Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CYDC064B16-55AXI | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 100 | 14mm | ROHS3 Compliant | ALSO OPERATES AT 2.5V AND 3V SUPPLY | 100-LQFP | unknown | 14mm | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, MoBL | ASYNCHRONOUS | 1.6mm | 1 | e3 | MATTE TIN | QUAD | 260 | 1.8V | 20 | 100 | YES | 0.5mm | S-PQFP-G100 | 1.7V | COMMERCIAL | 1.9V | 64Kb 4K x 16 | Volatile | 1.7V~1.9V 2.4V~2.6V 3V~3.6V | 4KX16 | 16 | 65536 bit | 55 ns | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MTFC4GMTEA-WT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2010 | e•MMC™ | Obsolete | 3 (168 Hours) | 153 | ROHS3 Compliant | No | 153 | 153-WFBGA | 32 Gb | Surface Mount | -25°C~85°C TA | FLASH - NAND | BOTTOM | 0.5mm | Other Memory ICs | 1.8/3.33/3.3V | 2.7V | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M25PX32-VMP6F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2013 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-VDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | M25PX32 | 8-VDFPN (6x5) (MLP8) | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 15ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS1230AB-70IND | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 3 (168 Hours) | 28 | Non-RoHS Compliant | 28-DIP Module (0.600, 15.24mm) | Through Hole | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1 | e0 | TIN LEAD | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | 28 | NO | R-XDMA-P28 | 4.75V | COMMERCIAL | 5.25V | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 70 ns | NVSRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M27C160-50F1 | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | Obsolete | 3 (168 Hours) | 42 | EAR99 | 5V | 54.635mm | ROHS3 Compliant | 42 | 42-CDIP (0.600, 15.24mm) Window | 16 Mb | 15.24mm | Through Hole | 0°C~70°C TA | EPROM - UV | 70mA | ASYNCHRONOUS | 5.71mm | 1 | 70mA | e3 | Matte Tin (Sn) | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | M27C160 | 42 | 2.54mm | Not Qualified | 5V | 3-STATE | 50ns | 16Mb 2M x 8 1M x 16 | Non-Volatile | 4.5V~5.5V | 1MX16 | 16 | 0.0001A | 8 | COMMON | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||
.png "M29F200FB55N3F2 TR") |
M29F200FB55N3F2 TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2014 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~125°C TA | FLASH - NOR | M29F200 | 2Mb 256K x 8 128K x 16 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
RMLV3216AGSA-5S2#KA0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | 48 | 32Mb 4M x 8 2M x 16 | Volatile | 2.7V~3.6V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32200E-6BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | no | Obsolete | 2 (1 Year) | 90 | EAR99 | 3.3V | 1 | 13mm | Non-RoHS Compliant | No | 90 | AUTO/SELF REFRESH | 90-TFBGA | 64 Mb | Surface Mount | -40°C~85°C TA | SDRAM | 1.2mm | 8542.32.00.02 | 1 | 160mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 3.3V | 90 | 0.8mm | 3V | 3.6V | 3-STATE | 5.5ns | 64Mb 2M x 32 | Volatile | 13b | 3V~3.6V | 2MX32 | 32 | 32b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761YSA183BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | not_compliant | 183MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 119 | INDUSTRIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.35mA | 128KX36 | 36 | 4718592 bit | 0.035A | 3.3 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
7015L12JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | yes | Active | 3 (168 Hours) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Lead Free | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 72 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 275mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 68 | COMMERCIAL | 12 ns | 9kB | RAM, SDR, SRAM | 13b | 8KX9 | Asynchronous | 9b | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M93S46-WMN6P | STMicroelectronics | 0.5800 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tube | Active | 1 (Unlimited) | 8 | EAR99 | 5mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | No SVHC | 1 kb | 1.5mm | 4mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 2mA | e4 | DUAL | 260 | 5V | 30 | M93S46 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 200 ns | 1Kb 64 x 16 | Non-Volatile | 2.5V~5.5V | 2MHz | 0.00001A | 40 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V2558S166PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 166MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.35mA | 128KX36 | 36 | 4718592 bit | 0.04A | 3.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25H640F-2CE2 | ROHM Semiconductor | 0.6852 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED | 8-SOIC (0.173, 4.40mm Width) | Unknown | 4.4mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | 4.5V | Not Qualified | 3/5V | 5.5V | 64Kb 8K x 8 | Non-Volatile | 0.0055mA | 2.5V~5.5V | 8 | 65536 bit | SERIAL | 10MHz | 0.00001A | 100 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 4ms | SPI | EEPROM | SPI | 4ms | ||||||||||||||||||||||||||||||||||||||||||||||||
|
MT40A512M16TB-062E IT:J | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Last Time Buy | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR4 | 19ns | 8Gb 512M x 16 | Volatile | 1.14V~1.26V | 1.6GHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70P255L65BYGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel | 2008 | yes | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | RoHS Compliant | No | 100 | TFBGA | Parallel | 3V | 1.8V | 128 kb | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 65 ns | 16kB | RAM, SDR, SRAM | 26b | 0.07mA | 8KX16 | 16 | 0.000008A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70V3599S133BFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2010 | yes | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1.7mm | 1 | 480mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 3.3V | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 25 ns | 512kB | RAM, SDR, SRAM | 34b | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA12YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | no | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 28 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.16mA | 32KX8 | 8 | 262144 bit | 0.015A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V631S12PRFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 128 | 85°C | -40°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | TQFP | Parallel | 3.45V | 3.15V | 4.5 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 515mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 12 ns | 512kB | RAM, SDR, SRAM | 36b | Asynchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
 |
25AA160DT-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | SPI, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 25AA160D | 8 | 0.65mm | 160 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C64M16D3LA-12BAN | Alliance Memory, Inc. | 6.9032 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Automotive, AEC-Q100 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 8mm | Surface Mount | -40°C~105°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B96 | 1.283V | 1.45V | 20ns | 1Gb 64M x 16 | Volatile | 1.283V~1.45V | 64MX16 | 16 | 1073741824 bit | 800MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3577S80PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2005 | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | Non-RoHS Compliant | 100 | FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.465V | not_compliant | 3.135V | 4.5 Mb | 100MHz | CMOS | 1 | 200mA | e0 | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 8 ns | RAM, SRAM | 17b | 36 | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416L10BEG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFBGA | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT71V416 | 48-CABGA (9x9) | 10ns | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V124SA15YI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 32 | 3A991.B.2.B | 85°C | -40°C | 20.955mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 32 | INDUSTRIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.12mA | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25G320FJ-3GE2 | ROHM Semiconductor | 0.4064 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | SEATED HT-CALCULATED | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 1.6V | 5.5V | 32Kb 4K x 8 | Non-Volatile | 1.6V~5.5V | 4KX8 | 8 | 32768 bit | SERIAL | 20MHz | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9389L9PRFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 128-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Synchronous | IDT70V9389 | 128-TQFP (14x20) | 9ns | 1.125Mb 64K x 18 | Volatile | 3V~3.6V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C86AT-E/OT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2002 | yes | Active | 1 (Unlimited) | 6 | 5V | 2.95mm | ROHS3 Compliant | Lead Free | Tin | No | 6 | SOT-23-6 | Serial | 16 kb | Surface Mount | -40°C~125°C TA | CMOS | 1.45mm | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 93C86A | 6 | 0.95mm | 5V | 100 ns | 16Kb 2K x 8 | Non-Volatile | 4.5V~5.5V | 2KX8 | 8 | 3MHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||
 |
JS28F512P33BFD | Micron Technology Inc. | 51.7051 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2013 | Axcell™ | yes | Obsolete | 3 (168 Hours) | 56 | 18.4mm | ROHS3 Compliant | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | Parallel, Serial | 512 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 1 | 31mA | e3 | MATTE TIN | DUAL | 260 | 3V | 30 | 28F512P33 | 56 | YES | 0.5mm | 2.3V | 512Mb 32M x 16 | Non-Volatile | 25b | 2.3V~3.6V | 32MX16 | 16 | Asynchronous | 40MHz | 105 ns | 16b | FLASH | Parallel | 105ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
25AA040A/S16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | EEPROM | 25AA040A | Die | 4Kb 512 x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MTFC32GJDED-3M WT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2013 | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 169-VFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | 256Gb 32G x 8 | Non-Volatile | 1.65V~3.6V | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1021B-12VXCT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2006 | Obsolete | 3 (168 Hours) | 44 | 3A991.B.2.B | 28.575mm | ROHS3 Compliant | Lead Free | 44 | 44-BSOJ (0.400, 10.16mm Width) | unknown | 12GHz | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.7592mm | 8542.32.00.41 | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 5V | CY7C1021 | 44 | YES | 1.27mm | 4.5V | Not Qualified | 5.5V | 1Mb 64K x 16 | Volatile | 4.5V~5.5V | 64KX16 | 16 | 1048576 bit | 12 ns | SRAM | Parallel | 12ns |
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