Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
BR24C02-10TU-1.8 | ROHM Semiconductor | 2.7958 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | yes | Not For New Designs | 1 (Unlimited) | 8 | 5V | 4.4mm | ROHS3 Compliant | Copper, Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | unknown | 2 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | BR24C02 | 8 | 0.65mm | Not Qualified | 4.5 μs | 2Kb 256 x 8 | Non-Volatile | 0.003mA | 1.8V~5.5V | 2KX1 | 1 | 400kHz | 0.000003A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25L640F-WE2 | ROHM Semiconductor | 1.3387 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 5mm | ROHS3 Compliant | Lead Free | Copper, Tin | 8 | 8-SOIC (0.173, 4.40mm Width) | SPI, Serial | 64 kb | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.6mm | 1 | e2 | TIN COPPER | DUAL | 260 | 2.5V | 10 | BR25L640 | 8 | 1.27mm | Not Qualified | 64Kb 8K x 8 | Non-Volatile | 0.003mA | 1.8V~5.5V | 8 | 5MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
QMP29GL512P11TFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | GL-P | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 56-TSOP | 512Mb 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X20CLSNIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | 2Mb 256K x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93G86FVJ-3AGTE2 | ROHM Semiconductor | 0.6407 |
Min: 1 Mult: 1 |
0.00000000 | 9 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | Active | 1 (Unlimited) | 8 | ROHS3 Compliant | Tin | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 16 kb | Surface Mount | -40°C~85°C TA | CMOS | DUAL | 0.635mm | R-PDSO-G8 | Not Qualified | 1.8/5V | 200 ns | 16Kb 1K x 16 | Non-Volatile | 0.003mA | 1.7V~5.5V | 1KX16 | 16 | 3MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 3-WIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MTFC8GLDDQ-4M IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 100-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 64Gb 8G x 8 | Non-Volatile | 1.65V~3.6V | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7024L45J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2013 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; ARBITER; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 29.21mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | YES | SRAMs | 5V | 3-STATE | 45 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | 0.0015A | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "CY7C128A-15VC") |
CY7C128A-15VC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2001 | Obsolete | 3 (168 Hours) | 24 | EAR99 | 5V | 1 | Non-RoHS Compliant | Contains Lead | No | 24 | AUTOMATIC POWER-DOWN | 24-BSOJ (0.300, 7.62mm Width) | 16 kb | 15GHz | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.55mm | 1 | e0 | TIN LEAD | DUAL | 225 | 5V | 30 | CY7C128A | 24 | YES | 5V | 3-STATE | 16Kb 2K x 8 | Volatile | 11b | 4.5V~5.5V | 2KX8 | 8 | 0.04A | YES | COMMON | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G32F-3AGTE2 | ROHM Semiconductor | 0.7356 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Surface Mount | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | Tin | 8 | SEATED HGT CALCULATED | 8-SOIC (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 32 kb | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | e3 | DUAL | NOT SPECIFIED | NOT SPECIFIED | 1.27mm | 1.6V | 5.5V | 450 ns | 32Kb 4K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR25020N-10SU-2.7 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | Not For New Designs | 1 (Unlimited) | 8 | 5V | ROHS3 Compliant | Copper, Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 2 kb | Surface Mount | -40°C~85°C TA | CMOS | DUAL | BR25020 | 1.27mm | Not Qualified | 800 ns | 2Kb 256 x 8 | Non-Volatile | 0.006mA | 2.7V~5.5V | 8 | 3MHz | 0.000005A | 100 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S29GL064S90TFVV10 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | GL-S | Active | 3 (168 Hours) | 56 | 18.4mm | ROHS3 Compliant | 64 | 56-TFSOP (0.724, 18.40mm Width) | 14mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | DUAL | 3V | YES | 0.5mm | R-PDSO-G56 | 2.7V | 3.6V | 90ns | 64Mb 8M x 8 4M x 16 | Non-Volatile | 1.65V~3.6V | 8MX8 | 8 | 3V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
6116SA25SOGI | Renesas Electronics America Inc. | 6.2368 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tube | Active | 1 (Unlimited) | ROHS3 Compliant | 24-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT6116 | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24T256-WZ | ROHM Semiconductor | 2.4283 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tube | Active | 1 (Unlimited) | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | NOT SPECIFIED | NOT SPECIFIED | 256Kb 32K x 8 | Non-Volatile | 1.6V~5.5V | 400kHz | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G64NUX-3ATTR | ROHM Semiconductor | 0.3114 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2014 | Active | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | Tin | 8-UFDFN Exposed Pad | 2-Wire, I2C, Serial | 64 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.6mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G64 | 0.5mm | R-PDSO-N8 | 1.7V | 5.5V | 450 ns | 64Kb 8K x 8 | Non-Volatile | 1.7V~5.5V | 8KX8 | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR24T32NUX-WTR | ROHM Semiconductor | 0.3480 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | yes | Active | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | Tin | 8 | 8-UFDFN Exposed Pad | 2-Wire, I2C, Serial | 32 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.6mm | 1 | e3 | DUAL | 225 | 2.5V | NOT SPECIFIED | BR24T32 | 0.5mm | 1.6V | Not Qualified | 5.5V | 900 ns | 32Kb 4K x 8 | Non-Volatile | 0.002mA | 1.6V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25L040FJ-WE2 | ROHM Semiconductor | 4.0670 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2005 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Copper, Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 4 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | e2 | TIN COPPER | DUAL | 260 | 2.5V | 10 | BR25L040 | 8 | 1.27mm | Not Qualified | 5 μs | 4Kb 512 x 8 | Non-Volatile | 0.003mA | 1.8V~5.5V | 8 | 5MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93A76RFVT-WME2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~105°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 4V | NOT SPECIFIED | YES | 0.65mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/5V | 5.5V | 8Kb 512 x 16 | Non-Volatile | 0.0045mA | 2.5V~5.5V | 512X16 | 16 | 8192 bit | SERIAL | 2MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | 3-WIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93G86FV-3AGTE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | CMOS | DUAL | YES | 0.635mm | R-PDSO-G8 | Not Qualified | 1.8/5V | 16Kb 1K x 16 | Non-Volatile | 0.003mA | 1.7V~5.5V | 1KX16 | 16 | 16384 bit | SERIAL | 3MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 3-WIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT45DB041A-TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2001 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | -40°C~85°C TC | FLASH | AT45DB041 | 28-TSOP | 4Mb 264Bytes x 2048 pages | Non-Volatile | 2.7V~3.6V | 13MHz | FLASH | SPI | 14ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70261S55PFI/2703 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 256Kb 16K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PC48F4400P0VB0E3 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2015 | Axcell™ | Discontinued | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-LBGA | Parallel | Surface Mount | -40°C~85°C TC | FLASH - NOR | 48F4400P0 | 64-EasyBGA (10x13) | 100ns | 512Mb 32M x 16 | Non-Volatile | 1.7V~2V | 52MHz | FLASH | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3319S166BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 166MHz | 1.4mm | 15mm | 1.4mm | CMOS | 500mA | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 3.6 ns | 166MHz | 512kB | RAM, SDR, SRAM | 18b | Synchronous | 0.03A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
|
BR24L16-W | ROHM Semiconductor | 0.2746 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Through Hole | Tube | 2011 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 9.3mm | ROHS3 Compliant | Lead Free | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | 16 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 3.7mm | 1 | e3/e2 | TIN/TIN COPPER | DUAL | 260 | 2.5V | 10 | BR24L16 | 8 | 2.54mm | Not Qualified | 2/5V | 5.5V | 900 ns | 16Kb 2K x 8 | Non-Volatile | 0.002mA | 1.8V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||
 |
DS1230ABP-70+ | Maxim Integrated | 24.6933 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2002 | yes | Active | 1 (Unlimited) | 34 | EAR99 | 5V | 25.019mm | ROHS3 Compliant | No | 34 | 34-PowerCap™ Module | 256 kb | Surface Mount | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 85mA | 6.85mm | 8473.30.11.40 | 1 | e3 | MATTE TIN | DUAL | 245 | 5V | 40 | DS1230AB | 34 | YES | 1.27mm | SRAMs | 5V | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 8b | 0.0006A | 70 ns | NVSRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR93L86RFV-WE2 | ROHM Semiconductor | 0.1647 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | 8-LSSOP (0.173, 4.40mm Width) | Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.25mm | 1 | 4.5mA | e2 | Tin/Copper (Sn/Cu) | DUAL | 260 | 2.5V | 10 | 8 | 0.65mm | 200 ns | 16Kb 1K x 16 | Non-Volatile | 1.8V~5.5V | 1KX16 | 16 | 2MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR24L16FJ-WE2 | ROHM Semiconductor | 6.2055 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | Copper, Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | No SVHC | 16 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.775mm | 1 | 2mA | e2 | Tin/Copper (Sn/Cu) | DUAL | 260 | 2.5V | 10 | BR24L16 | 8 | 1.27mm | 1.7V | 2/5V | 5.5V | 900 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||
 |
IS61NLP12836B-200TQI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Not For New Designs | 2 (1 Year) | Non-RoHS Compliant | 100 | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 3.1ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70P264L55BYGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2009 | yes | Discontinued | 3 (168 Hours) | 81 | EAR99 | 85°C | -40°C | 1.8V | 2 | 5mm | RoHS Compliant | Lead Free | No | 81 | TFBGA | Parallel | 1.9V | 1.7V | 256 kb | 5mm | 1mm | CMOS | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1.8V | 30 | 81 | INDUSTRIAL | YES | SRAMs | 3-STATE | 55 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR24G02NUX-3TTR | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | Tin | 8-UFDFN Exposed Pad | 2-Wire, I2C, Serial | 2 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.6mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | BR24G02 | 0.5mm | R-PDSO-N8 | 1.6V | 5.5V | 900 ns | 2Kb 256 x 8 | Non-Volatile | 1.6V~5.5V | 256X8 | 8 | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS43DR16160B-37CBLI | ISSI, Integrated Silicon Solution Inc | 3.9974 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 84 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | 84 | AUTO/SELF REFRESH | 84-TFBGA | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 10 | YES | 0.8mm | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 500ps | 256Mb 16M x 16 | Volatile | 0.26mA | 1.7V~1.9V | 16MX16 | 16 | 16b | 266MHz | 0.025A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 |
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