Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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70T651S12DR | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2005 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 28mm | RoHS Compliant | Contains Lead | No | 208 | PQFP | Parallel | 2.6V | 2.4V | 9 Mb | 28mm | 3.5mm | CMOS | 4.1mm | 1 | 355mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 20 | 208 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 12 ns | 1.1MB | RAM, SDR, SRAM | 18b | Asynchronous | 0.01A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416L15BEG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2012 | yes | Active | 3 (168 Hours) | 48 | 70°C | 0°C | 3.3V | 1 | 9mm | RoHS Compliant | Lead Free | 48 | TFBGA | Parallel | 3.6V | 3V | 4 Mb | 9mm | 1.2mm | CMOS | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3.3V | NOT SPECIFIED | 48 | COMMERCIAL | YES | 0.75mm | SRAMs | Not Qualified | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7024L15JG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | Active | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Lead Free | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 29.21mm | 3.63mm | 260mA | 15 ns | 8kB | RAM, SDR, SRAM | 24b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "EDW2032BBBG-6A-F-D") |
EDW2032BBBG-6A-F-D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2007 | Obsolete | 3 (168 Hours) | 95°C | 0°C | ROHS3 Compliant | No | 170 | 170-TFBGA | Parallel | 2 Gb | Surface Mount | 0°C~95°C TC | SGRAM - GDDR5 | 170-FBGA (12x14) | 2Gb 64M x 32 | Volatile | 13b | 1.31V~1.65V | 32b | 1.5GHz | RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC128-I/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2011 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5.26mm | ROHS3 Compliant | Tin | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 128 kb | 5.25mm | Surface Mount | -40°C~85°C TA | CMOS | 2.03mm | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 25LC128 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 50 ns | 128Kb 16K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA166BG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3556 | 3.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 166MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24FC16H-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tube | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8 | DUAL | 5V | YES | 1.27mm | R-PDSO-G8 | 1.7V | 5.5V | 450μs | 16Kb 2K x 8 | Non-Volatile | 1.7V~5.5V | 256X8 | 8 | 2048 bit | SERIAL | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V321L55TF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 3.3V | 2 | 10mm | RoHS Compliant | Contains Lead | No | 64 | LQFP | Parallel | 3.6V | 3V | 16 kb | 10mm | 1.4mm | CMOS | 1.6mm | 1 | 85mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 64 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 55 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49BV3218T-11CI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 48-TFBGA, CSPBGA | Surface Mount | -40°C~85°C TC | AT49BV3218 | 110ns | 32Mb 4M x 8 2M x 16 | Non-Volatile | 2.65V~3.3V | FLASH | Parallel | 20μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S71KS512SC0BHB000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Automotive, AEC-Q100, HyperFlash™ + HyperRAM™ KL | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | HYPER RAM IS ORGANISED AS 8MX8 | 24-VBGA | 6mm | Surface Mount | -40°C~105°C TA | FLASH, DRAM | SYNCHRONOUS | 1mm | 8542.32.00.71 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 512Mbit Flash 64Mbit RAM | Non-Volatile | 1.7V~1.95V | 64MX8 | 8 | 536870912 bit | 166MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V658S12BFGI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 208-LFBGA | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | IDT70V658 | 208-FPBGA (15x15) | 12ns | 2Mb 64K x 36 | Volatile | 3.15V~3.45V | SRAM | Parallel | 12ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL256SDPBHIC13 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | FL-S | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24 | ALSO CONFIGURABLE AS 128M X 1 | 24-TBGA | SPI, Serial | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | 3V | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 0.1mA | 2.7V~3.6V | 64MX4 | 4 | 268435456 bit | 66MHz | 0.0001A | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 500ms | 3V | SPI | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT6116LA35SOG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 1 | 15.4mm | RoHS Compliant | SOIC | Parallel | unknown | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 30 | 24 | COMMERCIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.075mA | 2KX8 | 8 | 16384 bit | 0.00002A | 35 ns | YES | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1418AV18-167BZC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | 1.8V | 17mm | Non-RoHS Compliant | Contains Lead | 165 | PIPELINED ARCHITECTURE | 165-LBGA | not_compliant | 36 Mb | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II | 1.4mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 220 | 1.8V | NOT SPECIFIED | CY7C1418 | 165 | YES | 1mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 500 ps | 36Mb 2M x 18 | Volatile | 0.5mA | 1.7V~1.9V | 2MX18 | 18 | 167MHz | 0.22A | COMMON | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1313CV18-250BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 165 | 15mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | 165-LBGA | unknown | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | NOT SPECIFIED | BOTTOM | 1.8V | 165 | YES | 1mm | R-PBGA-B165 | 1.7V | COMMERCIAL | 1.9V | 18Mb 1M x 18 | Volatile | 1.7V~1.9V | 1MX18 | 18 | 18874368 bit | 250MHz | 0.45 ns | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S25FS256SAGBHV200 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | 2016 | FS-S | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24-TBGA | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 1.7V | 2V | 256Mb 32M x 8 | Non-Volatile | 1.7V~2V | 64MX4 | 4 | 268435456 bit | SERIAL | 133MHz | 2 | 1.8V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT7164S20Y8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 1 | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 28 | COMMERCIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.17mA | 8KX8 | 8 | 65536 bit | 0.015A | 19 ns | YES | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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MTFC64GASAONS-AIT ES | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | compliant | FLASH | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49LV001NT-90TC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TC | AT49LV001 | 90ns | 1Mb 128K x 8 | Non-Volatile | 3V~3.6V | FLASH | Parallel | 50μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P74604S250BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 70°C | 0°C | RoHS Compliant | 165 | Parallel | 250MHz | QDR, RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761YSA183BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 85°C | -40°C | Non-RoHS Compliant | 165 | Parallel | 183MHz | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7034S15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 9kB | RAM, SDR, SRAM | 24b | 4KX18 | Asynchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
 |
7027S25PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 345mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 25 ns | 64kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.03A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
71124S15YGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 32 | 85°C | -40°C | 5V | 1 | 20.9mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 5.5V | 4.5V | 1 Mb | 10.2mm | 2.2mm | CMOS | 3.683mm | 1 | 155mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 32 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 15 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70261S55PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 270mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 55 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.015A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
|
IS62WV51216EFBLL-45BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 48-VFBGA | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | NOT SPECIFIED | NOT SPECIFIED | 45ns | 8Mb 512K x 16 | Volatile | 2.2V~3.6V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC160CT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 25LC160C | 8 | 0.65mm | 100 ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39LF801C-55-4C-EKE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Tray | 2011 | SST39 MPF™ | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 18.4mm | ROHS3 Compliant | Lead Free | No | 48 | BOTTOM BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | 8 Mb | Surface Mount | 0°C~70°C TA | CMOS | 1.2mm | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3.3V | 40 | SST39LF801 | 48 | YES | 0.5mm | 3V | 3.6V | 55ns | 8Mb 512K x 16 | Non-Volatile | 19b | 3V~3.6V | 512KX16 | 16 | Asynchronous | 16b | 0.00002A | 16b | 2.7V | YES | YES | YES | 256 | YES | YES | FLASH | Parallel | 10μs | 2K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||
|
7052S25G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2009 | no | Active | 1 (Unlimited) | 108 | EAR99 | 70°C | 0°C | 5V | 4 | 30.48mm | RoHS Compliant | Contains Lead | No | 108 | AUTOMATIC POWER-DOWN | Parallel | 5.5V | 4.5V | 16 kb | 30.48mm | 3.68mm | CMOS | 5.207mm | 1 | 300mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 108 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | RAM, SRAM | 11b | 2KX8 | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7006L20PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 320mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V |
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70T651S12DR Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 9 Mb kb 28mm mm 355mA mA 36b b
Price: 0.0000
RFQ -
-
7024L15JG Integrated Device Technology (IDT)
Surface Mount Memory IC 64 kb kb 29.21mm mm 260mA mA 16b b
Price: 0.0000
RFQ -
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25LC128-I/SM Microchip Technology
3/5V V Surface Mount 8 Pin Memory IC 25LC128 128 kb kb 5.26mm mm 5mA mA
Price: 0.0000
RFQ -
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24FC16H-I/SN Microchip Technology
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25LC160CT-I/ST Microchip Technology
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