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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts ELV Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case Lead Pitch Height Width Mounting Type Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Terminal Material Contact Configuration
231-28 231-28 CNC Tech 0.0000
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0.00000000 14 Weeks Polybutylene Terephthalate (PBT), Glass Filled Tube 2012 Obsolete 1 (Unlimited) Solder Gold RoHS Compliant 28 Through Hole -55°C~105°C 30mOhm PLCC Closed Frame 1A UL94 V-0 0.050 1.27mm 28 (4 x 7) Phosphor Bronze Phosphor Bronze 0.124 3.15mm 0.100 2.54mm
614-13-324-18-000012 614-13-324-18-000012 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 324 ROHS3 Compliant NOT SPECIFIED 1A LOW PROFILE 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.8 inch 1.8 inch STRAIGHT RECTANGULAR 0.016 inch RND PIN-SKT 0.1 inch 1000VAC V Gold (Au) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA324 18X18
14-C280-11 14-C280-11 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 EJECT-A-DIP™ yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C 1000000000Ohm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e4 0.95 inch 0.4 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch 1000VAC V Closed Frame 0.3 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
40-6572-10 40-6572-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 40 EAR99 Tin 40 ROHS3 Compliant UL94 V-0 1A STANDARD: UL 94V-0 Through Hole 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm e3 2.54mm 105°C 2.59 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 40 (2 x 20) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
518-77-456M26-001105 518-77-456M26-001105 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole FR4 Epoxy Glass Bulk 2012 518 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 456 Through Hole -55°C~125°C 10mOhm PGA 2.794mm Open Frame UL94 V-0 0.050 1.27mm Flash 456 (26 x 26) Beryllium Copper Brass 0.110 2.78mm 0.050 1.27mm
14-8390-310C 14-8390-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 14 EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
18-0511-10 18-0511-10 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 511 Active 1 (Unlimited) Solder 18 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1A SIP 2.54mm Through Hole -55°C~105°C SIP 3.81mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Tin 50.0μin 1.27μm 50.0μin 1.27μm 18 (1 x 18) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
32-8724-310C 32-8724-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 8 Active 1 (Unlimited) Solder 32 105°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 3A Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm Closed Frame, Elevated 3A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 10.0μin 0.25μm 32 (2 x 16) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
511-93-209-17-081001 511-93-209-17-081001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 209 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA209
714-93-120-31-018000 714-93-120-31-018000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Bulk 2009 714 no Active 1 (Unlimited) Solder EAR99 Gold 20 50.8mm Non-RoHS Compliant Contains Lead Copper 20 4.32mm 2.54mm Through Hole -55°C~125°C 8536.90.40.00 SIP e0 Carrier 3A 0.100 2.54mm Tin-Lead 30.0μin 0.76μm 200.0μin 5.08μm 20 (1 x 20) Beryllium Copper Brass Alloy 0.170 4.32mm 0.100 2.54mm
116-83-424-41-012101 116-83-424-41-012101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant UL94 V-0 1A 24 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.4 (10.16mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 24 (2 x 12) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
127-43-316-41-002000 127-43-316-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE yes Active EAR99 125°C -55°C Straight 9.9mm 16 14.53mm ROHS3 Compliant Copper Gold 3A 150V 100V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 Matte Tin (Sn) - with Nickel (Ni) barrier 1.78mm 7.62 mm IC SOCKET DIP16
511-93-169-17-101003 511-93-169-17-101003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 169 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA169
116-87-312-41-018101 116-87-312-41-018101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 12 ROHS3 Compliant UL94 V-0 1A 12 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin Flash 12 (2 x 6) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
21-7530-10 21-7530-10 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2013 700 Elevator Strip-Line™ Active 1 (Unlimited) Solder 21 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1.5A SIP 2.54mm Through Hole -55°C~105°C SIP 3.81mm 2 Elevated 2.54mm 1.5A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 21 (1 x 21) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
146-83-650-41-036101 146-83-650-41-036101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 146 Active 1 (Unlimited) Press-Fit Gold ROHS3 Compliant UL94 V-0 1A 50 Through Hole -55°C~125°C 10mOhm DIP, 0.6 (15.24mm) Row Spacing 2.794mm Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 50 (2 x 25) Beryllium Copper Brass 0.110 2.78mm 0.100 2.54mm
511-93-081-12-071001 511-93-081-12-071001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 81 Non-RoHS Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.1 inch 1.1 inch STRAIGHT RECTANGULAR 0.173 inch RND PIN-SKT 0.1 inch 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA81 12X12
9-1437504-3 9-1437504-3 TE Connectivity AMP Connectors 0.0000
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0.00000000 download 11 Weeks Chassis Mount, Through Hole Polytetrafluoroethylene (PTFE) Bulk 2011 8080 Obsolete 1 (Unlimited) 3 Solder EAR99 Tin Straight 3 Compliant RoHS Compliant No STANDARD: UL 94V-0 TO-3 Chassis Mount -55°C~125°C Transistor, TO-3 Closed Frame 200.0μin 5.08μm 200.0μin 5.08μm 3 (Oval) Beryllium Copper Beryllium Copper Copper
42-6556-40 42-6556-40 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2006 6556 yes Active 1 (Unlimited) Solder Cup 42 EAR99 Gold 42 ROHS3 Compliant UL94 V-0 Gold, Tin 3A STANDARD: UL 94V-0 Through Hole DIP, 0.6 (15.24mm) Row Spacing 4.572mm e3 Open Frame UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 42 (2 x 21) Beryllium Copper Brass 0.180 4.57mm 0.100 2.54mm
36-1508-21 36-1508-21 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 36 ROHS3 Compliant UL94 V-0 3A 36 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C DIP, 0.2 (5.08mm) Row Spacing 9.144mm e4 1.8 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch Closed Frame 0.1 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 36 (2 x 18) Beryllium Copper Brass 0.360 9.14mm 0.100 2.54mm
30-6823-90 30-6823-90 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Horizontal, Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 Vertisockets™ 800 Active 1 (Unlimited) Solder 30 EAR99 Gold 30 ROHS3 Compliant UL94 V-0 1.5A STANDARD: UL 94V-0 Through Hole, Right Angle, Horizontal DIP, 0.6 (15.24mm) Row Spacing 3.683mm e4 2.54mm 1.55 inch 0.7 inch RECTANGULAR 0.68 inch SQ PIN-SKT 0.1 inch Closed Frame 0.3 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 30 (2 x 15) Phosphor Bronze Phosphor Bronze 0.145 3.68mm 0.100 2.54mm
32-9503-31 32-9503-31 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 503 Active 1 (Unlimited) Wire Wrap 32 EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C DIP, 0.9 (22.86mm) Row Spacing 12.7mm 2 Closed Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 32 (2 x 16) Beryllium Copper Phosphor Bronze 0.500 12.70mm 0.100 2.54mm
614-87-325-18-111144 614-87-325-18-111144 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 614 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 325 Through Hole -55°C~125°C 10mOhm PGA 3.4544mm Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin Flash 325 (18 x 18) Beryllium Copper Brass 0.136 3.45mm 0.100 2.54mm
515-93-124-13-041001 515-93-124-13-041001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 124 Non-RoHS Compliant NOT SPECIFIED LOW PROFILE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET PGA124
14-8375-310C 14-8375-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 14 EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
614-43-422-31-002000 614-43-422-31-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole PLASTIC yes Active EAR99 GOLD (30) OVER NICKEL (100) 22 ROHS3 Compliant NOT SPECIFIED 22 8536.90.40.00 e3 Tin (Sn) IC SOCKET
123-43-210-41-001000 123-43-210-41-001000 0.0000
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0.00000000
110-87-632-41-001151 110-87-632-41-001151 Preci-Dip 0.0000
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0.00000000 10 Weeks Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tube 2012 110 Active 1 (Unlimited) Solder EAR99 Female Gold Straight 17.17mm 32 40.2mm ROHS3 Compliant Copper 1A Through Hole -55°C~125°C 150V 100V 8536.69.40.40 10mOhm 10GOhm DIP, 0.6 (15.24mm) Row Spacing Polyester 2 Open Frame, No Center Bar UL94 V-0 15.24 mm 0.100 2.54mm Tin Flash 32 (2 x 16) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
550-10-500M30-001166 550-10-500M30-001166 Preci-Dip 0.0000
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0.00000000 download 10 Weeks FR4 Epoxy Glass Bulk 2012 550 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Through Hole -55°C~125°C 10mOhm BGA Closed Frame 1A UL94 V-0 0.050 1.27mm 10.0μin 0.25μm 10.0μin 0.25μm 500 (30 x 30) Beryllium Copper Brass 0.098 2.50mm 0.050 1.27mm
20-3518-102 20-3518-102 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder 20 EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 1 inch 0.4 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch Open Frame 0.3 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 20 (2 x 10) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
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