Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Number of Circuits | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Reverse Pinout | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
23LC1024-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tube | 2004 | Active | 1 (Unlimited) | 8 | EAR99 | 2 | 10.16mm | ROHS3 Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | SPI | No SVHC | 1 Mb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | 23LC1024 | NO | 3/5V | 5.5V | 3-STATE | 25 ns | 1Mb 128K x 8 | Volatile | 24b | 2.5V~5.5V | Synchronous | SERIAL | 20MHz | 8b | NO | COMMON/SEPARATE | NO | SRAM | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1413AV18-250BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | no | Obsolete | 3 (168 Hours) | 165 | 17mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | 165-LBGA | unknown | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | e0 | TIN LEAD | BOTTOM | 220 | 1.8V | NOT SPECIFIED | 165 | YES | 1mm | R-PBGA-B165 | 1.7V | COMMERCIAL | 1.9V | 36Mb 2M x 18 | Volatile | 1.7V~1.9V | 2MX18 | 18 | 37748736 bit | 250MHz | 0.45 ns | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3579S4BF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 208-LFBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V3579 | 4.2ns | 1.125Mb 32K x 36 | Volatile | 3.15V~3.45V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "CG7802AA") |
CG7802AA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7164L70TDB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | no | Active | 1 (Unlimited) | 28 | 125°C | -55°C | 5V | 1 | 37.72mm | RoHS Compliant | Contains Lead | No | 28 | CDIP | Parallel | 5.5V | 4.5V | 64 kb | 7.62mm | 3.56mm | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 240 | 5V | 28 | MILITARY | NO | 2.54mm | SRAMs | 5V | 3-STATE | 70 ns | MIL-STD-883 Class B | 8kB | RAM, SDR, SRAM - Asynchronous | 13b | 8KX8 | 0.0002A | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
JS28F00AP30EFA | Micron Technology Inc. | 2.7356 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2015 | Axcell™ | Obsolete | 3 (168 Hours) | 56 | 1.8V | 18.4mm | ROHS3 Compliant | No | 56 | SYMMETRICAL BLOCKS | 56-TFSOP (0.724, 18.40mm Width) | Parallel, Serial | 1 Gb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 1 | 31mA | e3 | Matte Tin (Sn) | DUAL | 260 | 1.8V | 30 | 28F00AP30 | YES | 0.5mm | 1.81.8/3.3V | 1.7V | 1Gb 64M x 16 | Non-Volatile | 26b | 1.7V~2V | 64MX16 | 16 | Asynchronous | 40MHz | 0.00024A | 110 ns | 16b | NO | NO | 1K | 16words | FLASH | Parallel | 110ns | 64K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416L12YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 44 | 70°C | 0°C | 3.3V | 1 | 28.6mm | RoHS Compliant | Lead Free | No | 44 | Parallel | 3.6V | 3V | 4 Mb | 10.2mm | 2.9mm | CMOS | 1 | 170mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 44 | COMMERCIAL | SRAMs | 3-STATE | 12 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | Asynchronous | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25020-10TU-2.7 | ROHM Semiconductor | 2.7564 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | Not For New Designs | 1 (Unlimited) | 8 | 5V | ROHS3 Compliant | Copper, Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 2 kb | Surface Mount | -40°C~85°C TA | CMOS | DUAL | BR25020 | 0.635mm | Not Qualified | 800 ns | 2Kb 256 x 8 | Non-Volatile | 0.006mA | 2.7V~5.5V | 8 | 3MHz | 0.000005A | 100 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1399BNL-15ZXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 28 | 11.8mm | ROHS3 Compliant | 28-TSSOP (0.465, 11.80mm Width) | unknown | 8mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 1.2mm | 1 | NOT SPECIFIED | DUAL | 260 | 3.3V | 20 | 28 | YES | 0.55mm | R-PDSO-G28 | 3V | COMMERCIAL | 3.6V | 256Kb 32K x 8 | Volatile | 3V~3.6V | 32KX8 | 8 | 262144 bit | 15 ns | SRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S34MS04G200BHI900 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | FLASH | 1.8V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7008S20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 1 (Unlimited) | 84 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 512 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 325mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61LV12824-8TQ | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | no | Not For New Designs | 2 (1 Year) | 100 | 3.3V | 1 | 20mm | Non-RoHS Compliant | No | 100 | 100-LQFP | 3 Mb | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 1 | e0 | Tin/Lead (Sn/Pb) | QUAD | 3.3V | 100 | YES | 0.65mm | 3.63V | 3-STATE | 3Mb 128K x 24 | Volatile | 17b | 3.135V~3.6V | 24 | 8 ns | COMMON | SRAM | Parallel | 8ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS29GL128-70SLET | ISSI, Integrated Silicon Solution Inc | 5.7237 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Tray | Active | 3 (168 Hours) | 56 | 18.4mm | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | 14mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.5mm | R-PDSO-G56 | 2.7V | 3.6V | 70ns | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 128MX1 | 1 | 134217728 bit | 3V | FLASH | Parallel | 200μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X40CLSSIG | Winbond Electronics | 0.6947 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | EAR99 | 5.28mm | ROHS3 Compliant | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.28mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 2.16mm | 8542.32.00.51 | 1 | DUAL | 3V | 8 | YES | 1.27mm | S-PDSO-G8 | 2.7V | 3.6V | 4Mb 512K x 8 | Non-Volatile | 2.3V~3.6V | 4MX1 | 1 | 4194304 bit | 104MHz | 2.7V | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
EDFM432A1PH-GD-F-R TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | Surface Mount | -30°C~85°C TA | SDRAM - Mobile LPDDR3 | 168-FBGA (12x12) | 12Gb 384M x 32 | Volatile | 1.14V~1.95V | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT42L128M64D2LL-25 IT:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 216-WFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | MT42L128M64 | 8Gb 128M x 64 | Volatile | 1.14V~1.3V | 400MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C040-70PU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 1997 | yes | Active | 1 (Unlimited) | 32 | 5V | 42.29mm | ROHS3 Compliant | Lead Free | Tin | No | 32 | 32-DIP (0.600, 15.24mm) | No SVHC | 4 Mb | 70GHz | 4.83mm | 13.97mm | Through Hole | 2.214806g | -40°C~85°C TC | EPROM - OTP | 100μA | 1 | 30mA | e3 | DUAL | 5V | AT27C040 | 2.54mm | OTP ROMs | 5V | 3-STATE | 70ns | 4Mb 512K x 8 | Non-Volatile | 4.5V~5.5V | 512KX8 | 0.0001A | COMMON | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V5388S133BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2008 | no | Discontinued | 3 (168 Hours) | 256 | 3A991.B.2.A | 70°C | 0°C | 3.3V | 4 | 17mm | RoHS Compliant | Contains Lead | No | 256 | PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 1.4mm | 17mm | 1.4mm | CMOS | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 3.4 ns | RAM, SRAM | 16b | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M24C04-RDS6G | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 4 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 2.5V | 10 | M24C04 | 8 | YES | 0.65mm | 2/5V | 5.5V | 900ns | 4Kb 512 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 400kHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 10ms | I2C | 1010DDMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS25LQ080-JKLE | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Discontinued | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8 | 8-WDFN Exposed Pad | SPI, Serial | 8 Mb | Surface Mount | 10.886217mg | -40°C~105°C TA | FLASH - NOR | 15mA | 1 | 12mA | DUAL | YES | 1.27mm | 2.3V | Not Qualified | 2.5/3.3V | 3.6V | 8 ns | 8Mb 1M x 8 | Non-Volatile | 20b | 2.3V~3.6V | 1 | Synchronous | 8b | 104MHz | 0.00003A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | 256B | SPI | FLASH | SPI - Quad I/O | 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C76AT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 93C76A | 8 | 0.65mm | 8Kb 1K x 8 | Non-Volatile | 4.5V~5.5V | 512X16 | 16 | 3MHz | 8 | 2ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS7C513B-15JCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 1993 | yes | Active | 3 (168 Hours) | 44 | 28.575mm | ROHS3 Compliant | 44 | 44-BSOJ (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.7592mm | 1 | e3/e6 | PURE MATTE TIN/TIN BISMUTH | DUAL | 245 | 5V | 40 | 44 | YES | 1.27mm | 4.5V | 5.5V | 512Kb 32K x 16 | Volatile | 4.5V~5.5V | 32KX16 | 16 | 524288 bit | 15 ns | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC16M16A2FG-75:D TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 54-VFBGA | Surface Mount | 0°C~70°C TA | SDRAM | MT48LC16M16A2 | 5.4ns | 256Mb 16M x 16 | Volatile | 3V~3.6V | 133MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY7C1460AV25-167BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | NoBL™ | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 165-FBGA (15x17) | 3.4ns | 36Mb 1M x 36 | Volatile | 2.375V~2.625V | 167MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M25PX32-VMP6F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2013 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-VDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | M25PX32 | 8-VDFPN (6x5) (MLP8) | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 15ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71342LA25PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2009 | 64 | EAR99 | 85°C | -40°C | 5V | 2 | RoHS Compliant | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 32 kb | CMOS | 1 | QUAD | GULL WING | 5V | INDUSTRIAL | YES | 0.8mm | SRAMs | 5V | 2 | 3-STATE | 25 ns | 4kB | RAM, SRAM | 24b | 4KX8 | 8 | 8b | 0.0015A | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY15B064J-SXAT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100, F-RAM™ | Active | 3 (168 Hours) | 8 | EAR99 | 4.889mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.8985mm | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | SYNCHRONOUS | 1.727mm | 8542.32.00.71 | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.7V | 3.65V | 64Kb 8K x 8 | Non-Volatile | 3V~3.6V | 8KX8 | 8 | 65536 bit | 1MHz | FRAM | I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70V3389S6BF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 3 (168 Hours) | Non-RoHS Compliant | 208-LFBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V3389 | 208-CABGA (15x15) | 6ns | 1.125Mb 64K x 18 | Volatile | 3.15V~3.45V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M58LW032D90ZA6 | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | 64 | 64-TBGA | unknown | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e0 | TIN LEAD | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | M58LW | 64 | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 90ns | 32Mb 4M x 8 2M x 16 | Non-Volatile | 0.03mA | 2.7V~3.6V | 2MX16 | 16 | 33554432 bit | 16b | 0.00004A | 8 | 3V | NO | NO | YES | 32 | 4/8words | YES | YES | FLASH | Parallel | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S166BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 2.5V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 265mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.5 ns | RAM, SRAM | 20b | Synchronous | 0.045A | 18b | COMMON | 2.38V |
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71T75802S166BGI Integrated Device Technology (IDT)
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