Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Voltage - Rated DC | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Voltage | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Reverse Pinout | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "QMP9GL01GP12FFI010") |
QMP9GL01GP12FFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | GL-P | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 24-FBGA (6x8) | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NAND256W3A2BZAXE | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | 2004 | Obsolete | 3 (168 Hours) | 55 | 3V | 10mm | ROHS3 Compliant | No | 55 | 55-TFBGA | 256 Mb | Surface Mount | -40°C~85°C TA | 3.3V | FLASH - NAND | 1.05mm | 1 | BOTTOM | 3V | NAND256 | YES | 0.8mm | 3.3V | 256Mb 32M x 8 | Non-Volatile | 25b | 0.02mA | 2.7V~3.6V | 32MX8 | 8 | 0.00005A | 45 ns | NO | NO | YES | 2K | 528B | YES | FLASH | Parallel | 50ns | 16K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28F640J3BS-115 GMET | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2005 | Obsolete | 2 (1 Year) | ROHS3 Compliant | 64-FBGA | Surface Mount | -40°C~85°C TA | MT28F640J3 | 115ns | 64Mb 8M x 8 4M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256SA20PZGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT71256 | 28-TSOP | 20ns | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
SM661PX4-AC | Silicon Motion, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT45DB011D-MH-SL954 | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Bulk | 1997 | Obsolete | 1 (Unlimited) | 8 | RoHS Compliant | Gold | 8 | 8-UDFN Exposed Pad | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TC | CMOS | DUAL | 1.27mm | Not Qualified | 3/3.3V | 6 ns | 1Mb 256Bytes x 512 pages | Non-Volatile | 0.025mA | 2.7V~3.6V | 8b | 66MHz | 0.000025A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | 256B | SPI | FLASH | SPI | 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G32FVJ-3AGTE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Surface Mount | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | Tin | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 2-Wire, I2C, Serial | 32 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.1mm | 1 | e3 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G32 | 0.65mm | 1.6V | 5.5V | 450 ns | 32Kb 4K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25L010F-WE2 | ROHM Semiconductor | 0.1115 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Surface Mount | Tape & Reel (TR) | 2010 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 5mm | ROHS3 Compliant | Lead Free | Copper, Tin | No | 8 | 8-SOIC (0.173, 4.40mm Width) | SPI, Serial | 1 kb | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | 1 | 3mA | e2 | DUAL | 260 | 2.5V | 10 | BR25L010 | 8 | 1.27mm | 70 ns | 1Kb 128 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 5MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BU9844GUL-WE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 6 | EAR99 | 1.84mm | ROHS3 Compliant | 6 | 6-UFBGA, CSPBGA | 2-Wire, I2C, Serial | 16 kb | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.55mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 2.5V | NOT SPECIFIED | BU9844 | 6 | 0.5mm | 1.7V | Not Qualified | 1.8/5V | 5.5V | 16Kb 2K x 8 | Non-Volatile | 0.002mA | 1.7V~5.5V | 2KX8 | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010D0MR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA32AT-I/MC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Cut Tape (CT) | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-VFDFN Exposed Pad | 2-Wire, I2C, Serial | 32 kb | 950μm | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 40 | 24AA32A | 8 | 0.5mm | 1.7V | 900ns | 32Kb 4K x 8 | Non-Volatile | 1.8V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC32A-E/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2010 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | I2C, Serial | 32 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24LC32A | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 900ns | 32Kb 4K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24FC04T-I/OT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | 5 | 2.9mm | ROHS3 Compliant | SC-74A, SOT-753 | 1.55mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.45mm | 1 | DUAL | YES | 0.95mm | R-PDSO-G5 | 1.7V | 5.5V | 450ns | 4Kb 256 x 8 x 2 | Non-Volatile | 0.003mA | 1.7V~5.5V | 512X8 | 8 | 4096 bit | SERIAL | 1MHz | 0.000003A | 200 | HARDWARE | 5ms | I2C | NO | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS49NLS93200-25BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 144 | EAR99 | 1 | 18.5mm | Non-RoHS Compliant | 144 | AUTO REFRESH | 144-TFBGA | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 400MHz | BOTTOM | 1.8V | 144 | YES | 1mm | 1.7V | Not Qualified | 1.5/1.81.82.5V | 1.9V | 3-STATE | 20ns | 288Mb 32M x 9 | Volatile | 0.97mA | 1.7V~1.9V | 32MX9 | 9 | 301989888 bit | 9b | 0.048A | SEPARATE | DRAM | Parallel | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT41K256M16TW-093:P | Micron Technology Inc. | 5.4973 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2017 | yes | Active | 3 (168 Hours) | 96 | EAR99 | 1.35V | 1 | 14mm | ROHS3 Compliant | Copper, Silver, Tin | 96 | AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY | 96-TFBGA | 4 Gb | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 8542.32.00.36 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.35V | 30 | 0.8mm | 1.283V | 1.45V | 20ns | 4Gb 256M x 16 | Volatile | 15b | 1.283V~1.45V | 256MX16 | 16 | 16b | 1067MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M95020-WMN6TP | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 2 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 5mA | e4 | DUAL | 260 | 5V | 30 | M95020 | 8 | 1.27mm | 35 ns | 2Kb 256 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 20MHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL01GT11FHV020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | GL-T | Active | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | 64-LBGA | 11mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 30 | YES | 1mm | R-PBGA-B64 | 2.7V | 3.6V | 110ns | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 64MX16 | 16 | 1073741824 bit | 2.7V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M58WR032KB70ZQ6Z | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 88 | 88-VFBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | M58WR032 | 88-VFBGA (8x10) | 70ns | 32Mb 2M x 16 | Non-Volatile | 1.7V~2V | 66MHz | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C66B-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2004 | yes | Active | Not Applicable | 8 | EAR99 | 5V | 10.16mm | ROHS3 Compliant | Lead Free | No | 8 | 8-DIP (0.300, 7.62mm) | Serial | 4 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | Matte Tin (Sn) | DUAL | 2.5V | 93C66B | 8 | 2.54mm | 5V | 250 ns | 4Kb 256 x 16 | Non-Volatile | 4.5V~5.5V | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AT24C01-10PC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | 0°C~70°C TA | EEPROM | AT24C01 | 8-PDIP | 900ns | 1Kb 128 x 8 | Non-Volatile | 4.5V~5.5V | 400kHz | EEPROM | I2C | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25AA640A-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2012 | Active | 1 (Unlimited) | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 64 kb | Surface Mount | -40°C~125°C TA | e3 | Matte Tin (Sn) - annealed | 260 | 40 | 25AA640A | 100 ns | 64Kb 8K x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61NLP12836B-200B2LI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | yes | Active | 2 (1 Year) | 119 | 3A991.B.2.A | 3.3V | 4 | 22mm | ROHS3 Compliant | No | 119 | PIPELINED ARCHITECTURE | 119-BBGA | 4 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1 | 210mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 40 | 119 | YES | 1.27mm | 3.135V | 3-STATE | 3.1ns | 4.5Mb 128K x 36 | Volatile | 17b | 3.135V~3.465V | 128KX36 | 36 | Synchronous | 200MHz | 0.035A | 36b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS6C62256A-70SINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2009 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 28 | 28-SOIC (0.330, 8.38mm Width) | unknown | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | NOT SPECIFIED | NOT SPECIFIED | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
6116LA90TDB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | 2013 | no | Active | 1 (Unlimited) | 24 | 125°C | -55°C | 5V | 1 | 32.51mm | Non-RoHS Compliant | Contains Lead | 24 | CDIP | Parallel | 5.5V | not_compliant | 4.5V | 16 kb | 7.62mm | 3.56mm | CMOS | 85mA | 5.08mm | 1 | 85mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | NOT SPECIFIED | 24 | MILITARY | 2.54mm | SRAMs | Not Qualified | 5V | 3-STATE | 90 ns | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.0003A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
EM63A165TS-5IG | Etron Technology, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 54 | EAR99 | 1 | 22.22mm | RoHS Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | compliant | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G54 | 3V | 3.6V | 4.5ns | 256Mb 16M x 16 | Volatile | 3V~3.6V | 16MX16 | 16 | 268435456 bit | 200MHz | DRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71256S70TDB | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tube | Active | 1 (Unlimited) | Non-RoHS Compliant | 28-CDIP (0.300, 7.62mm) | Through Hole | -55°C~125°C TA | SRAM - Asynchronous | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F8G08AAAWP:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TA | FLASH - NAND | MT29F8G08 | 48-TSOP I | 8Gb 1G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62147EV30LL-45B2XA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2001 | MoBL® | Obsolete | 3 (168 Hours) | 48 | 3V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 48 | 48-VFBGA | 4 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 20mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3V | 40 | CY62147 | 48 | 0.75mm | 2.2V | 3.6V | 3-STATE | 4Mb 256K x 16 | Volatile | 18b | 2.2V~3.6V | 16 | Asynchronous | 0.000007A | 45 ns | 16b | COMMON | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39VF400A-70-4C-EKE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tray | 2000 | SST39 MPF™ | yes | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 18.5mm | ROHS3 Compliant | Lead Free | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | No SVHC | 4 Mb | 14MHz | 1.05mm | 12.2mm | Surface Mount | 0°C~70°C TA | CMOS | 8542.32.00.51 | 1 | 30mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | SST39VF400A | 48 | YES | 0.5mm | 2.7V | 3.6V | 70ns | 4Mb 256K x 16 | Non-Volatile | 18b | 2.7V~3.6V | 256KX16 | Asynchronous | 16b | 0.00002A | 16b | 2.7V | YES | YES | YES | 128 | YES | FLASH | Parallel | 20μs | 2K | ||||||||||||||||||||||||||||||||||||||||||||||||
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M24512-RMN6TP | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | Surface Mount | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 512 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SO8N-SO-A | 1 | 5mA | e4 | DUAL | 260 | 2.5V | 30 | M24512 | 8 | 1.27mm | 85°C | 500ns | 512Kb 64K x 8 | Non-Volatile | 1.8V~5.5V | SERIAL | 1MHz | 0.000001A | 200 | 4000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT25M02-SSHM-B | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 19 Weeks | Tube | 2005 | yes | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TC | CMOS | SYNCHRONOUS | 1.75mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 1.8V | 40 | YES | 1.27mm | 1.7V | 5.5V | 2Mb 256K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 2097152 bit | 5MHz | 5ms | SPI | EEPROM | SPI | 10ms |
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