Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S29GL128S90DHI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tray | 2015 | GL-S | Active | 3 (168 Hours) | 64 | 3A991.B.1.A | 9mm | ROHS3 Compliant | Copper, Silver, Tin | No | 64 | 64-LBGA | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 60mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 1mm | 2.7V | 3/3.3V | 3.6V | 90ns | 128Mb 8M x 16 | Non-Volatile | 23b | 2.7V~3.6V | 16MX8 | 8 | Asynchronous | 16b | 0.0001A | 16b | 3V | YES | YES | YES | 128 | 32B | YES | YES | FLASH | Parallel | 60ns | 64K | BOTTOM/TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256L20YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2011 | yes | Active | 3 (168 Hours) | 28 | 85°C | -40°C | 5V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 5.5V | 4.5V | 256 kb | 7.6mm | 2.67mm | CMOS | 3.556mm | 1 | e3 | Matte Tin (Sn) | DUAL | J BEND | 260 | 5V | 28 | INDUSTRIAL | YES | SRAMs | 5V | 3-STATE | 20 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R1RW0416DSB-2PR#D1 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | yes | Active | 3 (168 Hours) | 44 | 18.41mm | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1.2mm | 1 | DUAL | 3.3V | 44 | YES | 0.8mm | R-PDSO-G44 | 3V | 3.6V | 4Mb 256K x 16 | Volatile | 3V~3.6V | 256KX16 | 16 | 4194304 bit | 12 ns | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS45S16100H-7BLA1-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 60 | 1 | 10.1mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 6.4mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.65mm | R-PBGA-B60 | 3V | 3.6V | 5.5ns | 16Mb 1M x 16 | Volatile | 3V~3.6V | 1MX16 | 16 | 16777216 bit | 143MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H4M16LFB4-8:H | Micron Technology Inc. | 4.7710 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2007 | yes | Obsolete | 3 (168 Hours) | 54 | EAR99 | 1.8V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 54 | AUTO/SELF REFRESH | 54-VFBGA | 64 Mb | Surface Mount | 0°C~70°C TA | SDRAM - Mobile LPSDR | 1mm | 1 | 50mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT48H4M16 | 54 | 0.8mm | 1.7V | 1.95V | 3-STATE | 6ns | 64Mb 4M x 16 | Volatile | 14b | 1.7V~1.9V | 4MX16 | 16 | 16b | 125MHz | 0.00001A | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S81600E-7TL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | yes | Obsolete | 2 (1 Year) | 54 | EAR99 | 3.3V | 1 | 22.22mm | RoHS Compliant | No | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 128 Mb | 1mm | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | 130mA | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3.3V | 10 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 128Mb 16M x 8 | Volatile | 14b | 3V~3.6V | 16MX8 | 8b | 143MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
R1RW0416DSB-2PI#B0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 12ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62WV25616DBLL-55TLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 44-TSOP II | 55ns | 4Mb 256K x 16 | Volatile | 2.3V~3.6V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25L6456EXCI-10G | Macronix | 0.9803 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2017 | MXSMIO™ | Not For New Designs | 24 | 8mm | Non-RoHS Compliant | Lead Free | CAN BE ORGNISED AS 64 MBIT X 1; 4 X 6 BALL ARRAY | 24-TBGA, CSPBGA | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | 24 | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 16MX4 | 4 | 67108864 bit | SERIAL | 104MHz | 2 | 2.7V | FLASH | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "M28W640HCT70ZB6E") |
M28W640HCT70ZB6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 10.5mm | ROHS3 Compliant | TOP BOOT BLOCK | 48-TFBGA | 6.39mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3V | 30 | M28W640 | 48 | YES | 0.75mm | R-PBGA-B48 | Not Qualified | 3/3.3V | 2.7V | 64Mb 4M x 16 | Non-Volatile | 0.02mA | 2.7V~3.6V | 4MX16 | 16 | 67108864 bit | 0.000005A | 70 ns | NO | NO | YES | 8127 | 4words | YES | FLASH | Parallel | 70ns | 4K32K | TOP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MSM5412222B-25TK-MTL | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 22 Weeks | Tray | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | FRAM (Ferroelectric RAM) | 23ns | 3Mb 256K x 12 | Non-Volatile | 4.5V~5.5V | FRAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA256SC-I/S16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | -40°C~85°C TA | EEPROM | 24AA256 | Die | 900ns | 256Kb 32K x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SM671PXD-AD | Silicon Motion, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FWEIG | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 8 | 85°C | -40°C | 1.8V | RoHS Compliant | No | 8 | SPI, Serial | 1.95V | 1.7V | 128 Mb | 104MHz | CMOS | 1 | 20mA | DUAL | 1.8V | 8 | INDUSTRIAL | 1.27mm | Flash Memories | 7.5 ns | FLASH, NOR | 24b | 1 | Synchronous | 0.00002A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V65803S133PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | BURST COUNTER | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.3mA | 512KX18 | 18 | 9437184 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29C8G96MAZBADKD-5 IT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 2014 | Obsolete | 3 (168 Hours) | 137 | 13mm | ROHS3 Compliant | ALSO ORGANISED AS 128M X 16 | 168-VFBGA | 10.5mm | Surface Mount | -40°C~85°C TA | FLASH - NAND, Mobile LPDRAM | SYNCHRONOUS | 1.1mm | 8542.32.00.71 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | MT29C8G96 | YES | 0.8mm | R-PBGA-B137 | 1.7V | 1.95V | 8Gb 512M x 16 N 4Gb 128M x 32 LPDRAM | Non-Volatile | 1.7V~1.95V | 64MX32 | 32 | 2147483648 bit | 200MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F1G16ABBEAH4-ITX:E TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | 2013 | Active | 3 (168 Hours) | ROHS3 Compliant | 63-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | MT29F1G16 | 1Gb 64M x 16 | Non-Volatile | 1.7V~1.95V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT93C66A-ITR-B | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2010 | Discontinued | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | Serial | unknown | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.1mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 0.65mm | R-PDSO-G8 | 1.8V | 5.5V | 4Kb 512 x 8 256 x 16 | Non-Volatile | 1.8V~5.5V | 256X16 | 16 | 4096 bit | 2MHz | 8 | 10ms | 3-WIRE | EEPROM | SPI | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F8G08ABACAH4-ITS:C | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 3.3V | ROHS3 Compliant | 63-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 63-VFBGA (9x11) | 8Gb 1G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST26WF080BT-104I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2014 | SST26 SQI® | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | SPI | 5mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.8mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 1.8V | 30 | SST26WF080 | YES | 1.27mm | R-PDSO-N8 | 1.65V | 1.95V | TS 16949 | 8Mb 1M x 8 | Non-Volatile | 1.65V~1.95V | 80MX1 | 1 | 83886080 bit | SERIAL | 104MHz | 1.8V | FLASH | SPI - Quad I/O | 1.5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PCA24S08D,112 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2009 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 40 | PCA24S08 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/3.3V | 3.6V | 8Kb 1K x 8 | Non-Volatile | 0.001mA | 2.5V~3.6V | 1KX8 | 8 | 8192 bit | SERIAL | 400kHz | 0.000015A | 10 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | I2C | 10101MMR | EEPROM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25010A-10PU-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 5V | ROHS3 Compliant | Lead Free | No | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, SPI, Serial | 5.5V | 2.7V | 1 kb | 10MHz | Through Hole | -40°C~85°C TA | EEPROM | 10mA | 10MHz | AT25010 | 8-PDIP | 40 ns | 1Kb 128 x 8 | Non-Volatile | 2.7V~5.5V | 20MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7015S25J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 72 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 265mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.015A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CAT24S64C4ATR | ON Semiconductor | 1.1403 |
Min: 1 Mult: 1 |
0.00000000 | download | ACTIVE (Last Updated: 2 months ago) | Tape & Reel (TR) | 2014 | yes | Active | 1 (Unlimited) | 4 | 0.85mm | ROHS3 Compliant | LG-MAX, WD-MAX, ALSO AVAILABLE 1.6-5.5V OPERATES WITH 0.1MHZ AND 0.4MHZ | 0.85mm | CMOS | SYNCHRONOUS | 0.35mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 5V | INDUSTRIAL | YES | 0.4mm | S-PBGA-B4 | 1.7V | 85°C | -40°C | 5.5V | 8KX8 | 8 | 65536 bit | EEPROM | SERIAL | 1MHz | 5ms | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H128M8CF-25E IT:H | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | yes | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 10mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT47H128M8 | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 400ps | 1Gb 128M x 8 | Volatile | 0.21mA | 1.7V~1.9V | 128MX8 | 8 | 1073741824 bit | 400MHz | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C2048-70VI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1998 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 40-TFSOP (0.488, 12.40mm Width) | Surface Mount | -40°C~85°C TC | EPROM - OTP | AT27C2048 | 70ns | 2Mb 128K x 16 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X10CLZPIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | EAR99 | 6mm | ROHS3 Compliant | 8 | 8-WDFN Exposed Pad | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1 | 14mA | 3V | 8 | 1.27mm | 2.7V | 3.6V | 8 ns | 1Mb 128K x 8 | Non-Volatile | 24b | 2.3V~3.6V | 1MX1 | 1 | Synchronous | 104MHz | 3V | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT24C16A-ESR-T | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C | 550ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST26VF064B-104V/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Tube | 2016 | SST26 SQI® | Active | 1 (Unlimited) | 8 | 5.26mm | ROHS3 Compliant | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 64 Mb | 5.25mm | Surface Mount | -40°C~105°C TA | CMOS | SYNCHRONOUS | 2.03mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | SST26VF064 | YES | 1.27mm | 2.7V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 64MX1 | 1 | 104MHz | 3V | 256B | FLASH | SPI - Quad I/O | 1.5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W979H6KBQX2I | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 168 | 85°C | -40°C | 1 | 12mm | RoHS Compliant | 168 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | Parallel | 400MHz | 12mm | CMOS | SYNCHRONOUS | 0.8mm | 1 | BOTTOM | BALL | 1.2V | INDUSTRIAL | YES | 0.5mm | 1.14V | 1.3V | RAM, SDRAM | 32MX16 | 16 | 536870912 bit | FOUR BANK PAGE BURST |
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