Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Refresh Cycles | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MT25QU256ABA8E12-1SIT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 1.7V~2V | 133MHz | FLASH | SPI | 8ms, 2.8ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SFEM008GB1EA1TO-I-GE-111-STD | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | 2016 | EM-20 | Active | 3 (168 Hours) | 153 | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (MLC) | SYNCHRONOUS | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | R-PBGA-B153 | 2.7V | 3.6V | 64Gb 8G x 8 | Non-Volatile | 2.7V~3.6V | 8GX8 | 8 | 68719476736 bit | 200MHz | 2.7V | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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RMLV0416EGSB-4S2#AA1 | Renesas Electronics America | 3.7769 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tube | yes | Active | 3 (168 Hours) | 44 | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 44 | YES | R-PDSO-G44 | 2.7V | 3.6V | 4Mb 256K x 16 | Volatile | 2.7V~3.6V | 256KX16 | 16 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "FM24C04B-G2") |
FM24C04B-G2 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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RMLV3216AGSD-5S2#HA0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 52-TFSOP (0.350, 8.89mm Width) | Surface Mount | -40°C~85°C TA | 52 | 32Mb 4M x 8 2M x 16 | Volatile | 2.7V~3.6V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G32NUX-3ATTR | ROHM Semiconductor | 2.6146 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2014 | Active | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | Tin | 8-UFDFN Exposed Pad | 2-Wire, I2C, Serial | 32 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.6mm | 8542.32.00.51 | 1 | e3 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G32 | 0.5mm | R-PDSO-N8 | 1.6V | Not Qualified | 1.8/5V | 5.5V | 450 ns | 32Kb 4K x 8 | Non-Volatile | 0.0025mA | 1.7V~5.5V | 4KX8 | 8 | 1MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||
 |
NM93CS46LM8 | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | 0°C~70°C TA | NM93CS46 | 1Kb 64 x 16 | Non-Volatile | 2.7V~5.5V | 250kHz | EEPROM | SPI | 15ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BR93G86FJ-3AGTE2 | ROHM Semiconductor | 0.9254 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | CMOS | DUAL | YES | 1.27mm | R-PDSO-G8 | Not Qualified | 1.8/5V | 16Kb 1K x 16 | Non-Volatile | 0.003mA | 1.7V~5.5V | 1KX16 | 16 | 16384 bit | SERIAL | 3MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 3-WIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128JVFIM TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVSSJF TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~105°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q256FVFIQ | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FVAIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CAT24M01YI-GT3JN | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | 2012 | Active | 1 (Unlimited) | ROHS3 Compliant | Gold, Nickel | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | Surface Mount | -40°C~85°C TA | 400ns | 1Mb 128K x 8 | Non-Volatile | 1.8V~5.5V | 1MHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M25P10-AVMP6TG TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-VDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | M25P10 | 1Mb 128K x 8 | Non-Volatile | 2.3V~3.6V | 50MHz | FLASH | SPI | 15ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W971GG8KB-25 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 400ps | 1Gb 128M x 8 | Volatile | 0.185mA | 1.7V~1.9V | 128MX8 | 8 | 1073741824 bit | 200MHz | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||
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MT29F2G08ABAGAWP-IT:G TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NAND | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BR25H080FJ-2CE2 | ROHM Semiconductor | 0.5102 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED | 8-SOIC (0.154, 3.90mm Width) | Unknown | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | 4.5V | Not Qualified | 3/5V | 5.5V | 8Kb 1K x 8 | Non-Volatile | 0.004mA | 2.5V~5.5V | 8 | SERIAL | 10MHz | 100 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 4ms | SPI | EEPROM | SPI | 4ms | ||||||||||||||||||||||||||||||||||||||||||||||||
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IS61DDB24M18A-300B4LI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, DDR II | 1.4mm | 8542.32.00.41 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 165 | YES | 1mm | 1.71V | 1.89V | 450 ps | 72Mb 4M x 18 | Volatile | 1.71V~1.89V | 4MX18 | 18 | 75497472 bit | 300MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD5F1GQ4UEYIGY | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL512T11FAIV20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | GL-T | Active | 3 (168 Hours) | 64 | 13mm | Non-RoHS Compliant | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | 3V | YES | 1mm | R-PBGA-B64 | 2.7V | 3.6V | 110ns | 512Mb 64M x 8 | Non-Volatile | 1.65V~3.6V | 32MX16 | 16 | 536870912 bit | 8 | 2.7V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT28HC64B-70SC | Microchip | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 70°C | 0°C | 5V | Non-RoHS Compliant | Contains Lead | 28 | SOIC | Parallel, SPI | 5.5V | 4.5V | 64 kb | 70GHz | 40mA | 55 ns | 1kB | EEPROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42S32800J-75ETLI | ISSI, Integrated Silicon Solution Inc | 9.8259 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tube | yes | Active | 3 (168 Hours) | 86 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | 86 | AUTO/SELF REFRESH | 86-TFSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3.3V | 10 | YES | 0.5mm | 3V | 3.6V | 6ns | 256Mb 8M x 32 | Volatile | 3V~3.6V | 8MX32 | 32 | 268435456 bit | 133MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V7339S133BCI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 9 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 675mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 25 ns | 1.1MB | RAM, SDR, SRAM | 38b | Synchronous | 0.04A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
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IS29GL256S-10DHV020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | GL-S | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-FBGA (9x9) | 100ns | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL132K0XBHI033 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2013 | FL1-K | Obsolete | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | No | 24 | ALSO CONFIGURABLE AS 32M X 1 | 24-TBGA | SPI, Serial | 32 Mb | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 3V | YES | 1mm | 2.7V | 3/3.3V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 8MX4 | 4 | 108MHz | 0.000005A | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||
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IS25WP016D-JMLE | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | Not For New Designs | 3 (168 Hours) | 16 | 10.31mm | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | 7.49mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G16 | 1.65V | 1.95V | 16Mb 2M x 8 | Non-Volatile | 1.65V~1.95V | 2MX8 | 8 | 16777216 bit | SERIAL | 133MHz | 1.8V | FLASH | SPI - Quad I/O, QPI, DTR | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43DR86400C-3DBLI | ISSI, Integrated Silicon Solution Inc | 7.9251 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 60 | 1.8V | 1 | 10.5mm | ROHS3 Compliant | No | 60 | AUTO/SELF REFRESH | 60-TFBGA | 512 Mb | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | 120mA | 1.2mm | 1 | 250mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 1.8V | 0.8mm | 1.7V | 1.9V | 3-STATE | 450ps | 512Mb 64M x 8 | Volatile | 16b | 1.7V~1.9V | 64MX8 | 8 | 8b | 333MHz | 0.011A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||
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S99AL016J0017 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FVFIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL128S10TFIV20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tray | 2015 | GL-S | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | Lead Free | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | Parallel | 3.6V | 2.7V | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 60mA | 56-TSOP | 100ns | 128Mb 8M x 16 | Non-Volatile | 23b | 1.65V~3.6V | Asynchronous | 16b | 16b | 32B | FLASH | Parallel | 60ns |
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BR24G32NUX-3ATTR ROHM Semiconductor
1.8/5V V Surface Mount Memory IC BR24G32 32 kb kb 3mm mm
Price: 2.6146
RFQ -
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BR25H080FJ-2CE2 ROHM Semiconductor
3/5V V Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series 4.9mm mm
Price: 0.5102
RFQ -
IS61DDB24M18A-300B4LI ISSI, Integrated Silicon Solution Inc
165 Pin Memory IC 15mm mm
Price: 0.0000
RFQ -
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70V7339S133BCI Integrated Device Technology (IDT)
Surface Mount 256 Pin Memory IC 9 Mb kb 17mm mm 675mA mA 18b b
Price: 0.0000
RFQ -
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S25FL132K0XBHI033 Cypress Semiconductor Corp
3/3.3V V FL1-K Memory IC FL1-K Series 32 Mb kb 8mm mm
Price: 0.0000
RFQ -
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IS43DR86400C-3DBLI ISSI, Integrated Silicon Solution Inc
Surface Mount Memory IC 512 Mb kb 10.5mm mm 250mA mA
Price: 7.9251
RFQ -
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S29GL128S10TFIV20 Cypress Semiconductor Corp
Surface Mount GL-S Memory IC GL-S Series 128 Mb kb 60mA mA 16b b
Price: 0.0000
RFQ
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