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Evaluation Boards

Evaluation boards are electronic circuit boards that are designed to help engineers and developers evaluate the performance of a specific electronic component or system. These boards typically include the necessary components and interfaces to connect the component or system being evaluated to a computer or other testing equipment. Evaluation boards are commonly used in the development and testing of new electronic products, as they allow engineers to quickly and easily test the performance of a component or system in a real-world environment. They are also useful for troubleshooting and debugging electronic systems, as they provide a standardized platform for testing and comparison. Overall, evaluation boards are an essential tool for anyone working with electronic components or systems, as they help to ensure that products are designed and tested to the highest standards of performance and reliability.

Connector Type

  • BOARD CONNECTOR
  • Power
  • USB

Contact Material

  • Brass

Contact Plating

  • Gold
  • Gold, Tin
  • Lead, Tin

ECCN Code

  • 3A991.A.2
  • 7A994
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 111 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 143 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 21 Weeks
  • 22 Weeks
  • 24 Weeks
  • 25 Weeks
  • 26 Weeks
  • 28 Weeks
  • 29 Weeks
  • 3 Weeks
  • 32 Weeks
  • 35 Weeks
  • 4 Weeks
  • 42 Weeks
  • 5 Weeks
  • 52 Weeks
  • 6 Weeks
  • 7 Weeks
  • 70 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

Feature

  • I2C

fmax-Min

  • 0.4 MHz
  • 1 MHz

Frequency

  • 6GHz

Housing Material

  • Thermoplastic

Insulation Material

  • GLASS FILLED POLYBUTYLENE TEREPHTHALATE

JESD-609 Code

  • e1
  • e3

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 1 week ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 3 days ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 5 days ago)
  • ACTIVE (Last Updated: 6 days ago)
  • CONTACT ADI (Last Updated: 1 week ago)
  • IN PRODUCTION (Last Updated: 1 month ago)
  • LAST TIME BUY (Last Updated: 1 month ago)
  • LAST TIME BUY (Last Updated: 1 week ago)
  • LAST TIME BUY (Last Updated: 2 weeks ago)
  • OBSOLETE (Last Updated: 1 week ago)
  • OBSOLETE (Last Updated: 2 weeks ago)
  • OBSOLETE (Last Updated: 4 days ago)
  • PRODUCTION (Last Updated: 1 month ago)
  • PRODUCTION (Last Updated: 1 week ago)
  • PRODUCTION (Last Updated: 2 months ago)
  • PRODUCTION (Last Updated: 2 weeks ago)
  • PRODUCTION (Last Updated: 3 days ago)
  • PRODUCTION (Last Updated: 3 months ago)
  • PRODUCTION (Last Updated: 3 weeks ago)
  • PRODUCTION (Last Updated: 4 days ago)
  • PRODUCTION (Last Updated: 4 months ago)
  • PRODUCTION (Last Updated: 4 weeks ago)
  • PRODUCTION (Last Updated: 5 days ago)
  • PRODUCTION (Last Updated: 6 days ago)

Max Operating Temperature

  • 105°C
  • 125°C
  • 85°C

Mfr

  • Amphenol SGX Sensortech
  • Arduino
  • SparkFun Electronics
  • STMicroelectronics

Min Operating Temperature

  • -40°C

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • 2 (1 Year)
  • 3 (168 Hours)
  • Not Applicable
  • Vendor Undefined

Mount

  • Base
  • Cable
  • External
  • Hardware
  • Panel
  • PCB
  • Plug-In
  • Reverse
  • Screw
  • Socket
  • Standard
  • Surface Mount
  • Vertical
  • Wire

Mounting Feature

  • SURFACE MOUNT

Mounting Style

  • STRAIGHT

Number of Pins

  • 14
  • 16
  • 20
  • 24
  • 28
  • 3
  • 32
  • 48
  • 5
  • 6
  • 78
  • 8

Number of Positions

  • 24

Number of Terminations

  • 18
  • 24

Package / Case

  • 100
  • 24-DIP
  • 300
  • Axial
  • CLCC
  • LCC
  • Metal
  • Module
  • MSOP
  • SIP
  • SMD/SMT
  • SOIC
  • SOP
  • SOT-23
  • SOT-323
  • TSSOP

Packaging

  • Bag
  • Box
  • Bulk
  • Tray

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1997
  • 1998
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Resistance

  • 50Ohm

Series

  • #3
  • -
  • AMT203
  • AMT303
  • AttitudeEngine™
  • AutoDevKit
  • AVR® ATtiny
  • AXO®
  • B6T Workbench
  • Bare Conductive
  • BASIC Stamp®
  • C-SERIES SIPM
  • CaliPile™
  • CameraChip™, OmniBSI™, TrueFocus™
  • CapSense®
  • CapSense® Express™
  • CapSense®, QuietZone™
  • CapTouch™
  • Circuits from the Lab™
  • ColdFire®
  • dBCool®
  • DigiPile™
  • DigiPyro®
  • DLP® NIRscan™
  • Dust Networks®, SmartMesh®
  • eCompass
  • FHS
  • FireFly
  • FlightSense?
  • FlightSense™
  • Flymaple
  • Freedom Xtrinsic
  • FSR
  • g-Select
  • GestIC®
  • GHS-SME
  • Grid-EYE
  • GYPRO®
  • Himalaya
  • HMC
  • HMR
  • iCoupler®
  • iMEMS®
  • iMEMS®, iSensor™
  • iNEMO
  • IQ Switch®, ProxSense®
  • iSensor™
  • J-SERIES SIPM
  • Kinetis
  • LaunchPad™
  • Lepton®
  • LPC17xx
  • LPC800
  • MagAlpha
  • MAXQ®
  • maXTouch™
  • MEMS
  • MEMS, nano
  • MityDSP™
  • MK04
  • MK11/M5
  • MK11/M8
  • MK21
  • MMA
  • MPR
  • MTi 1
  • MTi 10
  • MTi 100
  • mTouch™
  • mTouch™, PICDEM™
  • NanEye®
  • NanoVesta
  • NavChip™
  • PICmicro®
  • PICtail™
  • PICtail™ Plus
  • PIC® 32
  • PSoC®
  • PSOC® CapSense
  • PYTHON
  • QDA
  • QFC
  • QFS
  • QGS
  • QTouch™
  • Quantum, QMatrix™
  • Quantum, QTouch™
  • QuickSense™
  • RabbitCore 4000
  • RB-SERIES SIPM
  • RightTouch™
  • RX
  • S-Touch™
  • Sensors Xplained
  • SensorTile
  • SensorXplorer™
  • Simblee™
  • SimpleLink™ SensorTag
  • SLG
  • SLI
  • SLS
  • SMAARTWIRE™
  • SmartMotion®
  • STAR
  • STM32
  • STM8S
  • STM8T
  • ToolStick
  • TRACKER™
  • Triaxis®
  • TruTherm®
  • Unagi
  • VersaPad™
  • VersaPoint™
  • Vinco, Vinculum-II
  • X-AMP®
  • XENSIV™
  • Xplained Pro
  • Xtrinsic
  • Zena™
  • zForce AIR Touch Sensor
  • ZMOTION®
  • ZSTAR
  • ZSTAR2
  • ZSTAR3
  • µPOINT®

Shape

  • Square

Surface Mount

  • YES

Terminal Finish

  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Tin/Silver/Copper (Sn/Ag/Cu)

Type

  • Integrated Circuit (IC)

USB

  • USB 2.0

Weight

  • 1.133981g
  • 1.360777g
  • 1.814369g
  • 1.995806g
  • 13.607771g
  • 14.605674g
  • 20.411657g
  • 23.586803g
  • 45.359237g
  • 50.008559mg
  • 6.078138g
  • 63.502932g
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Series Part Status Moisture Sensitivity Level (MSL) Operating Supply Voltage Accessory Type Length RoHS Status Lead Free Number of Pins Package / Case REACH SVHC Height Width Resistance Mounting Type Evaluation Kit Type Applications Core Architecture Function Operating System Core Processor Platform Utilized IC / Part Contents Supplied Contents Board Type Module/Board Type Media Delivery Type License - User Details License Length Edition
    QB-V850ESSX2-ZZZ QB-V850ESSX2-ZZZ Renesas Electronics America 0.0000
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    Min: 1

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    		 0.00000000 4 Weeks Active Not Applicable ROHS3 Compliant License
    Y-JLINK-PLUS Y-JLINK-PLUS Renesas Electronics America 0.0000
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