Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "IS61NVF51236-6.5B3") |
IS61NVF51236-6.5B3 | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | no | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165 | FLOW-THROUGH ARCHITECTURE | 165-TBGA | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 165 | YES | 1mm | 2.375V | Not Qualified | 2.5V | 2.625V | 3-STATE | 6.5ns | 18Mb 512K x 36 | Volatile | 0.45mA | 2.375V~2.625V | 512KX36 | 36 | 18874368 bit | 133MHz | 0.06A | COMMON | 2.38V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1314KV18-250BZXCT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Surface Mount | Tape & Reel (TR) | 2003 | yes | Active | 3 (168 Hours) | 165 | 1.8V | 2 | 15mm | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 18 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | 670mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C1314 | 1mm | 1.7V | 1.9V | 3-STATE | 450 ps | 18Mb 512K x 36 | Volatile | 18b | 1.7V~1.9V | 36 | Synchronous | 250MHz | 36b | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT42L64M32D2HE-18 IT:D TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 134-VFBGA | Surface Mount | -40°C~85°C TC | SDRAM - Mobile LPDDR2 | 2Gb 64M x 32 | Volatile | 1.14V~1.3V | 533MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7006L45J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; ARBITER; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 45 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24S128FJ-WE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | Copper, Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 128 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.775mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | BR24S128 | 8 | 1.27mm | Not Qualified | 5.5V | 900 ns | 128Kb 16K x 8 | Non-Volatile | 0.0025mA | 1.7V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS1230AB-70IND | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 3 (168 Hours) | 28 | Non-RoHS Compliant | 28-DIP Module (0.600, 15.24mm) | Through Hole | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1 | e0 | TIN LEAD | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | 28 | NO | R-XDMA-P28 | 4.75V | COMMERCIAL | 5.25V | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 70 ns | NVSRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q64FVTCIG | Winbond Electronics | 0.3801 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | No | 24 | 24-TBGA | SPI, Serial | 64 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 1 | BOTTOM | YES | 1mm | 3V | 3.6V | 3-STATE | 64Mb 8M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8MX8 | 8 | 104MHz | 0.00005A | 1 | 20 | HARDWARE/SOFTWARE | 256B | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29VZZZAD8DQKSM-053 W ES.9D8 TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC4GLGDM-AIT A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 153-TFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | 2.7V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7026S25J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 84-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7026 | 84-PLCC (29.21x29.21) | 25ns | 256Kb 16K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W9816G6IH-6I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2009 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 50-TSOP (0.400, 10.16mm Width) | Parallel | 166MHz | Surface Mount | -40°C~85°C TA | SDRAM | 50-TSOP II | 5ns | 16Mb 1M x 16 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY7C2270XV18-600BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2003 | Active | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 36 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II+ | 1 | 1.165A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C2270 | 165 | 3-STATE | 450 ps | 36Mb 1M x 36 | Volatile | 19b | 1.7V~1.9V | 36 | Synchronous | 600MHz | 36b | COMMON | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V67802S150PFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V67802 | 3.8ns | 9Mb 512K x 18 | Volatile | 3.135V~3.465V | 150MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR24G01FJ-3GTE2 | ROHM Semiconductor | 1.7121 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 1999 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8 | SEATED HT-CALCULATED | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | Unknown | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G01 | YES | 1.27mm | 1.7V | 5.5V | 1Kb 128 x 8 | Non-Volatile | 1.6V~5.5V | 8 | 1024 bit | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
JS28F256J3F1058 TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | StrataFlash™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 56-TSOP | 105ns | 256Mb 32M x 8 16M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 105ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7027S25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 25 ns | 64kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.005A | 16b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H32M32LFB5-5 AT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2013 | Obsolete | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-VFBGA | 8mm | Surface Mount | -40°C~105°C TA | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | 8542.32.00.32 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 1.8V | MT46H32M32 | 90 | YES | 0.8mm | R-PBGA-B90 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5ns | 1Gb 32M x 32 | Volatile | 0.15mA | 1.7V~1.95V | 32MX32 | 32 | 1073741824 bit | 200MHz | 0.000015A | COMMON | 8192 | DRAM | Parallel | 15ns | 24816 | 24816 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1061DV33-10BV1XI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 1996 | Obsolete | 3 (168 Hours) | 48 | 3.3V | 1 | 9.5mm | ROHS3 Compliant | Lead Free | No | 48 | 48-VFBGA | 16 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 175mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3.3V | 40 | CY7C1061 | 48 | 0.75mm | 3V | 3.6V | 3-STATE | 16Mb 1M x 16 | Volatile | 20b | 3V~3.6V | 16 | Asynchronous | 0.025A | 16b | COMMON | 2V | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70261S35PFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 256Kb 16K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC65-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2003 | yes | Active | 1 (Unlimited) | 8 | 10.16mm | ROHS3 Compliant | Lead Free | No | 8 | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | No SVHC | 64 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 5V | 24LC65 | 8 | 2.54mm | 2.5V | 3/5V | 6V | OPEN-DRAIN | 900ns | 64Kb 8K x 8 | Non-Volatile | 2.5V~6.0V | 400kHz | 0.00005A | 200 | 100000 Write/Erase Cycles | SOFTWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25L010FVJ-WE2 | ROHM Semiconductor | 4.8877 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2010 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | Copper, Tin | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | SPI, Serial | 1 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.05mm | 8542.32.00.51 | 1 | e2 | TIN COPPER | DUAL | 260 | 2.5V | 10 | BR25L010 | 8 | 0.65mm | S-PDSO-G8 | 1.8V | Not Qualified | 5 μs | 1Kb 128 x 8 | Non-Volatile | 0.003mA | 1.8V~5.5V | 128X8 | 8 | 5MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7015L20PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 20 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.005A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT42L128M64D2LN-18 WT:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | 8Gb 128M x 64 | Volatile | 1.14V~1.3V | 533MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49F001T-12JI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C TC | AT49F001 | 120ns | 1Mb 128K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M95080-DWDW4TP/K | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | Cut Tape (CT) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | EAR99 | 4.5mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 1.05mm | 3.1mm | Surface Mount | -40°C~145°C TA | CMOS | SYNCHRONOUS | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | M95080 | 0.65mm | 2.5V | 5.5V | 80 ns | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 20MHz | 4ms | SPI | EEPROM | SPI | 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M25PE40-VMP6G | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2008 | Obsolete | 3 (168 Hours) | SMD/SMT | 3.3V | ROHS3 Compliant | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | No SVHC | 4 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8mA | M25PE40 | 2.7V | 8 ns | 4Mb 512K x 8 | Non-Volatile | 1b | 2.7V~3.6V | Synchronous | 75MHz | 8b | FLASH | SPI | 15ms, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39VF200A-70-4I-MAQE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tray | 2000 | SST39 MPF™ | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 6mm | ROHS3 Compliant | No | 48 | 48-WFBGA | 2 Mb | Surface Mount | -40°C~85°C TA | CMOS | 0.73mm | 8542.32.00.51 | 1 | 30mA | BOTTOM | 3V | SST39VF200A | 48 | 0.5mm | 2.7V | 3.6V | 70ns | 2Mb 128K x 16 | Non-Volatile | 17b | 2.7V~3.6V | 128KX16 | 16 | Asynchronous | 16b | 0.00002A | 16b | 2.7V | YES | YES | YES | 64 | YES | FLASH | Parallel | 20μs | 2K | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T651S12BCI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 2.6V | 2.4V | 9 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 395mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 18b | Asynchronous | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1230Y-100+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2002 | yes | Active | 1 (Unlimited) | 28 | EAR99 | ROHS3 Compliant | Lead Free | 28 | 28-DIP Module (0.600, 15.24mm) | not_compliant | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8473.30.11.40 | 1 | e3 | Matte Tin (Sn) | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | DS1230Y | 28 | NO | 2.54mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 256Kb 32K x 8 | Non-Volatile | 0.085mA | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 0.0006A | 100 ns | NVSRAM | Parallel | 100ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS61NVF102418-7.5B3I | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | no | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165 | FLOW-THROUGH ARCHITECTURE | 165-TBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 165 | YES | 1mm | 2.375V | Not Qualified | 2.5V | 2.625V | 3-STATE | 7.5ns | 18Mb 1M x 18 | Volatile | 0.425mA | 2.375V~2.625V | 1MX18 | 18 | 18874368 bit | 117MHz | 0.075A | COMMON | 2.38V | SRAM | Parallel |
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