Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MR0A08BCYS35 | Everspin Technologies Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 18.41mm | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 55mA | 1.2mm | 8542.32.00.71 | 1 | 70mA | DUAL | 3.3V | 44 | 0.8mm | 3V | 3.6V | 1Mb 128K x 8 | Non-Volatile | 3V~3.6V | 128KX8 | 8 | 8b | 0.007A | 35 ns | 8b | RAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS42S32200L-6TL-TR | ISSI, Integrated Silicon Solution Inc | 3.0680 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 86 | ROHS3 Compliant | 86 | 86-TFSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SDRAM | 100mA | DUAL | 3.3V | YES | 0.5mm | Not Qualified | 3.3V | 3-STATE | 5.4ns | 64Mb 2M x 32 | Volatile | 3V~3.6V | 2MX32 | 32 | 32b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9425G6EH-5 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | Obsolete | 3 (168 Hours) | 66 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | unknown | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 66 | YES | 0.65mm | R-PDSO-G66 | 2.3V | Not Qualified | 2.5V | 2.7V | 3-STATE | 55ns | 256Mb 16M x 16 | Volatile | 0.3mA | 2.3V~2.7V | 16MX16 | 16 | 268435456 bit | 250MHz | 0.02A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||
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RMLV0416EGSB-4S2#AA1 | Renesas Electronics America | 3.7769 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tube | yes | Active | 3 (168 Hours) | 44 | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 44 | YES | R-PDSO-G44 | 2.7V | 3.6V | 4Mb 256K x 16 | Volatile | 2.7V~3.6V | 256KX16 | 16 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TC58NVG2S0FTA00 | Kioxia America, Inc. | 2.3909 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 3 (168 Hours) | RoHS Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TA | FLASH - NAND (SLC) | 48-TSOP I | 25ns | 4Gb 512M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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HTEE25608D | Honeywell Aerospace | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 19 Weeks | Tube | 2013 | Active | 1 (Unlimited) | 56 | 38.1mm | RoHS Compliant | 56 | 56-BCPGA | Parallel, Serial | 19.05mm | Through Hole | -55°C~225°C TA | CMOS | SYNCHRONOUS | 6.8mm | 1 | PERPENDICULAR | 5V | NO | 2.54mm | 4.75V | 5.25V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 5MHz | 5V | EEPROM | Parallel, SPI | 90ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML02G200BHB003 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100, ML-2 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63-VFBGA | 9mm | Surface Mount | -40°C~105°C TA | FLASH - NAND | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B63 | 2.7V | 3.6V | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 256MX8 | 8 | 2147483648 bit | 3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PF58F0095HVT0B0A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TC58BVG1S3HBAI4 | Kioxia America, Inc. | 1.0435 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Benand™ | Active | 3 (168 Hours) | 63 | 11mm | RoHS Compliant | 63-VFBGA | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | 3.3V | YES | 0.8mm | R-PBGA-B63 | 2.7V | 3.6V | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 256MX8 | 8 | 2147483648 bit | PARALLEL | 3.3V | FLASH | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 71V3577S75BQG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 165-CABGA (13x15) | 7.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 117MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC512-I/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5.26mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | No SVHC | 512 kb | 5.25mm | Surface Mount | -40°C~85°C TA | CMOS | 2.03mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 5V | 25LC512 | 8 | 1.27mm | 2.5V | 2.5/5V | 5.5V | 50 ns | 512Kb 64K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 20MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||
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DS28DG02E-3C+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2009 | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 9.7mm | ROHS3 Compliant | 28 | 28-TSSOP (0.173, 4.40mm Width) Exposed Pad | SPI, Serial | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.1mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | 260 | 3.3V | NOT SPECIFIED | DS28DG02 | 28 | YES | 0.65mm | 2.2V | Not Qualified | 2Kb 256 x 8 | Non-Volatile | 0.0008mA | 2.2V~5.25V | 256X8 | 8 | 2048 bit | 2MHz | 0.0001A | 40 | 200000 Write/Erase Cycles | HARDWARE | 3V | SPI | EEPROM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||
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71V321L25JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 1 (Unlimited) | 52 | EAR99 | 70°C | 0°C | 3.3V | 2 | 19mm | RoHS Compliant | Lead Free | No | 52 | PLCC | Parallel | 3.6V | 3V | 16 kb | 19mm | 3.63mm | CMOS | 1 | 100mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 3.3V | 52 | COMMERCIAL | SRAMs | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||
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TC58NYG1S3HBAI6 | Kioxia America, Inc. | 2.4765 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 3 (168 Hours) | 67 | 8mm | RoHS Compliant | 67-VFBGA | 6.5mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 1.8V | YES | 0.8mm | R-PBGA-B67 | 1.7V | 1.95V | 2Gb 256M x 8 | Non-Volatile | 1.7V~1.95V | 256MX8 | 8 | 2147483648 bit | 1.8V | FLASH | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q512JVFIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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EM-10 8GB I-GRADE | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Bulk | EM-10 | Active | Not Applicable | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~105°C | FLASH - NAND (MLC) | 153-BGA (11.5x13) | 8GB | Non-Volatile | 2.7V~3.6V | 52MHz | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1220Y-120+ | Rochester Electronics, LLC | 6.2751 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-DIP Module (0.600, 15.24mm) | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 24-DIP | 120ns | 16Kb 2K x 8 | Non-Volatile | 4.5V~5.5V | NVSRAM | Parallel | 120ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64CVZPJP | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | AEC-Q100 | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 8MX8 | 8 | 67108864 bit | SERIAL | 80MHz | 2.7V | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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709279L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 28.5MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 64kB | RAM, SDR, SRAM | 30b | Synchronous | 0.005A | 16b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
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MTFC2GMTEA-WT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2014 | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 153-WFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | MTFC2G | 16Gb 2G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT52L1G32D4PG-093 WT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 9 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 178-VFBGA | Surface Mount | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | 32Gb 1G x 32 | Volatile | 1.2V | 1067MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT70825L25PF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 80-LQFP | Surface Mount | 0°C~70°C TA | SARAM | IDT70825 | 80-TQFP (14x14) | 25ns | 128Kb 8K x 16 | Volatile | 4.5V~5.5V | RAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q80DVSSIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 5.23mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | 3V | YES | 1.27mm | S-PDSO-G8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | 104MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1230AB-120+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2002 | yes | Active | 1 (Unlimited) | 28 | EAR99 | ROHS3 Compliant | Lead Free | 28 | 28-DIP Module (0.600, 15.24mm) | not_compliant | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8473.30.11.40 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | DS1230AB | 28 | NO | 2.54mm | 4.75V | SRAMs | Not Qualified | 5V | 5.25V | 256Kb 32K x 8 | Non-Volatile | 0.085mA | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 0.0006A | 120 ns | NVSRAM | Parallel | 120ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
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W9812G6KH-5 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 54 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | DUAL | 3.3V | YES | 0.8mm | R-PDSO-G54 | 3V | 3.6V | 4.5ns | 128Mb 8M x 16 | Volatile | 3V~3.6V | 8MX16 | 16 | 134217728 bit | 200MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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93AA46C-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 10.16mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | Serial | No SVHC | 1 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | DUAL | 2.5V | 93AA46C | 8 | 2.54mm | 2/5V | 5.5V | 200 ns | 1Kb 128 x 8 64 x 16 | Non-Volatile | 1.8V~5.5V | 64X16 | 3MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32FVSSIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2012 | SpiFlash® | yes | Obsolete | 3 (168 Hours) | 3A991.B.1.A | ROHS3 Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI | 32 Mb | 2.16mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 20mA | 8 | 85°C | 7 ns | 32Mb 4M x 8 | Non-Volatile | 24b | 2.7V~3.6V | Synchronous | 104MHz | 8b | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1268XV18-600BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 36 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II+ | 1 | 910mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C1268 | 165 | 3-STATE | 50 ns | 36Mb 2M x 18 | Volatile | 20b | 1.7V~1.9V | 18 | Synchronous | 600MHz | 18b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GU6MB12I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 7.5mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B96 | 1.283V | 1.45V | 20ns | 2Gb 128M x 16 | Volatile | 1.283V~1.45V | 128MX16 | 16 | 2147483648 bit | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C024AV-20AXI | Rochester Electronics, LLC | 49.8975 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 100-TQFP (14x14) | 20ns | 64Kb 4K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 20ns |
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MR0A08BCYS35 Everspin Technologies Inc.
Surface Mount 44 Pin Memory IC 1 Mb kb 18.41mm mm 70mA mA 8b b
Price: 0.0000
RFQ -
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S34ML02G200BHB003 Cypress Semiconductor Corp
Automotive, AEC-Q100, ML-2 Memory IC Automotive, AEC-Q100, ML-2 Series 11mm mm
Price: 0.0000
RFQ -
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25LC512-I/SM Microchip Technology
2.5/5V V Surface Mount 8 Pin Memory IC 25LC512 512 kb kb 5.26mm mm 5mA mA
Price: 0.0000
RFQ -
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71V321L25JG8 Integrated Device Technology (IDT)
Surface Mount 52 Pin Memory IC 16 kb kb 19mm mm 100mA mA 8b b
Price: 0.0000
RFQ -
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709279L15PF8 Integrated Device Technology (IDT)
5V V Surface Mount 100 Pin Memory IC 512 kb kb 14mm mm 285mA mA 16b b
Price: 0.0000
RFQ -
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W25Q80DVSSIG Winbond Electronics
3/3.3V V SpiFlash® Memory IC SpiFlash® Series 5.23mm mm
Price: 0.0000
RFQ -
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93AA46C-I/P Microchip Technology
2/5V V Through Hole 8 Pin Memory IC 93AA46C 1 kb kb 10.16mm mm 2mA mA
Price: 0.0000
RFQ -
W25Q32FVSSIG Winbond Electronics
Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 32 Mb kb 20mA mA 8b b
Price: 0.0000
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CY7C1268XV18-600BZXC Cypress Semiconductor Corp
Surface Mount 165 Pin Memory IC CY7C1268 36 Mb kb 910mA mA 18b b
Price: 0.0000
RFQ -
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