Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IDT71V3559SA75BQG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 70°C | 0°C | RoHS Compliant | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V65803S150BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2005 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | BGA | Parallel | 9 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | INDUSTRIAL | YES | SRAMs | 3.465V | 3-STATE | RAM, SRAM | 19b | 0.345mA | 0.06A | 3.8 ns | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3556S133BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | Non-RoHS Compliant | BGA | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | INDUSTRIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.31mA | 128KX36 | 36 | 4718592 bit | 0.045A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3379S4BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | BGA | Parallel | 3.45V | 3.15V | 576 kb | 133MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 460mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 15b | Synchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
7143LA25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | 100 | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 270mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | Not Qualified | 5V | 3-STATE | 25 ns | RAM, SRAM | 22b | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||
 |
71342SA45J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 45 ns | 4kB | RAM, SDR, SRAM | 24b | 4KX8 | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
70V3379S5PRF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE | TQFP | Parallel | 3.45V | 3.15V | 576 kb | 100MHz | 14mm | 1.4mm | CMOS | 1 | 360mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 5 ns | 72kB | RAM, SDR, SRAM | 30b | Synchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
70V3579S5BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 100MHz | 15mm | 1.4mm | CMOS | 1 | 360mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 5 ns | RAM, SRAM | 30b | Synchronous | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
 |
70V18L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 576 kb | 1.4mm | 14mm | 1.4mm | 657.000198mg | CMOS | 235mA | 1 | 235mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | 72kB | RAM, SDR, SRAM | 16b | 64KX9 | Asynchronous | 0.003A | 9b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||
 |
70V9079S6PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 256 kb | 52.6MHz | 14mm | 1.4mm | CMOS | 1 | 395mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 100 | COMMERCIAL | 6 ns | 32kB | RAM, SDR, SRAM | 30b | Synchronous | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V2556SA166BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2011 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 350mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | RAM, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
71V256SA12PZGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 3.3V | 1 | 8mm | RoHS Compliant | Lead Free | No | 28 | TSSOP | Parallel | 3.6V | 3V | 256 kb | 11.8mm | 1mm | CMOS | 1 | 90mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 28 | INDUSTRIAL | 0.55mm | SRAMs | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.002A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||
.png "IDT71T016SA15BF8") |
IDT71T016SA15BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | 3 (168 Hours) | 48 | 3A991.B.2.B | 70°C | 0°C | 7mm | Non-RoHS Compliant | 48 | Parallel | not_compliant | 7mm | CMOS | 1.34mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 48 | COMMERCIAL | YES | 0.75mm | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM - Asynchronous | 0.13mA | 64KX16 | 16 | 0.015A | 15 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70125L55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2005 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 55 ns | RAM, SRAM | 11b | Asynchronous | 0.015A | 9b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||
 |
71V65603S133BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2007 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 9 Mb | 133MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 320mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 18b | 256KX36 | Synchronous | 0.06A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416S12YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | no | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 28.575mm | Non-RoHS Compliant | 44 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 44 | INDUSTRIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.18mA | 256KX16 | 16 | 4194304 bit | 0.02A | 12 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT6116SA35SOI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 1 (Unlimited) | 24 | EAR99 | 85°C | -40°C | 15.4mm | Non-RoHS Compliant | SOIC | Parallel | not_compliant | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 30 | 24 | INDUSTRIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.1mA | 2KX8 | 8 | 16384 bit | 0.002A | 35 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7007S55JI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 68 | EAR99 | 85°C | -40°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 256 kb | 24mm | 3.63mm | CMOS | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 55 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.03A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC32GLTDM-WT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2013 | e•MMC™ | Obsolete | 3 (168 Hours) | 153 | ROHS3 Compliant | 153 | TFBGA | 256 Gb | Surface Mount | -25°C~85°C TA | FLASH - NAND | BOTTOM | MTFC32G | YES | 0.5mm | Other Memory ICs | Not Qualified | 1.8/3.33/3.3V | 2.7V | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CYD02S36V18-167BBC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | 70°C | 0°C | Non-RoHS Compliant | 256 | 256-LBGA | Parallel | 1.9V | 1.7V | 167MHz | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | 167MHz | CYD02S36 | 256-FBGA (17x17) | 4ns | 2Mb 64K x 36 | Volatile | 1.7V~1.9V | 167MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
JS28F320J3F75F | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | StrataFlash™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | JS28F320 | 56-TSOP | 75ns | 32Mb 4M x 8 2M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 75ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST25VF020B-80-4I-SAE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2005 | SST25 | yes | Active | 3 (168 Hours) | 8 | 3A991.B.1.A | 3.3V | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 2 Mb | Surface Mount | -40°C~85°C TA | CMOS | 20mA | e3 | DUAL | 260 | 40 | SST25VF020B | YES | 1.27mm | 6 ns | 2Mb 256K x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 80MHz | 0.00002A | 8b | 100 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 10μs | ||||||||||||||||||||||||||||||||||||||||||||||
 |
6116LA25SOG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | 24-SOIC (0.295, 7.50mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT6116 | 24-SOIC | 25ns | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M95160-DFMC6TG | STMicroelectronics | 0.4627 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | No | 8 | 8-UFDFN Exposed Pad | SPI, Serial | 16 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 0.6mm | 1 | DUAL | 1.8V | M95160 | YES | 0.5mm | 1.7V | 5.5V | 80 ns | 16Kb 2K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 20MHz | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67803S133PFGI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V67803 | 4.2ns | 9Mb 512K x 18 | Volatile | 3.135V~3.465V | 133MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS25LQ010B-JKLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | SPI, Serial | 5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.3V | 3.6V | 1Mb 128K x 8 | Non-Volatile | 2.3V~3.6V | 1MX1 | 1 | 1048576 bit | 104MHz | 3V | FLASH | SPI - Quad I/O | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T3719MS133BBG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Bulk | 2010 | yes | Active | 3 (168 Hours) | 324 | 70°C | 0°C | 2.5V | 2 | 19mm | RoHS Compliant | Lead Free | No | 324 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 2.6V | 2.4V | 18 Mb | 133MHz | 19mm | 1.76mm | CMOS | 1 | 740mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 324 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 2.3MB | RAM, SDR, SRAM | 36b | Synchronous | 72b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
 |
AS6C2016-55ZINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2008 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | unknown | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | NOT SPECIFIED | NOT SPECIFIED | 2Mb 128K x 16 | Volatile | 2.7V~5.5V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7519S133BFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | Active | 4 (72 Hours) | Non-RoHS Compliant | 208-LFBGA | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Synchronous | IDT70V7519 | 208-CABGA (15x15) | 4.2ns | 9Mb 256K x 36 | Volatile | 3.15V~3.45V | 133MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M24C16-FMH6TG | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | Tape & Reel (TR) | Active | 1 (Unlimited) | 5 | EAR99 | 1.7mm | ROHS3 Compliant | No | 5 | ALSO OPERATES AT 100KHZ | 5-UFDFN | 2-Wire, I2C, Serial | 16 kb | 1.4mm | Surface Mount | -40°C~85°C TA | CMOS | 0.6mm | 1 | 1mA | BOTTOM | M24C16 | 0.4mm | 1.7V | 900ns | 16Kb 2K x 8 | Non-Volatile | 1.7V~5.5V | 2KX8 | 8 | 400kHz | I2C | EEPROM | I2C | 5ms |
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71V65803S150BGI Integrated Device Technology (IDT)
119 Pin Memory IC 9 Mb kb 14mm mm
Price: 0.0000
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