
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72T1895L4-4BBG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | 70°C | 0°C | 2.5V | RoHS Compliant | Copper, Silver, Tin | 144 | BGA | 2.625V | 2.375V | 1.1 Mb | 60mA | 60mA | Dual | 3.4 ns | Unidirectional | Yes | 225MHz | Asynchronous | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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72825LB25BG | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 7200 | Active | 3 (168 Hours) | Non-RoHS Compliant | 121-BBGA | Surface Mount | 0°C~70°C | 72825 | 40MHz | 15ns | Bi-Directional | Yes | No | 36K 1K x 18 x 2 | Synchronous | 4.5V~5.5V | Depth, Width | 100mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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72V36100L7-5BB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2008 | no | Active | 3 | 144 | EAR99 | 70°C | 0°C | 3.3V | 13mm | RoHS Compliant | Contains Lead | Lead, Tin | 144 | BGA | 3.45V | 3.15V | 2.3 Mb | 133.3MHz | 13mm | 1.76mm | CMOS | 40mA | 1.97mm | 8542.32.00.71 | 1 | 40mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 144 | COMMERCIAL | 1mm | FIFOs | Not Qualified | Dual | 5 ns | Unidirectional | Yes | 133.3MHz | 64KX36 | OTHER FIFO | Synchronous | PARALLEL | 0.015A | 36b | YES | ||||||||||||||||||||||||||||||||
 |
7205L12JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2002 | yes | Active | 1 | 32 | EAR99 | 70°C | 0°C | 5V | 13.97mm | RoHS Compliant | Lead Free | Tin | 32 | RETRANSMIT | PLCC | 5.5V | 4.5V | 72 kb | 11.43mm | 2.79mm | CMOS | 120mA | 3.55mm | 1 | 120mA | e3 | QUAD | J BEND | 260 | 5V | 32 | COMMERCIAL | 1.27mm | FIFOs | 5V | Dual | 12 ns | Unidirectional | No | Yes | 8KX9 | OTHER FIFO | Asynchronous | 9b | PARALLEL | 50MHz | 0.012A | 9b | NO | 20 ns | |||||||||||||||||||||||||||||||||
 |
72V285L10PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 | 64 | EAR99 | 70°C | 0°C | 3.3V | 14mm | RoHS Compliant | Lead Free | Tin | 64 | TQFP | 3.6V | 3V | 1.1 Mb | 100MHz | 1.4mm | 14mm | 1.4mm | 360.605934mg | CMOS | 60mA | 1 | 60mA | e3 | QUAD | GULL WING | 260 | 3.3V | 30 | 64 | COMMERCIAL | 0.8mm | FIFOs | Not Qualified | 1 | Dual | 6.5 ns | Unidirectional | Yes | 100MHz | 144kB | OTHER FIFO | Synchronous | 18b | PARALLEL | 0.02A | 18b | YES | ||||||||||||||||||||||||||||||||
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IDT72V7280L15BB | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 72V | Obsolete | 4 (72 Hours) | Non-RoHS Compliant | 256-BBGA | Surface Mount | 0°C~70°C | 72V7280 | 66.7MHz | 10ns | Uni-Directional | Yes | 1.125M 16K x 72 | Synchronous | 3.15V~3.45V | Depth, Width | 75mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
QS72215-25TF | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | no | Obsolete | 64 | ROHS3 Compliant | RETRANSMIT | 64-QFP | Surface Mount | 0°C~70°C | CMOS | e0 | TIN LEAD | QUAD | GULL WING | 5V | YES | S-PQFP-G64 | 4.5V | COMMERCIAL | 5.5V | 15ns | Yes | No | 9K 512 x 18 | Synchronous | 512X18 | 18 | 9216 bit | PARALLEL | YES | 25 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72211L10JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | Active | 70°C | 0°C | 5V | 13.97mm | RoHS Compliant | Lead Free | Tin | 32 | PLCC | 5.5V | 4.5V | 11.43mm | 2.79mm | 35mA | Dual | 6.5 ns | Unidirectional | No | Yes | 100MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V251L15PFI8 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 72V | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-LQFP | Surface Mount | -40°C~85°C | 72V251 | 66.7MHz | 32-TQFP (7x7) | 10ns | Uni-Directional | No | Yes | No | 72K 8K x 9 | Synchronous | 3V~3.6V | Depth, Width | 20mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7204L15TPGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2010 | yes | 28 | EAR99 | 85°C | -40°C | 5V | 34.671mm | RoHS Compliant | Tin | 28 | RETRANSMIT | DIP | 5.5V | 4.5V | 7.62mm | CMOS | 120mA | 4.572mm | 8542.32.00.71 | 1 | e3 | DUAL | 5V | 28 | INDUSTRIAL | 2.54mm | FIFOs | 5V | 15 ns | Unidirectional | No | Yes | 4KX9 | 9 | 36864 bit | OTHER FIFO | PARALLEL | 40MHz | 0.012A | NO | 25 ns | ||||||||||||||||||||||||||||||||||||||||||
 |
72V3662L15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | no | Discontinued | 4 | 120 | EAR99 | 70°C | 0°C | 3.3V | 14mm | Non-RoHS Compliant | Contains Lead | No | 120 | MAIL BOX BYPASS REGISTER | TQFP | 3.6V | 3V | 288 kb | 66.7MHz | 14mm | 1.4mm | CMOS | 1.6mm | 8542.32.00.71 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 120 | COMMERCIAL | 0.4mm | FIFOs | Dual | 10 ns | Bidirectional | Yes | 66.7MHz | 4KX36 | BI-DIRECTIONAL FIFO | Synchronous | 36b | PARALLEL | 0.001A | 36b | YES | 15 ns |
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