Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Max Power Dissipation | Voltage | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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N25Q128A21BF840E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2013 | Obsolete | 3 (168 Hours) | 8 | 1.8V | ROHS3 Compliant | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 20mA | DUAL | 1.8V | N25Q128A21 | 1.27mm | 7 ns | 128Mb 32M x 4 | Non-Volatile | 1b | 1.7V~2V | 8 | Synchronous | 108MHz | 0.00001A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | FLASH | SPI | 8ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C66AT-I/OT | Microchip Technology | 0.2768 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2002 | yes | Active | 1 (Unlimited) | 6 | 5V | 2.95mm | ROHS3 Compliant | Lead Free | No | 6 | SOT-23-6 | Serial | 4 kb | Surface Mount | -40°C~85°C TA | CMOS | 1.45mm | 1 | 2mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 93C66A | 6 | 0.95mm | 5V | 250 ns | 4Kb 512 x 8 | Non-Volatile | 4.5V~5.5V | 512X8 | 8 | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1570KV18-400BZXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 72 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, DDR II+ | 1 | 750mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 20 | CY7C1570 | 165 | 3-STATE | 450 ps | 72Mb 2M x 36 | Volatile | 20b | 1.7V~1.9V | 2MX36 | 36 | Synchronous | 400MHz | 0.32A | 36b | COMMON | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H8M32LFB5-75 AT:H | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2010 | Obsolete | 3 (168 Hours) | 90 | ROHS3 Compliant | 90-VFBGA | Surface Mount | -40°C~105°C TA | SDRAM - Mobile LPSDR | BOTTOM | 1.8V | MT48H8M32 | YES | 0.8mm | R-PBGA-B90 | Not Qualified | 1.8V | 5.4ns | 256Mb 8M x 32 | Volatile | 0.085mA | 1.7V~1.95V | 8MX32 | 32 | 268435456 bit | 133MHz | 0.00001A | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28EW128ABA1LJS-0SIT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 56-TSOP | 95ns | 128Mb 16M x 8 8M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "S25FL512SAGBAEA13") |
S25FL512SAGBAEA13 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | FL-S | Active | 3 (168 Hours) | Non-RoHS Compliant | 24-TBGA | Surface Mount | -55°C~125°C TA | FLASH - NOR | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | 3V | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL256P90TFCR20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Surface Mount | Tray | 2012 | GL-P | Active | 3 (168 Hours) | 56 | 18.4mm | ROHS3 Compliant | Tin | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | 256 Mb | Surface Mount | 0°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 110mA | e3 | DUAL | 260 | 3.3V | 40 | 0.5mm | 3V | 3.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 3V~3.6V | 1 | Asynchronous | 8b | 0.000005A | 90 ns | 8 | 3V | YES | YES | YES | 256 | 8/16words | YES | YES | FLASH | Parallel | 90ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC21A-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2003 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 9.27mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 2-WIRE SERIAL INTERFACE | 8-DIP (0.300, 7.62mm) | I2C, Serial | 1 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 5.33mm | 1 | 3mA | e3 | DUAL | 3V | 24LC21A | 8 | 2.54mm | 2.5V | 3/5V | 5.5V | 900ns | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.00003A | 200 | 1000000 Write/Erase Cycles | 10ms | I2C | 1010000R | EEPROM | I2C | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9279S9PRF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 512 kb | 40MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 9 ns | 64kB | RAM, SDR, SRAM | 15b | Synchronous | 0.005A | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F2T08CQHBBG2-3RES:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | Surface Mount | 0°C~70°C TA | FLASH - NAND | 272-TBGA (14x18) | 2Tb 256G x 8 | Non-Volatile | 2.5V~3.6V | 333MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY14B104N-BA45XI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tube | 2007 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.2.A | 3.3V | 10mm | ROHS3 Compliant | Lead Free | 48 | 48-TFBGA | unknown | 4 Mb | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | 52mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 20 | CY14B104 | 48 | 0.75mm | 2.7V | SRAMs | Not Qualified | 3.6V | 4Mb 256K x 16 | Non-Volatile | 2.7V~3.6V | 256KX16 | 16 | 16b | 0.005A | 45 ns | 16b | NVSRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY7C1513KV18-333BZC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 165-FBGA (13x15) | 72Mb 4M x 18 | Volatile | 1.7V~1.9V | 333MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24L16FVJ-WE2 | ROHM Semiconductor | 4.0882 |
Min: 1 Mult: 1 |
0.00000000 | 9 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Copper, Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 2-Wire, I2C, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 2mA | e2 | TIN COPPER | DUAL | 260 | 2.5V | 10 | 8 | 0.65mm | 1.7V | 2/5V | 5.5V | 900 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P72604S167BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2006 | 85°C | -40°C | Non-RoHS Compliant | 165 | Parallel | 167MHz | QDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416L12Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | no | 3 (168 Hours) | 44 | 3A991.B.2.A | 70°C | 0°C | 28.575mm | Non-RoHS Compliant | 44 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 44 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.17mA | 256KX16 | 16 | 4194304 bit | 0.01A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C64E-20SI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 28-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TC | EEPROM | AT28C64 | 28-SOIC | 200ns | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 200μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT47H256M4SH-25E:M TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 60-TFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | 400ps | 1Gb 256M x 4 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24T256FV-WE2 | ROHM Semiconductor | 0.8305 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | yes | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Copper, Tin | 8 | SEATED HT-CALCULATED | 8-LSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 256 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.35mm | 1 | e3 | MATTE TIN | DUAL | 225 | NOT SPECIFIED | BR24T256 | 0.65mm | 1.6V | Not Qualified | 5.5V | 900 ns | 256Kb 32K x 8 | Non-Volatile | 0.0025mA | 1.6V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C040-20LI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 44-CLCC | Surface Mount | -40°C~85°C TC | EEPROM | AT28C040 | 44-CLCC (16.55x16.55) | 200ns | 4Mb 512K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS7C3256A-15JIN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tube | 2001 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 3.3V | 1 | ROHS3 Compliant | Lead Free | No | 28 | 28-BSOJ (0.300, 7.62mm Width) | 256 kb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 3.7592mm | 1 | e3/e6 | MATTE TIN/TIN BISMUTH | DUAL | 245 | 3.3V | 40 | 28 | YES | 3V | 3.6V | 3-STATE | 256Kb 32K x 8 | Volatile | 15b | 0.04mA | 3V~3.6V | 32KX8 | 8 | 0.002A | COMMON | 3V | SRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS1230ABP-70+ | Maxim Integrated | 24.6933 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2002 | yes | Active | 1 (Unlimited) | 34 | EAR99 | 5V | 25.019mm | ROHS3 Compliant | No | 34 | 34-PowerCap™ Module | 256 kb | Surface Mount | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 85mA | 6.85mm | 8473.30.11.40 | 1 | e3 | MATTE TIN | DUAL | 245 | 5V | 40 | DS1230AB | 34 | YES | 1.27mm | SRAMs | 5V | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 8b | 0.0006A | 70 ns | NVSRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9359L7PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 144 kb | 45.45MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 330mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 18 ns | RAM, SRAM | 26b | 8KX18 | Synchronous | 0.003A | 18b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA183BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 183MHz | 22mm | 2.15mm | CMOS | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.3 ns | RAM, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
JS28F512P33BFD | Micron Technology Inc. | 51.7051 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2013 | Axcell™ | yes | Obsolete | 3 (168 Hours) | 56 | 18.4mm | ROHS3 Compliant | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | Parallel, Serial | 512 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 1 | 31mA | e3 | MATTE TIN | DUAL | 260 | 3V | 30 | 28F512P33 | 56 | YES | 0.5mm | 2.3V | 512Mb 32M x 16 | Non-Volatile | 25b | 2.3V~3.6V | 32MX16 | 16 | Asynchronous | 40MHz | 105 ns | 16b | FLASH | Parallel | 105ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R1LV0108ESA-7SI#S0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | 2011 | yes | Active | 1 (Unlimited) | 32 | EAR99 | 3V | 1 | ROHS3 Compliant | No | 32-TFSOP (0.465, 11.80mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1 | DUAL | 3V | R1LV0108E | 32 | YES | 0.5mm | R-PDSO-G32 | 2.7V | 3.6V | 3-STATE | 1Mb 128K x 8 | Volatile | 17b | 0.025mA | 2.7V~3.6V | 8 | 0.000002A | 70 ns | COMMON | 2V | SRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V546XS133PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 70°C | 0°C | Non-RoHS Compliant | LQFP | Parallel | 133MHz | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR25H256CDF | Everspin Technologies Inc. | 1.7643 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2013 | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 256 kb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 0.9mm | 1 | 27mA | DUAL | 3V | 1.27mm | 2.7V | 3.6V | 600mW | 10 ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 8b | 40MHz | 8b | RAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C4M32SA-6TCN | Alliance Memory, Inc. | 3.7809 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2015 | yes | Active | 3 (168 Hours) | 86 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 86-TFSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.5mm | R-PDSO-G86 | 3V | 3.6V | 5.4ns | 128Mb 4M x 32 | Volatile | 3V~3.6V | 4MX32 | 32 | 134217728 bit | 166MHz | DRAM | Parallel | 2ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CG8105AA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C080-90PC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-DIP (0.600, 15.24mm) | Through Hole | 0°C~70°C TC | EPROM - OTP | AT27C080 | 32-PDIP | 90ns | 8Mb 1M x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel |
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N25Q128A21BF840E Micron Technology Inc.
Surface Mount Memory IC N25Q128A21 128 Mb kb 20mA mA 8b b
Price: 0.0000
RFQ -
93C66AT-I/OT Microchip Technology
5V V Surface Mount 6 Pin Memory IC 93C66A 4 kb kb 2.95mm mm 2mA mA
Price: 0.2768
RFQ -
CY7C1570KV18-400BZXI Cypress Semiconductor Corp
Surface Mount 165 Pin Memory IC CY7C1570 72 Mb kb 750mA mA 36b b
Price: 0.0000
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S29GL256P90TFCR20 Cypress Semiconductor Corp
3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 18.4mm mm 110mA mA
Price: 0.0000
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24LC21A-I/P Microchip Technology
3/5V V Through Hole 8 Pin Memory IC 24LC21A 1 kb kb 9.27mm mm 3mA mA
Price: 0.0000
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70V9279S9PRF8 Integrated Device Technology (IDT)
Surface Mount 128 Pin Memory IC 512 kb kb 20mm mm 260mA mA 16b b
Price: 0.0000
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CY14B104N-BA45XI Cypress Semiconductor Corp
Surface Mount 48 Pin Memory IC CY14B104 4 Mb kb 10mm mm 52mA mA 16b b
Price: 0.0000
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BR24L16FVJ-WE2 ROHM Semiconductor
2/5V V Surface Mount 8 Pin Memory IC 16 kb kb 3mm mm 2mA mA
Price: 4.0882
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IDT71V416L12Y Integrated Device Technology (IDT)
3.3V V 44 Pin Memory IC 28.575mm mm
Price: 0.0000
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BR24T256FV-WE2 ROHM Semiconductor
Surface Mount Memory IC BR24T256 256 kb kb 4.4mm mm
Price: 0.8305
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DS1230ABP-70+ Maxim Integrated
5V V 34 Pin Memory IC DS1230AB 256 kb kb 25.019mm mm
Price: 24.6933
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70V9359L7PFI8 Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 144 kb kb 14mm mm 330mA mA 18b b
Price: 0.0000
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71V35761SA183BGGI8 Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 4.5 Mb kb 14mm mm 350mA mA 36b b
Price: 0.0000
RFQ -
JS28F512P33BFD Micron Technology Inc.
Axcell™ 56 Pin Memory IC Axcell™ Series 28F512P33 512 Mb kb 18.4mm mm 31mA mA 16b b
Price: 51.7051
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MR25H256CDF Everspin Technologies Inc.
Surface Mount Memory IC 256 kb kb 6mm mm 27mA mA 8b b
Price: 1.7643
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