Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
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25LC080C-H/SNVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | 4.9mm | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~150°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | DUAL | 2.7V | 25LC080C | YES | 1.27mm | R-PDSO-G8 | 2.5V | 5.5V | AEC-Q100; TS 16949 | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 1KX8 | 8 | 8192 bit | SERIAL | 10MHz | 6ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BR24G256-3 | ROHM Semiconductor | 5.4798 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | Obsolete | 1 (Unlimited) | 8 | ROHS3 Compliant | 2 | SEATED HT-CALCULATED | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 3.7mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | NO | R-PDIP-T8 | 1.6V | Not Qualified | 1.8/5V | 5.5V | 256Kb 32K x 8 | Non-Volatile | 1.6V~5.5V | 8 | 400kHz | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL064N90BFI042 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Surface Mount | Tape & Reel (TR) | 2016 | GL-N | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 8.15mm | ROHS3 Compliant | No | 48 | 48-VFBGA | 64 Mb | 6.15mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1mm | 8542.32.00.51 | 1 | 50mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | 0.8mm | 2.7V | 3/3.3V | 3.6V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 2.7V~3.6V | 4MX16 | 16 | Asynchronous | 0.000005A | 90 ns | 8 | 3V | YES | YES | YES | 8127 | 8/16words | YES | YES | FLASH | Parallel | 90ns | 8K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT28HC256-12JC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | 0°C~70°C TC | EEPROM | AT28HC256 | 32-PLCC (13.97x11.43) | 120ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT45DB081B-CNC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2003 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 8-VDFN | Surface Mount | -40°C~85°C TC | FLASH | AT45DB081 | 8-CASON (6x8) | 8Mb 264Bytes x 4096 pages | Non-Volatile | 2.7V~3.6V | 20MHz | FLASH | SPI | 14ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA16-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1 MILLION ERASE/WRITE CYCLES | 8-TSSOP (0.173, 4.40mm Width) | I2C, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 24AA16 | 8 | 0.65mm | 1.7V | 2/5V | 5.5V | 900ns | 16Kb 2K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24C1024BW-SH-B | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 1997 | Obsolete | 1 (Unlimited) | SMD/SMT | 85°C | -40°C | 3.3V | 5.35mm | ROHS3 Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | 2-Wire, I2C, Serial | 3.6V | No SVHC | 1.8V | 1 Mb | 400kHz | 1.91mm | 5.4mm | Surface Mount | -40°C~85°C TA | EEPROM | 3mA | 400kHz | AT24C1024 | 8-SOIC | 550ns | 1Mb 128K x 8 | Non-Volatile | 1.8V~3.6V | 1MHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V07S25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 170mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.006A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL128P0XNFI003 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tape & Reel (TR) | 2013 | FL-P | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | ROHS3 Compliant | No | 8 | 8-WDFN Exposed Pad | SPI, Serial | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1 | 22mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 1.27mm | 2.7V | 3/3.3V | 3.6V | 8 ns | 128Mb 16M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 104MHz | 0.00002A | 1b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT6116LA20TP | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 24 | EAR99 | 70°C | 0°C | 1 | 31.75mm | Non-RoHS Compliant | DIP | Parallel | not_compliant | 7.62mm | CMOS | 4.191mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | THROUGH-HOLE | 225 | 5V | 30 | 24 | COMMERCIAL | NO | 2.54mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.12mA | 2KX8 | 8 | 16384 bit | 0.00002A | 19 ns | YES | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX69GL642EEXGI-70G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | Active | 56 | 9mm | RoHS Compliant | IT IS ALSO HAVING 2M X 16BIT PSRAM | 7mm | CMOS | ASYNCHRONOUS | 1.2mm | 8542.32.00.71 | 1 | BOTTOM | BALL | 260 | 3V | 40 | INDUSTRIAL | YES | 0.8mm | R-PBGA-B56 | 2.7V | 85°C | -40°C | 3.6V | 4MX16 | 16 | 67108864 bit | MEMORY CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W988D2FBJX7E | Winbond Electronics | 6.8722 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-TFBGA | 8mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | SYNCHRONOUS | 1.025mm | 8542.32.00.24 | 1 | BOTTOM | 1.8V | 90 | YES | 0.8mm | R-PBGA-B90 | 1.7V | Not Qualified | 1.8V | 1.95V | 5.4ns | 256Mb 8M x 32 | Volatile | 0.07mA | 1.7V~1.95V | 8MX32 | 32 | 268435456 bit | 133MHz | 0.00001A | 16 | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GG8NB11I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 2Gb 256M x 8 | Volatile | 1.425V~1.575V | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q512JVEIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16DVUUIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 8-UDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85RC128APNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tape & Reel (TR) | 2015 | Not For New Designs | 1 (Unlimited) | 85°C | -40°C | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 1MHz | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 128Kb 16K x 8 | Non-Volatile | 3V~3.6V | 1MHz | FRAM | I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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93LC76C-I/W15K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | 85°C | -40°C | ROHS3 Compliant | No | Die | Serial | 5.5V | 2.5V | 8 kb | 2MHz | Surface Mount | -40°C~85°C TA | EEPROM | 3mA | 2MHz | 93LC76C | Die | 300 ns | 8Kb 1K x 8 512 x 16 | Non-Volatile | 2.5V~5.5V | 3MHz | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71256S70DB | Renesas Electronics America Inc. | 198.8827 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tube | Active | 1 (Unlimited) | Non-RoHS Compliant | 28-CDIP (0.600, 15.24mm) | Through Hole | -55°C~125°C TA | SRAM - Asynchronous | 28-CerDip | 70ns | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7006L55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | CMOS | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F4G08ABBDAHC:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2012 | yes | Obsolete | 3 (168 Hours) | 63 | 1.8V | 13mm | ROHS3 Compliant | Copper, Silver, Tin | No | 63 | 63-VFBGA | 4 Gb | Surface Mount | 0°C~70°C TA | FLASH - NAND | 1mm | 1 | 20mA | BOTTOM | 260 | 1.8V | 30 | 0.8mm | 1.7V | 1.95V | 25 ns | 4Gb 512M x 8 | Non-Volatile | 30b | 1.7V~1.95V | 512MX8 | 8 | Asynchronous | 0.00005A | 8b | NO | NO | YES | 4K | 2kB | YES | FLASH | Parallel | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML04G100BHB000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 14 Weeks | Tray | 2009 | ML-1 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63 | 63-VFBGA | 9mm | Surface Mount | -40°C~105°C TA | FLASH - NAND | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | 2.7V | 3.6V | AEC-Q100 | 4Gb 512M x 8 | Non-Volatile | 2.7V~3.6V | 512MX8 | 8 | 4294967296 bit | 3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT53D4DAKA-DC TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | SDRAM - Mobile LPDDR4 | Volatile | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q256FVFJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~105°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W971GG6SB25I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 84 | 1.8V | 1 | 12.5mm | ROHS3 Compliant | 84 | AUTO/SELF REFRESH | 84-TFBGA | 1 Gb | Surface Mount | -40°C~95°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.8mm | 1.7V | 1.9V | 400ps | 1Gb 64M x 16 | Volatile | 13b | 1.7V~1.9V | 64MX16 | 16 | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GG8KB-11 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 20ns | 2Gb 256M x 8 | Volatile | 1.425V~1.575V | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V05L20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2006 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 3.6V | 3V | 64 kb | 24mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | YES | SRAMs | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM | 26b | 0.175mA | 8KX8 | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7026L25J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 84-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7026 | 84-PLCC (29.21x29.21) | 25ns | 256Kb 16K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS3030W-100# | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Obsolete | 5 (48 Hours) | 256 | EAR99 | 27mm | ROHS3 Compliant | Lead Free | 256 | 256-BGA | not_compliant | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8.72mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | BOTTOM | 225 | 3.3V | NOT SPECIFIED | DS3030W | 256 | YES | 1.27mm | 3V | Not Qualified | 3.6V | 256Kb 32K x 8 | Non-Volatile | 3V~3.6V | 32KX8 | 8 | 262144 bit | 8b | 100 ns | NVSRAM | Parallel | 100ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64CVZPJG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | AEC-Q100 | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 8MX8 | 8 | 67108864 bit | SERIAL | 80MHz | 2.7V | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FVPIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms |
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25LC080C-H/SNVAO Microchip Technology
Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series 25LC080C 4.9mm mm
Price: 0.0000
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S29GL064N90BFI042 Cypress Semiconductor Corp
3/3.3V V Surface Mount GL-N Memory IC GL-N Series 64 Mb kb 8.15mm mm 50mA mA
Price: 0.0000
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24AA16-I/ST Microchip Technology
2/5V V Surface Mount 8 Pin Memory IC 24AA16 16 kb kb 4.4mm mm 3mA mA
Price: 0.0000
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AT24C1024BW-SH-B Microchip Technology
Surface Mount Memory IC AT24C1024 1 Mb kb 5.35mm mm 3mA mA
Price: 0.0000
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70V07S25PF Integrated Device Technology (IDT)
Surface Mount 80 Pin Memory IC 256 kb kb 14mm mm 170mA mA 8b b
Price: 0.0000
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S25FL128P0XNFI003 Cypress Semiconductor Corp
3/3.3V V Surface Mount FL-P Memory IC FL-P Series 128 Mb kb 22mA mA 1b b
Price: 0.0000
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7006L55J8 Integrated Device Technology (IDT)
5V V Surface Mount 68 Pin Memory IC 128 kb kb 24mm mm 210mA mA 8b b
Price: 0.0000
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MT29F4G08ABBDAHC:D Micron Technology Inc.
Surface Mount Memory IC 4 Gb kb 13mm mm 20mA mA 8b b
Price: 0.0000
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