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  • STM32F103C8T6
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IC Adapters

Additional Feature

  • ADAPTER
  • SOCKET ADAPTER
  • SOCKET ADAPTER, 94V-0
  • SOCKET ADAPTER, UL 94V-0
  • STANDARD: UL 94V-0
  • UL 94V-0

Board Material

  • FR4 Epoxy Glass
  • Polyimide (PI)

Body Breadth

  • 0.7 inch

Body Depth

  • 0.3 inch

Body Material

  • Glass, Polysulfone

Cable Length

  • 3m

Connector Type

  • DIP, Socket

Contact Finish - Mating

  • GOLD
  • GOLD (10)
  • GOLD (10) OVER NICKEL (100)
  • NOT SPECIFIED
  • Silver
  • TIN
  • TIN LEAD
  • Tin-Lead

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Contact Finish Thickness - Post

  • Flash

Contact Material

  • Brass
  • Copper

Contact Material - Mating

  • Beryllium Copper
  • Brass
  • Copper
  • Phosphor Bronze

Contact Material - Post

  • Beryllium Copper
  • Brass
  • Brass Alloy
  • Phosphor Bronze

Contact Plating

  • Gold
  • Gold, Tin
  • Lead, Tin
  • Silver
  • Tin

Contact Style

  • RND PIN-SKT

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PLCC
  • PQFP
  • QFP
  • SIP
  • Socket, 0.6 (15.24mm) Row Spacing
  • SOIC
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

  • DIP
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Core Architecture

  • AVR

Current Rating

  • 1A
  • 3A

Current Rating (Amps)

  • 1A
  • 3A

Depth

  • 25.4mm
  • 32.3mm
  • 32mm
  • 43.2mm
  • 6.9mm

Device Socket Type

  • IC SOCKET

ECCN Code

  • EAR99

Factory Lead Time

  • 16 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks

Feature

  • Closed Frame
  • High Temperature
  • Socket Included

Flammability Rating

  • UL94 V-0

Gender

  • Female

Height

  • 1.58mm
  • 2.29mm
  • 2.39mm
  • 5.85mm
  • 6.08mm
  • 6.9mm

Housing Material

  • Polyamide
  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled
  • RYTON

Insulation Resistance

  • 1GOhm

JESD-609 Code

  • e0
  • e3
  • e4

Lead Free

  • Contains Lead
  • Lead Free

Lead Length

  • 2.032mm
  • 2.286mm
  • 3.175mm
  • 3.302mm
  • 3.683mm
  • 3.81mm
  • 3m
  • 5.9944mm

Lead Pitch

  • 1.27mm
  • 2.54mm

Length

  • 10.2mm
  • 100.3mm
  • 17.8mm
  • 19.4mm
  • 20.3mm
  • 22.2mm
  • 22.9mm
  • 25.4mm
  • 30.5mm
  • 34.3mm
  • 35.6mm
  • 39.4mm
  • 3m
  • 40.1mm
  • 40.5mm
  • 40.6mm
  • 43.2mm
  • 45mm
  • 50.3mm
  • 55.2mm
  • 65.5mm
  • 68.1mm
  • 69.9mm
  • 72.5mm
  • 95.7mm

Material

  • Glass, Polyester, Thermoplastic
  • Polyester

Material Flammability Rating

  • UL94 V-0

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • Not Applicable

Mount

  • Socket
  • Surface Mount
  • Through Hole
  • Through Hole, Wire
  • Wire

Mounting Type

  • Surface Mount
  • Through Hole

Number of Contacts

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 200
  • 208
  • 22
  • 24
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Positions

  • 10
  • 12
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 22
  • 24
  • 26
  • 28
  • 32
  • 40
  • 42
  • 48
  • 56
  • 64
  • 90
  • 95

Number of Rows

  • 1
  • 2

Orientation

  • Straight

Package / Case

  • PLCC
  • QFP
  • SOIC
  • TO-8
  • TSOP

Packaging

  • Box
  • Bulk

Part Status

  • Active
  • Obsolete

Pbfree Code

  • no
  • yes

PCB Contact Pattern

  • RECTANGULAR

PCB Contact Row Spacing

  • 0.3 mm
  • 0.6 mm

Pitch

  • 1.778mm
  • 1.78mm
  • 2.54mm

Pitch - Mating

  • 0.020 0.50mm
  • 0.024 0.60mm
  • 0.025 0.64mm
  • 0.026 0.65mm
  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Pitch - Post

  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Published

  • 2000
  • 2001
  • 2002
  • 2003
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2017
  • 2018

Radiation Hardening

  • No

REACH SVHC

  • No SVHC

RoHS Status

  • Non-RoHS Compliant
  • RoHS Compliant
  • ROHS3 Compliant

Row Spacing

  • 10.16 mm
  • 15.24 mm
  • 2.54 mm
  • 20.32 mm
  • 22.86 mm
  • 25.4 mm
  • 3.81 mm
  • 7.62 mm

Sensing Distance

  • 3 m

Series

  • 647
  • DS9075

Termination

  • Solder
  • Wire Wrap

Termination Post Length

  • 0.030 0.76mm
  • 0.031 0.80mm
  • 0.080 2.03mm
  • 0.089 2.28mm
  • 0.090 2.29mm
  • 0.125 3.18mm
  • 0.130 3.30mm
  • 0.145 3.68mm
  • 0.150 3.81mm
  • 0.180 4.57mm
  • 0.236 6.00mm
  • 0.620 15.75mm

Voltage - Rated

  • 1kV

Weight

  • 453.59237g
  • 680.388555g

Width

  • 24.4mm
  • 27.9mm
  • 32.3mm
  • 32mm
  • 38.5mm
  • 43.2mm
  • 6.9mm
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Contact Finish - Mating Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Operating Temperature Lead Length JESD-609 Code Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
    16-354000-20 16-354000-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 16 ROHS3 Compliant UL94 V-0 Lead Free Tin 3A 16 STANDARD: UL 94V-0 1.58mm Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    24-351000-11-RC 24-351000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2007 Correct-A-Chip® 351000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant 24 SOCKET ADAPTER No SVHC Through Hole 3.175mm e4 7.62 mm IC SOCKET 0.026 0.65mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    20-665000-00 20-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant 20 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    LCQT-QFP0.5-40 LCQT-QFP0.5-40 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 40 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
    1107254-14 1107254-14 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    64-304121-00 64-304121-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 2006 Obsolete Not Applicable Solder EAR99 64 Non-RoHS Compliant Lead Free 64 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.031 0.80mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.031 0.80mm TQFP QFP FR4 Epoxy Glass
    24-35W000-11-RC 24-35W000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 24 ROHS3 Compliant 24 SOCKET ADAPTER Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    1110267-N 1110267-N Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1110267-N Active 1 (Unlimited) Solder EAR99 64 Non-RoHS Compliant 68 SOCKET ADAPTER Through Hole e0 IC SOCKET Tin-Lead 200.0μin 5.08μm Brass 0.100 2.54mm PLCC DIP, 0.9 (22.86mm) Row Spacing FR4 Epoxy Glass
    LCQT-QFP0.5-52 LCQT-QFP0.5-52 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant UL94 V-0 Lead Free 52 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
    1107254-40 1107254-40 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A 40 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    95-132I25 95-132I25 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 95-132I25 Active 1 (Unlimited) Solder 95 EAR99 Tin 132 34.3mm Non-RoHS Compliant Contains Lead 132 SOCKET ADAPTER 2.39mm Through Hole e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    28-652000-10 28-652000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2011 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 28 Non-RoHS Compliant Lead Free Tin 1A 28 UL 94V-0 1.58mm Through Hole e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    24-354W00-10 24-354W00-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free 24 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
    16-354W00-20 16-354W00-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant 16 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
    20-352000-10 20-352000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole RYTON 2006 Correct-A-Chip® 352000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 20 Non-RoHS Compliant 1A 20 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    28-354000-11-RC 28-354000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 Copper 3A 28 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    1106396-40 1106396-40 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2013 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A 40 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    20-351000-10 20-351000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead Tin 1A 20 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    68-653000-10 68-653000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 no Active 1 (Unlimited) Solder EAR99 105°C -55°C 68 Non-RoHS Compliant Contains Lead Tin 1A 68 UL 94V-0 6.08mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    20-353000-10 20-353000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole RYTON 2006 Correct-A-Chip® 353000 Active 1 (Unlimited) Solder EAR99 Tin-Lead 20 Non-RoHS Compliant UL94 V-0 Lead, Tin 1A 20 Through Hole 3.175mm e3 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm 200.0μin 5.08μm Phosphor Bronze Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    84-653000-11-RC 84-653000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 105°C -55°C 84 ROHS3 Compliant UL94 V-0 Lead Free 1A 84 UL 94V-0 Through Hole 3.175mm e4 2 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    14-666000-00 14-666000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 14 Non-RoHS Compliant Tin 14 UL 94V-0 Surface Mount 2.032mm e0 2 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
    24-35W000-10 24-35W000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 24 30.5mm Non-RoHS Compliant Lead Free 24 SOIC 1.58mm Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    68-652000-11-RC 68-652000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 68 ROHS3 Compliant 1A 68 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    18-35W000-10-P 18-35W000-10-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder 18 Non-RoHS Compliant 18 SOIC Through Hole 3.175mm 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    1107254-28 1107254-28 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 35.6mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    95-100I25 95-100I25 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 2001 Obsolete 1 (Unlimited) Solder EAR99 Tin 100 34.3mm RoHS Compliant Lead Free Brass 100 SOCKET ADAPTER 2.39mm Through Hole 2.54 mm IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    44-653000-11-RC 44-653000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder 44 ROHS3 Compliant UL94 V-0 Lead Free Brass Gold 1A 44 No SVHC Through Hole 3.175mm Socket Included 1A UL94 V-0 15.24 mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    20-354W00-20 20-354W00-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant 20 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
    18-350000-10-HT 18-350000-10-HT Aries Electronics 0.0000
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    		 0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 18 Non-RoHS Compliant 18 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
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