Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Number of Sectors/Size | Page Size | Serial Bus Type | I2C Control Byte | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S25FL256LDPNFN010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | FL-L | Active | 3 (168 Hours) | 8 | 8mm | ROHS3 Compliant | IT ALSO HAVE MEMORY WIDTH X 1 | 8-WDFN Exposed Pad | 6mm | Surface Mount | -40°C~125°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 64MX4 | 4 | 268435456 bit | SERIAL | 66MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25U1635EZNI-10G | Macronix | 1.1638 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2013 | MX25xxx35/36 - MXSMIO™ | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 2V | 6mm | ROHS3 Compliant | Lead Free | ALSO CONFIGURABLE AS 16M X 1 | 8-WDFN Exposed Pad | SPI, Serial | 16 Mb | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 8 | YES | 1.27mm | R-PDSO-N8 | 1.65V | Not Qualified | 1.8V | 2V | 16Mb 2M x 8 | Non-Volatile | 0.025mA | 1.65V~2V | 4MX4 | 4 | 104MHz | 0.00002A | 2 | 10 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | FLASH | SPI | 30μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||
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MT28F640J3RG-115 GMET | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2005 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 56-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH | MT28F640J3 | 56-TSOP I | 115ns | 64Mb 8M x 8 4M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C2M32SA-6TIN | Alliance Memory, Inc. | 4.0142 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2013 | yes | Active | 3 (168 Hours) | 86 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | Lead Free | AUTO/SELF REFRESH | 86-TFSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.5mm | R-PDSO-G86 | 3V | 3.6V | 5.5ns | 64Mb 2M x 32 | Volatile | 3V~3.6V | 2MX32 | 32 | 67108864 bit | 166MHz | DRAM | Parallel | 2ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7014S15J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | LOW POWER STANDBY MODE; BATTERY BACK-UP | PLCC | Parallel | 5.5V | 4.5V | 36 kb | 19mm | 3.63mm | CMOS | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 15 ns | 4.5kB | RAM, SDR, SRAM | 24b | 4KX9 | Asynchronous | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V124SA20Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 32 | 3A991.B.2.B | 70°C | 0°C | 20.955mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 32 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.095mA | 128KX8 | 8 | 1048576 bit | 0.01A | 20 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "7024S55GB") |
7024S55GB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Bulk | 2000 | no | Active | 1 (Unlimited) | 84 | 125°C | -55°C | 5V | 2 | 27.94mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | Parallel | 5.5V | 4.5V | 64 kb | 27.94mm | 3.68mm | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 20 | 84 | MILITARY | NO | SRAMs | 5V | 3-STATE | 55 ns | 38535Q/M;38534H;883B | 8kB | RAM, SDR, SRAM | 24b | 0.3mA | 4KX16 | 0.03A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7133SA35PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 35 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 16b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416L10PHGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tape & Reel | 2005 | yes | Active | 3 (168 Hours) | 44 | 85°C | -40°C | 3.3V | 1 | 18.41mm | RoHS Compliant | Lead Free | No | 44 | TSOP | Parallel | 3.6V | 3V | 4 Mb | 10.16mm | 1mm | CMOS | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 44 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 10 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | Asynchronous | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC16M16A2B4-6A AAT:G TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2014 | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 54-VFBGA | Surface Mount | -40°C~105°C TA | SDRAM | MT48LC16M16A2 | 5.4ns | 256Mb 16M x 16 | Volatile | 3V~3.6V | 167MHz | DRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT48V8M16LFF4-8 IT:G TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 54-VFBGA | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPSDR | MT48V8M16 | 7ns | 128Mb 8M x 16 | Volatile | 2.3V~2.7V | 125MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93AA76BT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 40 | 93AA76B | 8 | 0.65mm | 5.5V | 8Kb 512 x 16 | Non-Volatile | 1.8V~5.5V | 512X16 | 16 | 3MHz | 8 | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
47L04T-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | IT ALSO HAS EEPROM BACKUP OF 512 X 8 BITS | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | EEPROM, SRAM | SYNCHRONOUS | 1.75mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | 47L04 | YES | 1.27mm | R-PDSO-G8 | 2.7V | 3.6V | 400ns | TS 16949 | 4Kb 512 x 8 | Non-Volatile | 2.7V~3.6V | 512X8 | 8 | 4096 bit | 1MHz | EERAM | I2C | 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S34SL02G200BHV003 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M28W160FST70ZA6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | M28W160 | 70ns | 16Mb 1M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3577SA80BQG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 8ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53D1024M32D4DT-046 AUT:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | 200-VFBGA | Surface Mount | -40°C~125°C TC | SDRAM - Mobile LPDDR4 | 32Gb 1G x 32 | Volatile | 1.1V | 2133MHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7164S20DB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2007 | no | Active | 1 (Unlimited) | 28 | 125°C | -55°C | 5V | 1 | 37.2mm | RoHS Compliant | Contains Lead | No | 28 | CDIP | Parallel | 64 kb | 15.24mm | 1.65mm | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 240 | 5V | 28 | MILITARY | NO | 2.54mm | SRAMs | 5V | 3-STATE | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 13b | 8KX8 | 0.02A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G64FVT-3GE2 | ROHM Semiconductor | 1.8067 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 64 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | BR24G64 | 0.65mm | 1.6V | 5.5V | 900 ns | 64Kb 8K x 8 | Non-Volatile | 1.6V~5.5V | 8 | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43TR16256AL-107MBLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tray | Active | 3 (168 Hours) | 96 | 1 | 13mm | ROHS3 Compliant | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 96-TFBGA | 9mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B96 | 1.283V | 1.45V | 20ns | 4Gb 256M x 16 | Volatile | 1.283V~1.45V | 256MX16 | 16 | 4294967296 bit | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C08AN-10SU-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | Obsolete | 1 (Unlimited) | 8 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, Serial | 8 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | 3mA | e3 | MATTE TIN | DUAL | 260 | 5V | 40 | AT24C08 | 1.27mm | 2.7V | Not Qualified | 4.5μs | 8Kb 1K x 8 | Non-Volatile | 2.7V~5.5V | 8 | 400kHz | 0.000004A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416L10PH8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT71V416 | 44-TSOP II | 10ns | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1041CV33-15ZXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 44 | 18.415mm | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | unknown | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 1.194mm | 1 | e3 | TIN | DUAL | 260 | 3.3V | 20 | 44 | YES | 0.8mm | R-PDSO-G44 | 3V | COMMERCIAL | 3.6V | 4Mb 256K x 16 | Volatile | 3V~3.6V | 256KX16 | 16 | 4194304 bit | 15 ns | SRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
N25Q032A13ESE40F | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2011 | yes | Not For New Designs | 3 (168 Hours) | 8 | 5.49mm | ROHS3 Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 32 Mb | 1.91mm | 5.49mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1 | 20mA | DUAL | 260 | 3V | 30 | YES | 1.27mm | 3/3.3V | 2.7V | 7 ns | 32Mb 8M x 4 | Non-Volatile | 22b | 2.7V~3.6V | 32MX1 | Synchronous | 108MHz | 0.0001A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | FLASH | SPI | 8ms, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761S200BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel | 2009 | yes | Discontinued | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 200MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 360mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.1 ns | RAM, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71016S12YI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | no | 3 (168 Hours) | 44 | 3A991.B.2.B | 85°C | -40°C | 28.575mm | Non-RoHS Compliant | 44 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 44 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.21mA | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61WV204816ALL-10BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 48 | 8mm | ROHS3 Compliant | 48-TFBGA | 6mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.75mm | R-PBGA-B48 | 1.65V | 2.2V | 32Mb 2M x 16 | Volatile | 1.65V~2.2V | 2MX16 | 16 | 33554432 bit | 10 ns | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V124SA12TYG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 32 | 70°C | 0°C | 3.3V | 1 | 21.95mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3V | 1 Mb | 7.6mm | 2.67mm | CMOS | 3.7592mm | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S166PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 166MHz | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 30 | 100 | INDUSTRIAL | YES | 0.65mm | SRAMs | 3-STATE | 3.5 ns | 166MHz | 2.3MB | RAM, SDR, SRAM | 20b | 0.265mA | 0.06A | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
RC28F256P33BFA | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | Axcell™ | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | Non-RoHS Compliant | 64 | 64-TBGA | Parallel, Serial | not_compliant | 256 Mb | Surface Mount | -40°C~85°C TC | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 31mA | e0 | TIN LEAD SILVER | BOTTOM | 235 | 3V | 30 | 28F256P33 | 64 | YES | 1mm | Not Qualified | 2.5/3.3V | 2.3V | 256Mb 16M x 16 | Non-Volatile | 24b | 2.3V~3.6V | 16MX16 | 16 | Asynchronous | 52MHz | 0.00021A | 95 ns | 16b | NO | NO | 4255 | FLASH | Parallel | 95ns | BOTTOM |
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