Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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R1RW0416DSB-2LR#B0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T3339S133BC8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2010 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 19b | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "70V27S15PFI8") |
70V27S15PFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 512Kb 32K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT35XL512ABA2G12-0AUT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Xccela™ - MT35X | Active | 24-TBGA | Surface Mount | -40°C~125°C | FLASH - NOR | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | Xccela Bus | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29C2G24MAAAAKAKD-5 IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 137-TFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND, Mobile LPDRAM | MT29C2G24M | 2Gb 256M x 8 N 1Gb 32M x 32 LPDRAM | Non-Volatile | 1.7V~1.95V | 200MHz | FLASH, RAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9199L7PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 1.1 Mb | 45.45MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 18 ns | RAM, SRAM | 17b | Synchronous | 9b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416VS12PH | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | yes | 3 (168 Hours) | 44 | 3A991.B.2.A | 70°C | 0°C | 18.41mm | Non-RoHS Compliant | TSOP | Parallel | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e3 | MATTE TIN | DUAL | GULL WING | 260 | 3.3V | 30 | 44 | COMMERCIAL | YES | 0.8mm | R-PDSO-G44 | 3V | Not Qualified | 3.6V | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 12 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H64M8CB-3:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2006 | Obsolete | 5 (48 Hours) | 60 | EAR99 | 1.8V | 1 | 12mm | ROHS3 Compliant | Lead Free | 60 | AUTO/SELF REFRESH | 60-FBGA | unknown | 512 Mb | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 180mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT47H64M8 | 60 | 0.8mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 450ps | 512Mb 64M x 8 | Volatile | 16b | 1.7V~1.9V | 64MX8 | 8 | 333MHz | 0.007A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39SF020A-45-4I-WHE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2000 | SST39 MPF™ | Obsolete | 2 (1 Year) | 32 | EAR99 | 5V | 12.4mm | ROHS3 Compliant | Lead Free | No | 32 | 32-TFSOP (0.488, 12.40mm Width) | 2 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 25mA | e3 | MATTE TIN | DUAL | 260 | 5V | 40 | SST39SF020A | 32 | 0.5mm | 45ns | 2Mb 256K x 8 | Non-Volatile | 18b | 4.5V~5.5V | 256KX8 | 8 | Asynchronous | 8b | 8b | 5V | FLASH | Parallel | 20μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S-25A040A0A-J8T2UD | ABLIC U.S.A. Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | EAR99 | 5.02mm | RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 5.5V | 4Kb 512 x 8 | Non-Volatile | 2.5V~5.5V | 512X8 | 8 | 4096 bit | SERIAL | 6.5MHz | 4ms | SPI | EEPROM | SPI | 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M93C46-WMN6P | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tube | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | No SVHC | 1 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SO8N-SO-A | 1 | 2mA | e4 | DUAL | 260 | 5V | 30 | M93C46 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 85°C | 200 ns | 1Kb 128 x 8 64 x 16 | Non-Volatile | 2.5V~5.5V | 64X16 | SERIAL | 2MHz | 0.00001A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H4M16LFB4-10 IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2004 | Obsolete | 2 (1 Year) | ROHS3 Compliant | 54-VFBGA | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPSDR | MT48H4M16 | 7ns | 64Mb 4M x 16 | Volatile | 1.7V~1.9V | 104MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
520366231296 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H8M32LFB5-75 IT:H | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2009 | yes | Obsolete | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-VFBGA | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPSDR | SYNCHRONOUS | 1mm | 8542.32.00.24 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT48H8M32 | 90 | YES | 0.8mm | R-PBGA-B90 | 1.7V | Not Qualified | 1.8V | 1.95V | 5.4ns | 256Mb 8M x 32 | Volatile | 0.085mA | 1.7V~1.95V | 8MX32 | 32 | 268435456 bit | 133MHz | 0.00001A | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93G46F-3GTE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | IT ALSO OPERATES AT 1MHZ AT 1.7 MIN | 8-SOIC (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 4.5V | 5.5V | 1Kb 64 x 16 | Non-Volatile | 1.7V~5.5V | 64X16 | 16 | 1024 bit | SERIAL | 3MHz | 8 | 5ms | 3-WIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S-24C02DI-M5T1U5 | ABLIC U.S.A. Inc. | 0.2620 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | 5 | 2.9mm | RoHS Compliant | IT ALSO OPERATES AT 0.4 MHZ AT 1.7 TO 5.5 V SUPPLY VOLTAGE | SC-74A, SOT-753 | 1.6mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.3mm | 1 | e3 | TIN | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 0.95mm | R-PDSO-G5 | 2.5V | 5.5V | 500ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 256X8 | 8 | 2048 bit | SERIAL | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761YSA200BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | not_compliant | 200MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.36mA | 128KX36 | 36 | 4718592 bit | 0.03A | 3.1 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M29W400DT55ZE6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2009 | yes | Obsolete | 3 (168 Hours) | 48 | EAR99 | 8mm | ROHS3 Compliant | No | 48 | TOP BOOT BLOCK | 48-TFBGA | 4 Mb | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 10mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3.3V | 30 | M29W400 | 48 | YES | 0.8mm | 3/3.3V | 2.7V | 4Mb 512K x 8 256K x 16 | Non-Volatile | 2.7V~3.6V | 256KX16 | 16 | Asynchronous | 0.0001A | 55 ns | 8 | YES | YES | YES | 1217 | YES | FLASH | Parallel | 55ns | 16K8K32K64K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT49H32M9BM-25:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2015 | Obsolete | 3 (168 Hours) | 144 | 1.8V | 1 | 18.5mm | ROHS3 Compliant | Lead Free | No | 144 | AUTO REFRESH | 144-TFBGA | 288 Mb | Surface Mount | 0°C~95°C TC | CMOS | 1.2mm | 1 | 400MHz | BOTTOM | 1.8V | MT49H32M9 | YES | 1mm | 1.7V | 1.5/1.81.82.5V | 1.9V | 3-STATE | 20ns | 288Mb 32M x 9 | Volatile | 24b | 1.7V~1.9V | 32MX9 | 9 | 9b | COMMON | DRAM | Parallel | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24C00T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 128 b | 3mm | Surface Mount | -40°C~125°C TA | CMOS | 1.1mm | 1 | 2mA | e3 | DUAL | 260 | 5V | 40 | 24C00 | 8 | 0.65mm | 3500ns | 128b 16 x 8 | Non-Volatile | 4.5V~5.5V | 8 | 100kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | 4ms | I2C | 1010XXXR | EEPROM | I2C | 4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709289L9PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 1 Mb | 40MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX16 | Synchronous | 0.003A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V34L20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 175mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 20 ns | 9kB | RAM, SDR, SRAM | 24b | 4KX18 | Asynchronous | 18b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7133SA20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.015A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT70825S25PF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 80-LQFP | Surface Mount | 0°C~70°C TA | SARAM | IDT70825 | 80-TQFP (14x14) | 25ns | 128Kb 8K x 16 | Volatile | 4.5V~5.5V | RAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28LV010-25SI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TC | EEPROM | AT28LV010 | 32-SOIC | 250ns | 1Mb 128K x 8 | Non-Volatile | 3V~3.6V | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V65803S133BQI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V65803 | 165-CABGA (13x15) | 4.2ns | 9Mb 512K x 18 | Volatile | 3.135V~3.465V | 133MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25HP512-10PC-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | 0°C~70°C TA | EEPROM | AT25HP512 | 8-PDIP | 512Kb 64K x 8 | Non-Volatile | 2.7V~5.5V | 10MHz | EEPROM | SPI | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7130LA20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 8 kb | 14mm | 1.4mm | 200mA | 20 ns | 1kB | RAM, SDR, SRAM | 10b | Asynchronous | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3557S75BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | CMOS | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 100MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24T512FJ-3AME2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 1.7V | 5.5V | 512Kb 64K x 8 | Non-Volatile | 1.7V~5.5V | 64KX8 | 8 | 524288 bit | SERIAL | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms |
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BR24T512FJ-3AME2 ROHM Semiconductor
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